Office Action Predictor
Application No. 17/616,751

PROCESS FOR THE GENERATION OF METAL- OR SEMIMETAL-CONTAINING FILMS

Final Rejection §103
Filed
Dec 06, 2021
Examiner
MURATA, AUSTIN
Art Unit
1712
Tech Center
1700 — Chemical & Materials Engineering
Assignee
Wayne State University
OA Round
4 (Final)
60%
Grant Probability
Moderate
5-6
OA Rounds
3y 2m
To Grant
65%
With Interview

Examiner Intelligence

60%
Career Allow Rate
436 granted / 725 resolved
Without
With
+5.1%
Interview Lift
avg trend
3y 2m
Avg Prosecution
37 pending
762
Total Applications
career history

Statute-Specific Performance

§101
0.7%
-39.3% vs TC avg
§103
57.8%
+17.8% vs TC avg
§102
12.8%
-27.2% vs TC avg
§112
24.9%
-15.1% vs TC avg
Black line = Tech Center average estimate • Based on career data

Office Action

§103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant elected with traverse of formula Ia on 11/5/2024. Claims 17 and 18 are withdrawn because they are directed to the nonelected species. Claims 29 and 30 are withdrawn by original presentation. Response to Amendment The amendment filed 11/10/2025 are entered and fully considered. Response to Arguments Applicant argues the prior art does not teach the elected compound of claim 16 as a reducing agent. Applicant argues the reducing agent only changes the oxidation state of the film without becoming part of it. The examiner does not agree with applicant’s definition of a reductant and maintains that a reducing agent is defined by the electron donation. The term does not define what is deposited for a particular reaction. The aluminum precursor in PARK can be oxidizing or reducing. The examples that have a halogen bonded to the aluminum are more likely to be oxidizers than the alkyl groups. However the newly amended limitation requires the compound to be a reducing agent for the metal or semi metal. The reducing agent limitation in combination with the compound structure limits the scope of the deposition reaction and the previous rejection is removed. An additional reference LU et al. (US 2013/0115383) shows how a similar aluminum compound can be used as a reducing agent with a metal halide to deposit a pure metal film [0025]. This is the same metal/semimetal compound (halides) described in applicants specification page 24 lines 9-24. Although the cyclic structure is slightly different in the LU and PARK reference, they serve the same purpose of increasing stability while the exposed hydrogen atoms are the same and will similarly to be replaced by the halogens from the metal halide. The reaction results in the aluminum precursor acting as the reducing agent for the metal halide. Claim Rejections - 35 USC § 103 The text of those sections of Title 35, U.S. Code not included in this action can be found in a prior Office action. Claim(s) 16 and 19-28 are is/are rejected under 35 U.S.C. 103 as being unpatentable over of LU et al. (US 2013/0115383) in view of PARK et al. (US 2020/0207790) and KUHN et al. “Vinamidin-stabilisierte Alane” (1999) (from IDS). Regarding claims 16 and 23, LU teaches an aluminum precursor for depositing pure metal such as Ti or Ta abstract by ALD [0028]. The aluminum hydride (alane) is stabilized with a coordination to an amine [0019]. The aluminum precursor uses Al-H bonds which can reduce a metal halide to a pure metal film [0025]. The reference teaches an aluminum precursor with Al-H bonds and a stabilizing amine but does not expressly teach the claimed ring structure using the nitrogen and R groups. However, PARK teaches a precursor that can be used in atomic layer deposition [0048]. PARK teaches a precursor for a thin film [0007] that uses an aluminum compound shown at [0044]: PNG media_image1.png 202 226 media_image1.png Greyscale Z can be NR7. R4 is hydrogen, C1-6 alkyl or (dialkylamino)alkyl of C3-10 [0027]. R3 can be a hydrogen or C1-6 alkyl group [0027]. R5 and R6 are hydrogen or C1-6 alkyl [0027]. PARK further states that the N can have an extra pair of electrons that interact with the Al to form a hexagonal ring structure [0044]. This conjugate system provides stability to the aluminum compound [0046]. At the time of filing the invention it would have been prima facie obvious to one of ordinary skill in the art to use the conjugate system ring structure with resonance in PARK as the stabilizing structure in LU to improve the stability of the aluminum compound. An example of the stabilizing conjugate system with resonant structure for an alane is shown in KUHN which teaches a similar aluminum precursor for a similar CVD process with formula: PNG media_image2.png 92 126 media_image2.png Greyscale The precursor has the same conjugate structure for stability and uses hydrogens directly bonded to the aluminum which indicate it is a reducing agent. At the time of filing the invention it would have been prima facie obvious to one of ordinary skill in the art to use an aluminum precursor with Al-H bonds with a stabilizing ring structure of PARK because KUHN demonstrates they are known and operable for vapor deposition (CVD and ALD). The above generic formula covers Formula Ia and more specifically Ia-1, Ia-2, Ia-3. The reference does not teach the use of TMS, CF3 or DIP as R groups corresponding to species Ia-4, Ia-5, Ia-6, or Ia-7. In addition Z can be O which would correspond to formula Ib, but not formula Ic. Regarding claim 19, As described above, the R3 group can be hydrogen. R3 is at the third position of the compound. Regarding claims 20 and 21, LU teaches the metal halide can be Ti and Ta abstract and other metals/semimetals [0007]. Regarding claim 22, LU teaches performing thin film application (ALD) a plural times [0030]. Regarding claim 24, Modified LU teaches a precursor according to formula Ia as described above. The precursor has a molecular weight of less than 600 g/mol. Regarding claims 25 and 26, Modified LU teaches the precursor according to formula Ia as described above. The same precursor will have the same physical properties of vapor pressure and melting point. Regarding claim 27, LU teaches the metal deposited can be Ti and Ta abstract and other metals/semimetals [0007]. Regarding claim 28, LU teaches a pure metal layer which is less than 5% nitrogen. Conclusion Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a). A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action. Any inquiry concerning this communication or earlier communications from the examiner should be directed to AUSTIN MURATA whose telephone number is (571)270-5596. The examiner can normally be reached M-F 8:30-5. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, MICHAEL CLEVELAND can be reached at 571272-1418. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /AUSTIN MURATA/ Primary Examiner, Art Unit 1712
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Prosecution Timeline

Dec 06, 2021
Application Filed
Nov 18, 2024
Response after Non-Final Action
Nov 22, 2024
Response after Non-Final Action
Dec 11, 2024
Non-Final Rejection — §103
Mar 03, 2025
Response Filed
Apr 03, 2025
Final Rejection — §103
May 28, 2025
Response after Non-Final Action
Jun 17, 2025
Request for Continued Examination
Jun 25, 2025
Response after Non-Final Action
Aug 06, 2025
Non-Final Rejection — §103
Nov 10, 2025
Response Filed
Jan 31, 2026
Final Rejection — §103
Mar 31, 2026
Response after Non-Final Action

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Prosecution Projections

5-6
Expected OA Rounds
60%
Grant Probability
65%
With Interview (+5.1%)
3y 2m
Median Time to Grant
High
PTA Risk
Based on 725 resolved cases by this examiner