Prosecution Insights
Last updated: April 19, 2026
Application No. 17/622,748

DISPLAY PANEL INCLUDING ANODE AND BONDING PAD AND MANUFACTURING METHOD THEREOF

Non-Final OA §103§112
Filed
Dec 24, 2021
Examiner
CROSS, XIA L
Art Unit
2892
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co. Ltd.
OA Round
5 (Non-Final)
82%
Grant Probability
Favorable
5-6
OA Rounds
2y 6m
To Grant
92%
With Interview

Examiner Intelligence

Grants 82% — above average
82%
Career Allow Rate
376 granted / 458 resolved
+14.1% vs TC avg
Moderate +10% lift
Without
With
+9.7%
Interview Lift
resolved cases with interview
Typical timeline
2y 6m
Avg Prosecution
14 currently pending
Career history
472
Total Applications
across all art units

Statute-Specific Performance

§101
0.1%
-39.9% vs TC avg
§103
44.4%
+4.4% vs TC avg
§102
25.8%
-14.2% vs TC avg
§112
21.2%
-18.8% vs TC avg
Black line = Tech Center average estimate • Based on career data from 458 resolved cases

Office Action

§103 §112
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Continued Examination Under 37 CFR 1.114 A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after final rejection. Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, the finality of the previous Office action has been withdrawn pursuant to 37 CFR 1.114. Applicant's submission filed on January 22, 2026 has been entered. Status of Claims Claims 1, 3-5, 7-8, and 10-21 are pending, with claim 1 currently amended, claims 2, 6, and 9 cancelled, and claims 14-20 withdrawn. Claim Rejections - 35 USC § 112 The following is a quotation of 35 U.S.C. 112(b): (b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention. The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph: The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention. Claims 10-11 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention. Claim 10 recites the limitation "the metal wiring" in line 2. There is insufficient antecedent basis for this limitation in the claim. For the purpose of examination, “the metal wiring” is interpreted as “a metal wiring.” Claim 11 depends upon claim 10. Claim Rejections - 35 USC § 103 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. This application currently names joint inventors. In considering patentability of the claims the examiner presumes that the subject matter of the various claims was commonly owned as of the effective filing date of the claimed invention(s) absent any evidence to the contrary. Applicant is advised of the obligation under 37 CFR 1.56 to point out the inventor and effective filing dates of each claim that was not commonly owned as of the effective filing date of the later invention in order for the examiner to consider the applicability of 35 U.S.C. 102(b)(2)(C) for any potential 35 U.S.C. 102(a)(2) prior art against the later invention. Claims 1, 3-5, 7-8, 10-13, and 21 are rejected under 35 U.S.C. 103 as being unpatentable over Kamada et al. (US PG-Pub No.: 2021/0005669 A1, hereinafter, “Kamada”), prior art of record, in view of Park et al. (US PG-Pub No.: 2021/0296609 A1, hereinafter, “Park”), prior art of record, and Joo et al. (US PG-Pub No.: 2021/0318770 A1, hereinafter, “Joo”), prior art of record. Regarding claim 1, Kamada discloses a display panel (see Kamada, FIG. 16), comprising: a thin-film transistor (208, FIG. 16) comprising a source (222a, ¶ [0262]), a drain (222b, ¶ [0262]), and a gate (223, ¶ [0262]), wherein the thin-film transistor (208) serves as a driving switch for pixels of the display panel to emit light (FIG. 16); an anode (191R, ¶ [0192]) electrically connected to the thin-film transistor (208), wherein a material of the anode (191R) comprises silver-palladium-copper alloy (Table 1); a bonding pad (166, FIG. 16) electrically connected to the thin-film transistor (208, FIGs. 13 and 16; FIG. 13 shows that FPC 172 is the external circuit for the display panel sending and receiving electrical signals, and ¶ [0242] discloses that 172 is electrically connected with both 162 and 164 to supply a signal and power; therefore, although not shown in FIG. 16, 166 is electrically connected with the driving transistor 208), wherein a material of the bonding pad (166) is same as the material of the anode (191R, ¶¶ [0109] and [0272]), a passivation layer (214a, FIG. 17; FIG. 16 labelled wrongly since FIG. 16 labelled 214a and 214b as the same layer), wherein the passivation layer (214a) is disposed on the thin-film transistor (208) and covers the thin-film transistor (208), and the passivation layer (214a) comprises a first through hole (hole for part of 169R, FIG. 16) defined on the thin-film transistor (208), and a planarization layer (214b, FIG. 16), wherein the planarization layer (214b) is disposed on the passivation layer (214a), and the planarization layer (214b) comprises a second through hole (hole for 191R and part of 169R, FIG. 16) defined corresponding to a position of the first through hole (hole for 169R). Kamada is silent regarding that the anode further comprises a transparent conductive oxide disposed on two opposite surfaces of the silver-palladium-copper alloy; and a hole position of the first through hole overlaps with and corresponds to a hole position of the second through hole, and the second through hole is provided with a bottom opening on a surface of the passivation layer away from the thin-film transistor, the first through hole is provided with a top opening on the surface of the passivation layer away from the thin-film transistor, wherein a projection area of the bottom opening on a surface of the passivation layer close to the thin film transistor covers and is larger than a projection area of the top opening on the surface of the passivation layer close to the thin film transistor. Park, however, discloses a display panel (see Park, FIG. 5), wherein an anode comprises a transparent conductive oxide disposed on two opposite surfaces of the silver-palladium-copper alloy (ITO/APC/ITO, ¶ [0109]). Park also discloses that the source and the drain (S1 and D1, FIG. 5) comprising copper or copper alloy (¶ [0099]). Therefore, it would have been obvious to one of ordinary skill in the art before the effective filling date of the claimed invention to form Kamada’s anode comprising a transparent conductive oxide disposed on two opposite surfaces of the silver-palladium-copper alloy, as taught by Park, in order to improve light efficiency (¶ [0109]); and to form Kamada’s metal wiring, the source, and the drain with copper or copper alloy, as taught by Park, since copper has low resistance and it is a great material to form electrodes. Kamada in view of Park is silent regarding that a hole position of the first through hole overlaps with and corresponds to a hole position of the second through hole, and the second through hole is provided with a bottom opening on a surface of the passivation layer away from the thin-film transistor, the first through hole is provided with a top opening on the surface of the passivation layer away from the thin-film transistor, wherein a projection area of the bottom opening on a surface of the passivation layer close to the thin film transistor covers and is larger than a projection area of the top opening on the surface of the passivation layer close to the thin film transistor. Joo, however, discloses a display panel (see Joo, FIG. 8), wherein a second through hole (hole for part of 171 and part of ANDE1 in 160, FIG. 8) is provided with a bottom opening on a surface of a passivation layer (150, FIG. 8) away from a thin-film transistor (ST, FIG. 8), a first through hole (hole for part of ANDE1 in 150) is provided with a top opening on the surface of the passivation layer (150) away from the thin-film transistor (ST), wherein a projection area of the bottom opening on a surface of the passivation layer (150) close to the thin film transistor (ST) covers and is larger than a projection area of the top opening on the surface of the passivation layer (150) close to the thin film transistor (ST, FIG. 8). Therefore, it would have been obvious to one of ordinary skill in the art before the effective filling date of the claimed invention to form the second through hole of Kamada in view of Park provided with a bottom opening on a surface of the passivation layer away from the thin-film transistor, the first through hole is provided with a top opening on the surface of the passivation layer away from the thin-film transistor, wherein a projection area of the bottom opening on a surface of the passivation layer close to the thin film transistor covers and is larger than a projection area of the top opening on the surface of the passivation layer close to the thin film transistor, as taught by Joo, since it is an alternative design. Regarding claim 3, Kamada in view of Park and Joo discloses the display panel according to claim 1, wherein the transparent conductive oxide comprises indium oxide (Park, ¶ [0109]), antimony oxide, or cadmium oxide. Regarding claim 4, Kamada in view of Park and Joo discloses the display panel according to claim 1, wherein the bonding pad (166) further comprises a transparent conductive oxide disposed on two opposite surfaces of the silver-palladium-copper alloy (see statement above regarding claim 1). Regarding claim 5, Kamada in view of Park and Joo discloses the display panel according to claim 4, wherein the transparent conductive oxide comprises indium oxide (Park, ¶ [0109]), antimony oxide, or cadmium oxide. Regarding claim 7, Kamada in view of Park and Joo discloses the display panel according to claim 1, wherein the anode (181) is electrically connected to the thin-film transistor (203) through the first through hole and the second through hole (Park, FIG. 16). Regarding claim 8, Kamada in view of Park and Joo discloses the display panel according to claim 7, wherein the first through hole and the second through hole are respectively defined through two manufacturing processes (claim 8 is a device claim, even though product-by-process claims are limited by and defined by the process, determination of patentability is based on the product itself. See MPEP § 2113(I)). Regarding claim 10, Kamada in view of Park and Joo discloses the display panel according to claim 1, wherein the passivation layer (214a) further comprises a third through hole defined above a metal wiring (165; Kamada, FIG. 16), and the bonding pad (166) is electrically connected to the metal wiring (165) through the third through hole (FIG. 16). Note: for the purpose of examination, “the metal wiring” is interpreted as “a metal wiring.” Claim 11 depends upon claim 10. Regarding claim 11, Kamada in view of Park and Joo discloses the display panel according to claim 10, wherein the first through hole and the third through hole are defined through a same manufacturing process (claim 11 is a device claim, even though product-by-process claims are limited by and defined by the process, determination of patentability is based on the product itself. See MPEP § 2113(I)). Regarding claim 12, Kamada in view of Park and Joo discloses the display panel according to claim 1. Kamada is silent regarding that the thin-film transistor comprises a top-gate thin-film transistor. Park, however, discloses a display panel (see Park, FIG. 5), comprising a top gate thin-film transistor (T1, FIG. 5). Therefore, it would have been obvious to one of ordinary skill in the art before the effective filling date of the claimed invention to form Kamada’s thin-film transistor a top-gate thin-film transistor, as taught by Park, since it is an alternative design (Park, ¶ [0094]). Regarding claim 13, Kamada in view of Park and Joo discloses the display panel according to claim 1, wherein the display panel is an organic light-emitting diode display panel (Kamada, ¶ [0065]), and the anode (181) is an anode of an organic light-emitting diode (FIG. 16). Regarding claim 21, Kamada in view of Park and Joo discloses the display panel according to claim 1, wherein the display panel further comprises a metal wiring (165; Kamada, ¶ [0240]), the metal wiring (165), and the source (222a) and the drain (222b) of the thin-film transistor (208) are disposed in a same layer (FIG. 16), and the bonding pad (166) is electrically connected to the thin-film transistor (208, since 172 is electrically connected with both 162 and 164 to supply a signal and power) serving as a driving switch for pixels of the display panel (FIG. 16) to emit light through the metal wiring (165). Kamala is silent regarding that the metal wiring adopting copper or copper alloy. Park, however, discloses that source and drain (S1 and D1, FIG. 5) comprising copper or copper alloy (¶ [0099]). Therefore, it would have been obvious to one of ordinary skill in the art before the effective filling date of the claimed invention to form Kamada’s metal wiring, the source, and the drain with copper or copper alloy, as taught by Park, since copper has low resistance and it is a great material to form electrodes. Response to Arguments Applicant's arguments filed on Jan 22, 2026 have been fully considered but they are not persuasive. Applicant alleged that Joo fails to disclose a projection area of the bottom opening on a surface of the passivation layer close to the thin film transistor covers and is larger than a projection area of the top opening on the surface of the passivation layer close to the thin film transistor (Remarks, pages 7-10). Examiner respectfully disagrees. Joo’s first through hole is a hole in 150 filled by part of ANDE1 and Joo’s second through hole is a hole in 160 filled by part of 171 and part of ANDE1. The first and second though holes are holes going through 150 and 160 separately, which meet the claim limitations as stated in rejection for claim 1 above. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to XIA L. CROSS whose telephone number is (571)270-3273. The examiner can normally be reached 9 am-5:30 pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, N. Drew Richards can be reached at 571-272-1736. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /XIA L CROSS/Primary Examiner, Art Unit 2892
Read full office action

Prosecution Timeline

Dec 24, 2021
Application Filed
Jul 27, 2024
Non-Final Rejection — §103, §112
Oct 27, 2024
Response Filed
Jan 25, 2025
Final Rejection — §103, §112
Apr 27, 2025
Request for Continued Examination
Apr 28, 2025
Response after Non-Final Action
May 03, 2025
Non-Final Rejection — §103, §112
Jul 28, 2025
Response Filed
Nov 01, 2025
Final Rejection — §103, §112
Jan 22, 2026
Request for Continued Examination
Feb 03, 2026
Response after Non-Final Action
Feb 07, 2026
Non-Final Rejection — §103, §112 (current)

Precedent Cases

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

5-6
Expected OA Rounds
82%
Grant Probability
92%
With Interview (+9.7%)
2y 6m
Median Time to Grant
High
PTA Risk
Based on 458 resolved cases by this examiner. Grant probability derived from career allow rate.

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