DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Continued Examination Under 37 CFR 1.114
A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after allowance or after an Office action under Ex Parte Quayle, 25 USPQ 74, 453 O.G. 213 (Comm'r Pat. 1935). Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, prosecution in this application has been reopened pursuant to 37 CFR 1.114. Applicant's submission filed on June 18, 2926 has been entered.
Claim Rejections - 35 USC § 103
The text of those sections of Title 35, U.S. Code not included in this action can be found in a prior Office action.
Claims 24-25 and 26-28 are rejected under 35 U.S.C. 103 as being unpatentable over U.S. Patent 8,128,000 to Forster in view of U.S. Patent 3,317,175 to Salerno et al.
Forster discloses method of constructing a coil antenna structure, the method comprising: bonding a conductive layer (106) on a flexible substrate (104); bonding the conductive layer (106) to a substrate (102); forming a coiled antenna (400, see fig. 4) by cutting (see Col. 3, lines 48-54) a spiraling gap into a conductive layer (106); wherein the coiled antenna (400) is in a wound position and the coiled antenna comprises a conductive trace (402) having an outer termination (not label) and an inner termination (404); and applying a force to the outer termination of the coiled antenna to expand the gap between the conductive trace to a distance great enough to prevent conductive sections of the conductive trace from touching each other and to form the coiled antenna in an unwounded position (see Col. Lines 63-65), except for a applying a linear force, a torque, or heating and cooling or distortion.
Salerno et al teach the process of expanding a distance between conductive elements (transistors) which form on a flexible material (204) bonded to the substrate (202) by applying a linear force, a torque, or heating and cooling (see Figs. 11E or 12A-C) for precisely controlling the spacing between elements (see Col. 15, lines 20-23). Therefore, it would have been obvious to one having ordinary skill in the art before the effective filing date of the claimed invention to modify the invention Forster by utilizing the process of expanding the gap between conductive elements as taught by Salerno et al for controlling the gap between elements.
Allowable Subject Matter
Claims 1, 6-18 and 21-23 are allowed.
Claim 26 is objected to as being dependent upon a rejected base claim 24, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
Conclusion
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/DN/ /DONGHAI D NGUYEN/September 24, 2026 Primary Examiner, Art Unit 3729
