Prosecution Insights
Last updated: May 29, 2026
Application No. 17/838,670

THERMAL STORAGE FOR HIGH LOAD SHORT DURATION COOLING

Non-Final OA §103§112
Filed
Jun 13, 2022
Examiner
ATKISSON, JIANYING CUI
Art Unit
3763
Tech Center
3700 — Mechanical Engineering & Manufacturing
Assignee
Hamilton Sundstrand Corporation
OA Round
4 (Non-Final)
42%
Grant Probability
Moderate
4-5
OA Rounds
0m
Est. Remaining
88%
With Interview

Examiner Intelligence

Grants 42% of resolved cases
42%
Career Allowance Rate
203 granted / 484 resolved
-28.1% vs TC avg
Strong +46% interview lift
Without
With
+45.9%
Interview Lift
resolved cases with interview
Typical timeline
3y 9m
Avg Prosecution
1 currently pending
Career history
484
Total Applications
across all art units

Statute-Specific Performance

§103
87.0%
+47.0% vs TC avg
§102
6.9%
-33.1% vs TC avg
§112
5.1%
-34.9% vs TC avg
Black line = Tech Center average estimate • Based on career data from 484 resolved cases

Office Action

§103 §112
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Response to Arguments Applicant’s arguments, filed with respect to the specification objections have been fully considered and are persuasive in view of the amendment. Accordingly, the previously set forth specification objections have been withdrawn. Applicant’s arguments filed with respect to the rejections under 35 U.S.C. 112(b) have been fully considered and are persuasive in view of the amendments. Accordingly, the previously set forth rejections under 35 U.S.C. 112(b) have been withdrawn. Please see below for new grounds of rejection under 35 U.S.C. 112(b) necessitated by amendment. Applicant's arguments, filed with respect to the prior art rejections have been fully considered but they are moot. Applicant’s arguments are directed at the current amendment. Applicant has amended the claims to present a new combination(s) of limitations for examination, necessitating the new grounds of rejection presented below. Claim Interpretation The following is a quotation of 35 U.S.C. 112(f): (f) Element in Claim for a Combination. – An element in a claim for a combination may be expressed as a means or step for performing a specified function without the recital of structure, material, or acts in support thereof, and such claim shall be construed to cover the corresponding structure, material, or acts described in the specification and equivalents thereof. The following is a quotation of pre-AIA 35 U.S.C. 112, sixth paragraph: An element in a claim for a combination may be expressed as a means or step for performing a specified function without the recital of structure, material, or acts in support thereof, and such claim shall be construed to cover the corresponding structure, material, or acts described in the specification and equivalents thereof. The claims in this application are given their broadest reasonable interpretation using the plain meaning of the claim language in light of the specification as it would be understood by one of ordinary skill in the art. The broadest reasonable interpretation of a claim element (also commonly referred to as a claim limitation) is limited by the description in the specification when 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, is invoked. As explained in MPEP § 2181, subsection I, claim limitations that meet the following three-prong test will be interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph: (A) the claim limitation uses the term “means” or “step” or a term used as a substitute for “means” that is a generic placeholder (also called a nonce term or a non-structural term having no specific structural meaning) for performing the claimed function; (B) the term “means” or “step” or the generic placeholder is modified by functional language, typically, but not always linked by the transition word “for” (e.g., “means for”) or another linking word or phrase, such as “configured to” or “so that”; and (C) the term “means” or “step” or the generic placeholder is not modified by sufficient structure, material, or acts for performing the claimed function. Use of the word “means” (or “step”) in a claim with functional language creates a rebuttable presumption that the claim limitation is to be treated in accordance with 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph. The presumption that the claim limitation is interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, is rebutted when the claim limitation recites sufficient structure, material, or acts to entirely perform the recited function. Absence of the word “means” (or “step”) in a claim creates a rebuttable presumption that the claim limitation is not to be treated in accordance with 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph. The presumption that the claim limitation is not interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, is rebutted when the claim limitation recites function without reciting sufficient structure, material or acts to entirely perform the recited function. Claim limitations in this application that use the word “means” (or “step”) are being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, except as otherwise indicated in an Office action. Conversely, claim limitations in this application that do not use the word “means” (or “step”) are not being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, except as otherwise indicated in an Office action. This application includes one or more claim limitations that do not use the word “means,” but are nonetheless being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, because the claim limitation(s) uses a generic placeholder that is coupled with functional language without reciting sufficient structure to perform the recited function and the generic placeholder is not preceded by a structural modifier. Such claim limitation(s) is/are: first thermal storage device in claims 1, 4, 7-12, 13, 15, 17, 19-20 and second thermal storage device in claims 1, 4, 7-12, 13, 15, 17, 19-20. Because this/these claim limitation(s) is/are being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, it/they is/are being interpreted to cover the corresponding structure described in the specification as performing the claimed function, and equivalents thereof. In the case of the first thermal storage device, the corresponding structure can be found in par 0032: “such as a liquid reservoir for example”. In the case of the second thermal storage device the corresponding structure can be found in par 0032: “such as a vapor reservoir for example”. If applicant does not intend to have this/these limitation(s) interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, applicant may: (1) amend the claim limitation(s) to avoid it/them being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph (e.g., by reciting sufficient structure to perform the claimed function); or (2) present a sufficient showing that the claim limitation(s) recite(s) sufficient structure to perform the claimed function so as to avoid it/them being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph. Claim Rejections - 35 USC § 112 The following is a quotation of the first paragraph of 35 U.S.C. 112(a): (a) IN GENERAL.—The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor or joint inventor of carrying out the invention. The following is a quotation of the first paragraph of pre-AIA 35 U.S.C. 112: The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor of carrying out his invention. Claims 1, 4, 7-12, 13, 15, 17, 19-20 are rejected under 35 U.S.C. 112(a) or 35 U.S.C. 112 (pre-AIA ), first paragraph, as failing to comply with the written description requirement. The claim(s) contains subject matter which was not described in the specification in such a way as to reasonably convey to one skilled in the relevant art that the inventor or a joint inventor, or for applications subject to pre-AIA 35 U.S.C. 112, the inventor(s), at the time the application was filed, had possession of the claimed invention. Regarding claims 1 and 13, the limitation wherein “no conditioning of the thermal management fluid occurs between the condenser and the second thermal storage device” is not sufficiently supported by the disclosure since the scope of what is meant by “no conditioning” is unable to be determined as there is no mention of not having conditioning occur between the condenser and second thermal storage device. As such the limitation will be interpreted broadly. Claims 1 and 13 are therefore considered to add new matter. Claims 4, 7-12, 15, 17, 19-20 are rejected as being dependent upon a rejected claim. The following is a quotation of 35 U.S.C. 112(b): (b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention. The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph: The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention. Claims 1, 4, 7-12, 13, 15, 17, 19-20 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention. Claim 1 recites the limitation "the second thermal storage device" in line 10 of the claim. There is insufficient antecedent basis for this limitation in the claim. It appears that “the second thermal storage device” may be in error for –the first thermal storage device--. In view of the 112(a) issues the limitation will be interpreted broadly and ‘wherein no conditioning of the thermal management fluid occurs between the condenser and the second thermal storage device’ OR ‘wherein no conditioning of the thermal management fluid occurs between the condenser and the first thermal storage device’ in the prior art will be considered to meet the limitation. Claim 13 recites the limitation "such that no conditioning of the thermal management fluid occurs between the condenser and the second thermal storage device being arranged directly upstream from the compressor relative to a flow of the thermal management fluid” is indefinite since it appears that the limitation is missing another instance of “second thermal storage device, such that the limitation should read --such that no conditioning of the thermal management fluid occurs between the condenser and the second thermal storage device and the second thermal storage device being arranged directly upstream from the compressor relative to a flow of the thermal management fluid--, in addition as stated in the rejection of claim 1 above, “the second thermal storage device” may be in error for –the first thermal storage device—in regards to -- such that no conditioning of the thermal management fluid occurs between the condenser and the second thermal storage device--. In view of the 112(a) issues the limitation will be interpreted broadly and ‘wherein no conditioning of the thermal management fluid occurs between the condenser and the second thermal storage device’ OR ‘wherein no conditioning of the thermal management fluid occurs between the condenser and the first thermal storage device’ in the prior art will be considered to meet the limitation. Claims 4, 7-12, 15, 17, 19-20 are rejected as being dependent upon a rejected claim. Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claim(s) 1, 4, 7-12 is/are rejected under 35 U.S.C. 103 as being unpatentable over Chen (CN-107152890-A: previously cited) in view of Ito (US-20200116396-A1: previously cited). Regarding claim 1, Chen discloses a thermal management system for a directed energy weapon (Fig 1-3, abstract, par 0002) comprising: a closed loop vapor compression system through which a thermal management fluid circulates (cooling system), the vapor compression system including a compressor (compressor #7), an expansion valve (throttling device #11), an evaporator (evaporator #5), the directed energy weapon being arranged in thermal communication with the evaporator (Fig 1 high-energy weapon #3 in communication with #5 in the bay #1 area); wherein the expansion valve is adjustable to control a flow of the thermal management fluid provided to the evaporator in response to a mode of operation of the directed energy weapon (par 0028-0029, Fig 2 throttling device #11), the expansion valve being in an at least partially closed position when the directed energy weapon is in a charging mode (par 0029: #11 is closed in position when the load of the weapon #3 is small, i.e. a charging (not firing) mode. Note: a small thermal load corresponds to a state where the weapon is not in operation, as evidenced in par 0017: “…the impact of instantaneous thermal load when high-energy weapons are working”)) and the expansion valve being in a fully open position when the directed energy weapon is in a firing mode (par 0028: #11 is in open position when the weapon has large thermal load, i.e. in firing mode. Note: a large thermal load corresponds to a state where the weapon is in operation, see par 0017: “the impact of instantaneous thermal load when high-energy weapons are working”), wherein when the expansion valve is in the fully open position, the thermal management fluid provided to the evaporator is a liquid (in a vapor compression system the evaporator receives at minimum a liquid/vapor mixture, therefore at least a portion of water provided to #5 is a liquid). Chen does not disclose the closed loop vapor compression system including a first thermal storage device arranged downstream from the condenser and upstream from the expansion valve relative to the flow of thermal management fluid, wherein no conditioning of the thermal management fluid occurs between the condenser and the second thermal storage device; a second thermal storage device arranged directly upstream from the compressor relative to a flow of thermal management fluid and wherein when the expansion valve is in the fully open position, vapor thermal management fluid is configured to accumulate within the at least one of the first thermal storage device and the second thermal storage device. However, as evidenced by Ito, it is old and well-known for a closed loop vapor compression system to include a first thermal storage device arranged downstream from the condenser and upstream from the expansion valve relative to the flow of thermal management fluid (Ito Fig 5 see arrows directing flow, tank #24 is downstream from heat exchanger #14 and upstream of throttle device #25), wherein no conditioning of the thermal management fluid occurs between the condenser and the second thermal storage device (Ito Fig 5 there is no conditioning associated with expansion valves between accumulator #17 and heat exchanger #14), and a second thermal storage device (Ito Fig 1 and 5, accumulator #17) arranged directly upstream from the compressor relative to a flow of thermal management fluid (Ito Fig 5 see accumulator #17 upstream of compressor #12, see arrows depicting refrigerant flow) and wherein when the expansion valve is in the fully open position (Ito see Fig 5 first throttle device #25 and par 0058), vapor thermal management fluid is configured to accumulate within the at least one of the first thermal storage device and the second thermal storage device (Ito par 0031: accumulator 17 is configured to store the refrigerant). It would, therefore, have been obvious to one of ordinary skill in the art before the effective filing date of the invention to provide the system of Chen with a first thermal storage device arranged downstream from the condenser and upstream from the expansion valve relative to the flow of thermal management fluid, wherein no conditioning of the thermal management fluid occurs between the condenser and the second thermal storage device; a second thermal storage device arranged directly upstream from the compressor relative to a flow of thermal management fluid and wherein when the expansion valve is in the fully open position, vapor thermal management fluid is configured to accumulate within the at least one of the first thermal storage device and the second thermal storage device, since, as evidenced by Ito, such provision is old and well-known, and would provide the predictable benefit(s) of preventing liquid from entering the compressor and/or storing refrigerant that is not required to be in circulation for a current system demand. Regarding claim 4, Chen further discloses wherein the thermal management fluid has a first flow rate when the expansion valve is in the at least partially closed position (Chen par 0029: since #11 is closed, the flow rate in branch #9 will be zero) and the thermal management fluid has a second flow rate when the expansion valve is in the fully open position, the second flow rate being greater than the first flow rate (Chen par 0028: since #11 is open, the flow rate in branch #9 will be greater than zero). Regarding claim 7, Chen discloses wherein the evaporator further comprises an inlet and an outlet (Chen Fig 1 see arrow directing flow to an inlet of #5 and through an outlet of #5). Chen does not disclose wherein the first thermal storage device is upstream from and is fluidly connected to and configured to provide thermal management fluid to the inlet of the evaporator. However, as evidenced by Ito, it is old and well-known to wherein the first thermal storage device is upstream from and is fluidly connected to and configured to provide thermal management fluid to the inlet of the evaporator (Ito Fig 5 see arrows directing flow, tank #24 is upstream and provides fluid to an inlet of #16). It would, therefore, have been obvious to one of ordinary skill in the art before the effective filing date of the invention to provide the system of Chen with wherein the first thermal storage device is upstream from and is fluidly connected to and configured to provide thermal management fluid to the inlet of the evaporator, since, as evidenced by Ito, such provision is old and well-known, and would provide the predictable benefit(s) of storing refrigerant that is not required to be in circulation for a current system demand. Regarding claim 8, Modified Chen further discloses wherein the thermal management fluid received within the first thermal storage device is a liquid (Ito Fig 5 #14 condenses the refrigerant and this liquid is collected in #24). Regarding claim 9, Chen does not disclose a pump in fluid communication with the first thermal storage device, the pump being operable to move thermal management fluid from the first thermal storage device to the evaporator. Ito further teaches a pump in fluid communication with the first thermal storage device (Ito Fig 7 pump #26 in communication with #24), the pump being operable to move thermal management fluid from the first thermal storage device to the evaporator (Ito Fig 7 see arrows directing fluid flow). It would have been obvious to one of ordinary skill in the art before the effective filing date of the invention to provide the system of Chen with a pump in fluid communication with the first thermal storage device, the pump being operable to move thermal management fluid from the first thermal storage device to the evaporator, as taught by Ito, as doing so would improve the system of Chen by performing a refrigerant circulation operation using a liquid pump while utilizing coldness of an external refrigerant, thus improving energy efficiency (Ito par 0040). Regarding claim 10, Chen further discloses wherein the thermal management fluid is refrigerant (Chen par 0027: evidenced by “refrigerant pipeline”). Regarding claim 11, Chen is silent regarding wherein the thermal management fluid is carbon dioxide. Ito further teaches wherein the thermal management fluid is carbon dioxide (Ito par 00024). It would have been obvious to one of ordinary skill in the art before the effective filing date of the invention to provide the system of Chen with wherein the thermal management fluid is carbon dioxide, as taught by Ito, as doing so would improve the system of Chen by utilizing a refrigerant with a low global warming potential. Regarding claim 12, Chen further discloses wherein the vapor compression cycle is sized based on an average cooling required for the directed energy weapon (Chen par 0007: Chen provides a modular sized system based on average cooling (between small load and high load of the weapon) by adjusting the operation of the compressor). Claim(s) 13, 15, 17, 19, 20 is/are rejected under 35 U.S.C. 103 as being unpatentable over Chen (CN-107152890-A: previously cited) and further in view of Ito (US-20200116396-A1: previously cited). Regarding claim 13, Chen discloses a method of operating a thermal management system for a directed energy weapon (Fig 1-3, abstract, par 0002), the method comprising: circulating a thermal management fluid through a closed loop vapor compression system including an expansion valve and an evaporator (Fig 2 see arrows depicting circulation of refrigerant fluid through throttling device #11 and evaporator #5), the evaporator being in thermal communication with the directed energy weapon (Fig 1 high-energy weapon #3 in communication with #5 in the bay #1 area); adjusting a position of the expansion valve between an at least partially closed position and a fully open position to control a flow of the thermal management fluid provided to the evaporator in response to a mode of operation of the directed energy weapon (par 0028-0029), the expansion valve being in the at least partially closed position when the directed energy weapon is in a charging mode (par 0029: #11 is closed in position when the load of the weapon #3 is small, i.e. a charging (not firing) mode. Note: a small thermal load corresponds to a state where the weapon is not in operation, as evidenced in par 0017: “…the impact of instantaneous thermal load when high-energy weapons are working”)) and the expansion valve being in the fully open position when the directed energy weapon is in a firing mode (par 0028: #11 is in open position when the weapon has large thermal load, i.e. in firing mode. Note: a large thermal load corresponds to a state where the weapon is in operation, see par 0017: “the impact of instantaneous thermal load when high-energy weapons are working”), wherein when the expansion valve is in the fully open position, the thermal management fluid provided to the evaporator is a liquid (in a vapor compression system the evaporator receives at minimum a liquid/vapor mixture, therefore at least a portion of water provided to #5 is a liquid). Chen does not disclose accumulating thermal management fluid within at least one thermal storage device when the directed energy weapon is in the firing mode, wherein the at least one thermal storage device includes a first thermal storage device and a second thermal storage device, the first thermal storage device being arranged downstream from the condenser and upstream from the expansion valve relative to the flow of thermal management fluid such that no conditioning of the thermal management fluid occurs between the condenser and the second thermal storage device being arranged directly upstream from the compressor relative to a flow of the thermal management fluid. However, as evidenced by Ito, it is old and well-known to employ a method of accumulating thermal management fluid within at least one thermal storage device (Ito Fig 5 see arrows directing flow to accumulator #17), wherein the at least one thermal storage device includes a first thermal storage device (Ito Fig 5 tank #24) and a second thermal storage device (Ito Fig 5 Ito accumulator #17), the first thermal storage device being arranged downstream from the condenser and upstream from the expansion valve relative to the flow of thermal management fluid (Ito Fig 5 see arrows directing flow, tank #24 is downstream from heat exchanger #14 and upstream of throttle device #25) such that no conditioning of the thermal management fluid occurs between the condenser and the second thermal storage device (Ito Fig 5 there is no conditioning associated with expansion valves between accumulator #17 and heat exchanger #14; see 112(b) section above: an instance of “second thermal storage device” has been added here for clarity) and the second thermal storage device being arranged directly upstream from the compressor relative to a flow of the thermal management fluid (Ito Fig 5 see accumulator #17 upstream of compressor #12, see arrows depicting refrigerant flow). It would, therefore, have been obvious to one of ordinary skill in the art before the effective filing date of the invention to provide the system of Chen with the method of accumulating thermal management fluid within a thermal storage device when the directed energy weapon is in the firing mode, wherein the thermal management fluid is a vapor accumulated within the thermal storage device and the thermal storage device is arranged directly upstream from the compressor relative to a flow of the thermal management fluid, since, as evidenced by Ito, such provision is old and well-known, and would provide the predictable benefit(s) of preventing liquid from entering the compressor. Examiner notes that the combination of Ito and Chen will meet the limitations regarding when the directed energy weapon is in the firing mode since Chen teaches that in the firing mode (i.e. load of weapon is large), the refrigeration system is in operation (Chen par 0028). Regarding claim 15, Chen does not disclose accumulating thermal management fluid within the first thermal storage device when the directed energy weapon is in the charging mode, wherein the thermal management fluid accumulated within the first thermal storage device is a liquid. However, as evidenced by Ito, it is old and well-known to employ a method of accumulating thermal management fluid within a first thermal storage device (Ito Fig 5 tank #24, par 0064), wherein the thermal management fluid accumulated within the first thermal storage device is a liquid (Ito #14 condenses the refrigerant and this liquid is collected in #24). It would, therefore, have been obvious to one of ordinary skill in the art before the effective filing date of the invention to provide the method of Chen with accumulating thermal management fluid within the first thermal storage device when the directed energy weapon is in the charging mode, wherein the thermal management fluid accumulated within the first thermal storage device is a liquid, since, as evidenced by Ito, such provision is old and well-known, and would provide the predictable benefit(s) of storing refrigerant that is not required to be in circulation for a current system demand. Examiner notes that the combination of Ito and Chen will meet the limitations regarding when the directed energy weapon is in the charging mode since Chen teaches that even in the charging mode (i.e. load of weapon is small), the refrigeration system is still in operation (Chen par 0029) and therefore, with the teaching of Ito, the operation of the tank #24 will continue to operate and accumulate fluid. Regarding claim 17, Chen does not disclose pumping the thermal management fluid from the first thermal storage device to the evaporator when the directed energy weapon is in the firing mode. Ito teaches pumping the thermal management fluid from the first thermal storage device to the evaporator (Ito Fig 7 see arrows directing fluid flow via pump #26). It would have been obvious to one of ordinary skill in the art before the effective filing date of the invention to provide the method of Chen with pumping the thermal management fluid from the first thermal storage device to the evaporator when the directed energy weapon is in the firing mode, as taught by Ito, as doing so would improve the method of Chen by performing a refrigerant circulation operation using a liquid pump while utilizing coldness of an external refrigerant, thus improving energy efficiency (Ito par 0040). Examiner notes that the combination of Ito and Chen will meet the limitations regarding when the directed energy weapon is in the firing mode since Chen teaches that in the firing mode (i.e. load of weapon is large), the refrigeration system is in operation (Chen par 0028). Regarding claim 19, Chen further discloses wherein the thermal management fluid is refrigerant (Chen par 0027: evidenced by “refrigerant pipeline”). Regarding claim 20, Chen is silent regarding wherein the thermal management fluid is carbon dioxide. Ito teaches wherein the thermal management fluid is carbon dioxide (Ito par 00024). It would have been obvious to one of ordinary skill in the art before the effective filing date of the invention to provide the system of Chen with wherein the thermal management fluid is carbon dioxide, as taught by Ito, as doing so would improve the system of Chen by utilizing a refrigerant with a low global warming potential. Conclusion Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a). A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action. Any inquiry concerning this communication or earlier communications from the examiner should be directed to ESMERALDA ARREGUIN-MARTINEZ whose telephone number is (571)270-0174. The examiner can normally be reached M-F 8am - 5pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Jianying Atkisson can be reached on (571) 270-7740. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /ESMERALDA ARREGUIN-MARTINEZ/Examiner, Art Unit 3763 /TAVIA SULLENS/Primary Examiner, Art Unit 3763
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Prosecution Timeline

Show 4 earlier events
Oct 16, 2024
Response after Non-Final Action
Nov 18, 2024
Request for Continued Examination
Nov 20, 2024
Response after Non-Final Action
Dec 13, 2024
Non-Final Rejection mailed — §103, §112
Mar 13, 2025
Response Filed
May 06, 2025
Final Rejection mailed — §103, §112
Jul 07, 2025
Response after Non-Final Action
Apr 21, 2026
Response after Non-Final Action

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Prosecution Projections

4-5
Expected OA Rounds
42%
Grant Probability
88%
With Interview (+45.9%)
3y 9m (~0m remaining)
Median Time to Grant
High
PTA Risk
Based on 484 resolved cases by this examiner. Grant probability derived from career allowance rate.

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