Prosecution Insights
Last updated: April 19, 2026
Application No. 17/903,278

ACOUSTIC NOISE SUPPRESSING HEAT EXCHANGERS

Final Rejection §102§103
Filed
Sep 06, 2022
Examiner
DRAVININKAS, ADAM B
Art Unit
2835
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Intel Corporation
OA Round
2 (Final)
75%
Grant Probability
Favorable
3-4
OA Rounds
2y 5m
To Grant
89%
With Interview

Examiner Intelligence

Grants 75% — above average
75%
Career Allow Rate
696 granted / 932 resolved
+6.7% vs TC avg
Moderate +14% lift
Without
With
+14.1%
Interview Lift
resolved cases with interview
Typical timeline
2y 5m
Avg Prosecution
24 currently pending
Career history
956
Total Applications
across all art units

Statute-Specific Performance

§101
0.1%
-39.9% vs TC avg
§103
47.4%
+7.4% vs TC avg
§102
33.0%
-7.0% vs TC avg
§112
15.9%
-24.1% vs TC avg
Black line = Tech Center average estimate • Based on career data from 932 resolved cases

Office Action

§102 §103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1, 2, 10, 11, and 17-20 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Chang (US 2005/0252640 A1). Re. claim 1: Chang discloses a heat exchanger for an apparatus, comprising: a bottom plate (12); a top plate (11); and (see fig. 2, 4; para. 0024-0025) a plurality of heat dissipating fins (43) extending between the top and bottom plates that form a plurality of air channels (44); (see fig. 2, 4, 5; para. 0026-0030) wherein at least one of the top plate and bottom plate comprises a heat conducting material, the plurality of heat dissipating fins receive heat from the top or bottom plates, and (see para. 0024-0025) individuals of at least a subset of the plurality of fins include a baffle (46, 47) that protrudes into an individual of the plurality of air channels. (see fig. 5-9; para. 0031-0035) Re. claim 2: Chang discloses wherein all of the fins (43) of the plurality of heat dissipating fins include at least one baffle (46, 47). (see fig. 5-9; para. 0031-0035) Re. claim 10: Chang discloses a method, comprising: creating, from a heat dissipating material, a plurality of heat dissipating fins (43); (see fig. 2, 4, 5; para. 0026-0030) forming a (46, 47) baffle into individuals of a subset of the plurality of fins; and forming a plurality of air channels (44) by disposing the plurality of fins between a top plate (11) and a bottom plate (12), at least one of the top plate and bottom plate comprised of a heat conducting material, (see fig. 2, 4; para. 0024-0025) wherein individuals of the baffles protrude into corresponding individuals of the plurality of air channels. (see fig. 5-9; para. 0031-0035) Re. claim 11: Chang discloses wherein the subset of the plurality of fins (43) comprises all of the plurality of fins. (see fig. 5-9; para. 0031-0035) Re. claim 17: Chang discloses a computer device, comprising: a processor (3); (see fig. 3; para. 0025) a heat exchanger (1) adapted to dissipate heat from the processor; and (see fig. 2, 3; para. 0024-0026) a fan (2) disposed to pass air through the heat exchanger; (see fig. 2, 3; para. 0024-0026) wherein the heat exchanger comprises: a top plate (11) and a bottom plate (12), at least one of the top plate or bottom plate being heat conducting, and (see fig. 2; para. 0024) a plurality of heat dissipating fins (43) extending between the top and bottom plates to form a plurality of air channels (44), the plurality of heat dissipating fins disposed to receive heat from the top or bottom plates, and (see fig. 2, 4, 5; para. 0026-0030) individuals of at least a subset of the plurality of fins include a baffle (46, 47) that protrudes into an individual of the plurality of air channels. (see fig. 5-9; para. 0031-0035) Re. claim 18: Chang discloses a heat pipe (5) in contact (thermal contact) with the processor and the heat exchanger, and adapted to conduct heat generated by the processor to the heat exchanger. (see fig. 2-4; para. 0028) Re. claim 19: Chang discloses wherein the computer device is a laptop computer. (see para. 0004-0007) Re. claim 20: Chang discloses wherein the computer device is a mobile device. (see para. 0004-0007) Claim Rejections - 35 USC § 103 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. This application currently names joint inventors. In considering patentability of the claims the examiner presumes that the subject matter of the various claims was commonly owned as of the effective filing date of the claimed invention(s) absent any evidence to the contrary. Applicant is advised of the obligation under 37 CFR 1.56 to point out the inventor and effective filing dates of each claim that was not commonly owned as of the effective filing date of the later invention in order for the examiner to consider the applicability of 35 U.S.C. 102(b)(2)(C) for any potential 35 U.S.C. 102(a)(2) prior art against the later invention. Claim(s) 3-8 and 12-16 is/are rejected under 35 U.S.C. 103 as being unpatentable over Chang as applied to claims 1 and 10 above, and further in view of Lev et al. (US 2009/0027850 A1) Re. claims 3-4 and 12-13: Chang fails to disclose: wherein a subset of the plurality of fins do not have a baffle. wherein the subset of the plurality of fins that do not have a baffle are interleaved with the subset of the plurality of fins that include a baffle. However, Lev discloses: at least a subset (104) of a plurality of fins (100) include a baffle (sawtooth shape) that protrudes into an individual of the plurality of air channels wherein a subset of the plurality of fins (106) do not have a baffle; and wherein the subset of the plurality of fins that do not have a baffle are interleaved with the subset of the plurality of fins that include a baffle. (see fig. 4A; para. 0012) Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to shape the fins of Chang in the way that the fins of Lev are shaped. One of ordinary skill would have been motivated to do this in order to increase the rate of heat transfer and increase the convection away from the processor. (Lev para. 0012) Re. claim 5: Lev discloses wherein the baffles (104) increase the surface area of the subset of the plurality of fins (surface area of baffled fins 104 are greater than straight fins 106). (see fig. 4; para. 0009, 0011, 0014) Re. claims 6 and 14: Lev discloses wherein individuals of the baffles comprise a rounded rectangular depression (108) that protrudes from a plane defined by the baffle’s fin. (see fig. 4B; para. 0012) Re. claims 7 and 15: Lev discloses wherein individuals of the baffles comprise the baffle’s fin formed into a sinusoidal pattern (102). (see fig. 2, 3; para. 0010-0012) Re. claims 8 and 16: Lev discloses wherein individuals of the baffles comprise the baffle’s fin formed into a plurality of alternating angles (104). (see fig. 4A; para. 0012) Claim(s) 9 is/are rejected under 35 U.S.C. 103 as being unpatentable over Chang as applied to claim 1 above, and further in view of Kojima et al. (US 5,625,229). Re. claim 9: Chang fails to specifically disclose: wherein the heat exchanger is formed from copper or aluminum. However, Kojima discloses: wherein the heat exchanger (90, 100) is formed from copper or aluminum. (see fig. 10, 12; col. 6 ln. 17-40) Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to make the heat exchanger of Chang out of copper or aluminum as taught by Kojima. One of ordinary skill would have been motivated to do this in order to create lightweight fins with a high thermal transfer rate. (Kojima col. 6 ln. 25-36) Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Wu (US 2003/0164233 A1) discloses a heat exchanger with baffled fins for dissipating heat. Mira (US 5,709,263) discloses a sinusoidal shaped fin for a heat sink in an electronic device. Any inquiry concerning this communication or earlier communications from the examiner should be directed to ADAM B DRAVININKAS whose telephone number is (571)270-1353. The examiner can normally be reached Monday - Friday 9a-6p MT. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, JAYPRAKASH (JP) N GANDHI can be reached at 571-272-3740. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. September 20, 2025 /ADAM B DRAVININKAS/Primary Examiner, Art Unit 2835
Read full office action

Prosecution Timeline

Sep 06, 2022
Application Filed
Apr 10, 2023
Response after Non-Final Action
Sep 20, 2025
Non-Final Rejection — §102, §103
Oct 09, 2025
Response Filed
Oct 24, 2025
Final Rejection — §102, §103 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12566481
PORTABLE MAINTENANCE CDU AND MAINTENANCE PORTS FOR SUPPLYING LIQUID COOLANT DURING PRIMARY CDU DOWNTIME
2y 5m to grant Granted Mar 03, 2026
Patent 12568601
COOLING APPARATUS FOR ELECTRONIC DEVICE
2y 5m to grant Granted Mar 03, 2026
Patent 12557249
HEAT RADIATION STRUCTURE, ELECTRONIC DEVICE, AND HEAT TRANSFER STRUCTURE
2y 5m to grant Granted Feb 17, 2026
Patent 12538462
COOLER FOR POWER ELECTRONICS
2y 5m to grant Granted Jan 27, 2026
Patent 12529855
HEAT SINK FOR OPTICAL MODULE
2y 5m to grant Granted Jan 20, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

AI Strategy Recommendation

Get an AI-powered prosecution strategy using examiner precedents, rejection analysis, and claim mapping.
Powered by AI — typically takes 5-10 seconds

Prosecution Projections

3-4
Expected OA Rounds
75%
Grant Probability
89%
With Interview (+14.1%)
2y 5m
Median Time to Grant
Moderate
PTA Risk
Based on 932 resolved cases by this examiner. Grant probability derived from career allow rate.

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month