DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
This Office Action (second non-final rejection) is in response to Amendment filed on June 10, 2026.
Claim Rejections - 35 USC § 112
The following is a quotation of the first paragraph of 35 U.S.C. 112(a):
(a) IN GENERAL.—The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor or joint inventor of carrying out the invention.
The following is a quotation of the first paragraph of pre-AIA 35 U.S.C. 112:
The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor of carrying out his invention.
Claims 1-5 and 7-11 are rejected under 35 U.S.C. 112(a) or 35 U.S.C. 112 (pre-AIA ), first paragraph, as failing to comply with the written description requirement. The claim(s) contains subject matter which was not described in the specification in such a way as to reasonably convey to one skilled in the relevant art that the inventor or a joint inventor, or for applications subject to pre-AIA 35 U.S.C. 112, the inventor(s), at the time the application was filed, had possession of the claimed invention.
Regarding claim 1, the claimed limitations, (i) “a plurality of first heat conductive holes each extending through the substrate layer, wherein each of the first heat conductive holes is filled with a first heat dissipation column being in contact with the heat conductive layer and the backplane layer;” and (ii) “a heat dissipation joint part disposed at least between two adjacent ones of the first heat conductive holes to be in contact with the two adjacent ones of the first heat conductive holes, and disposed on a side of the substrate layer away from the light-emitting layer and on a surface of the backplane layer close to the substrate layer” recited in lines 8-14 are not incorporated by the original disclosure of current application, because the first group (i) of limitations is disclosed in connection with the embodiment of Fig. 5 (i.e., fourth structural diagram), however, the heat dissipation joint part limitation is disclosed only in connection with the distinct embodiment of Fig. 6 (i.e., fifth structural diagram), the original disclosure does not originally describe the claimed combination of these features. Specifically, Fig. 6 of the fifth structural diagram shows the first heat conductive holes 501 that do not extend through the substrate layer 10 and are not in contact with the backplane layer 40. In contrast, although the fourth structural diagram of Fig. 5 discloses the first heat conductive holes 501 extending through the substrate layer 10 and contacting the backplane layer 40, the Fig. 5 embodiment does not include the heat dissipation joint part 70 disposed between two adjacent first heat conductive holes 501.
Therefore, this claimed limitation fails to comply with the written description requirement. Claims 2-5 and 7-11 depends on claim 1, and therefore, claims 2-5 and 7-11 also fail to comply with the written description requirement.
Response to Arguments
Applicant’s arguments with respect to claim(s) 1 have been considered but are moot because the new ground of rejection does not rely on any reference applied in the prior rejection of record for any teaching or matter specifically challenged in the argument.
Conclusion
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/JAY C KIM/Primary Examiner, Art Unit 2815
/WOO K LEE/Examiner, Art Unit 2815
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