Prosecution Insights
Last updated: May 29, 2026
Application No. 18/008,598

HEAT DISSIPATION SHEET

Non-Final OA §103
Filed
Dec 06, 2022
Priority
Jun 12, 2020 — JP 2020-102303 +1 more
Examiner
GAITONDE, MEGHA MEHTA
Art Unit
1781
Tech Center
1700 — Chemical & Materials Engineering
Assignee
Denka Company Limited
OA Round
5 (Non-Final)
40%
Grant Probability
Moderate
5-6
OA Rounds
1m
Est. Remaining
76%
With Interview

Examiner Intelligence

Grants 40% of resolved cases
40%
Career Allowance Rate
237 granted / 588 resolved
-24.7% vs TC avg
Strong +36% interview lift
Without
With
+35.9%
Interview Lift
resolved cases with interview
Typical timeline
3y 7m
Avg Prosecution
29 currently pending
Career history
631
Total Applications
across all art units

Statute-Specific Performance

§101
0.1%
-39.9% vs TC avg
§103
86.4%
+46.4% vs TC avg
§102
6.5%
-33.5% vs TC avg
§112
0.7%
-39.3% vs TC avg
Black line = Tech Center average estimate • Based on career data from 588 resolved cases

Office Action

§103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Continued Examination Under 37 CFR 1.114 A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after final rejection. Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, the finality of the previous Office action has been withdrawn pursuant to 37 CFR 1.114. Applicant's submission filed on March 2, 2026, has been entered. Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claims 1, 2 and 4 are rejected under 35 U.S.C. 103 as being unpatentable over WO 2018/123788 Otsuka et al (cited by US 2019/0337803) in view of US 2018/0328677 Kim et al. Regarding claim 1, Otsuka teaches a heat dissipation (paragraph 0002) sheet (paragraph 0004), which is prepared by molding (paragraph 0152) a thermally conductive resin composition (paragraph 0002) prepared by blending an inorganic filler component and a resin component (paragraph 0171), the inorganic filler component including a first inorganic filler (h-BN) and a second inorganic filler (h-BN, paragraph 0171, where the first and second inorganic fillers being the same material is not excluded by the claim), provided that particle size distribution of the inorganic filler component includes a first maximum point attributable to the first inorganic filler and a second maximum point attributable to the second inorganic filler (paragraph 0010 and figure 5); a particle size at the first maximum point is 40-300 microns (paragraph 0037); a particle size at the second maximum point is 1.6% to 75% the particle size at the first maximum point (paragraph 0038, 5-30 microns); and an accumulated amount of a frequency between a peak start and a peak end of a peak having the first maximum point is 50% or more (figure 5), and which has a thickness of 0.050 to 10 mm (paragraph 0156), and wherein the second inorganic filler is a clumped boron nitride particle where primary particles of hexagonal crystal boron nitride are aggregated (paragraph 0012, part I, where “clumped” and “aggregated” are not defined as mutually exclusive, distinct arrangements). Otsuka does not explicitly teach that the particle size ratio of the second maximum point (5-30 microns) to the first maximum point (40-300 microns) is 0.30 to 0.67, or that the thickness is 0.2 mm or less. “In the case where the claimed ranges ‘overlap or lie inside ranges disclosed by the prior art’ a prima facie case of obviousness exists,” (MPEP 2144.05 Section I). Therefore, absent evidence of criticality: the taught range of 1.6% to 75% reads on the claimed range of 30% to 67%, the taught range of 0.050-10 mm reads on the claimed range of 0.2 mm. Otsuka does not explicitly the heat dissipation sheet base material or structure. Kim teaches a heat dissipating plate comprises a base material having a thickness of 1 mm (paragraph 0050), and the heat dissipation sheet has a layer structure of: a thermally conductive composition followed by the base material, followed by another layer of the thermally conductive composition (figure 2). It would have been obvious to one of ordinary skill in the art before the effective filing date of the invention to include the core/cover structure of Kim in the product of Otsuka because this achieves a low coefficient of thermal expansion in the plane direction while also achieving a high conductivity in the thickness direction (paragraph 0009). Kim does not teach that the base material has thickness of 0.05 mm or less. However, “where the only difference between the prior art and the claims was a recitation of relative dimensions of the claimed device, and a device having the claimed relative dimensions would not perform differently than the prior art device, the claimed device was not patentably distinct from the prior art device” (MPEP 2144.04 Section IV Part A). Therefore, without a showing of criticality, the claimed dimensions do not impart patentability to the claims. Neither Otsuka nor Kim disclose the roughness of the sheet. However, as Otsuka in view of Kim satisfies all of the previous limitations, Otsuka’s materials (h-BN) and method (packing amount and density) are indistinguishable from the claimed materials and method (as-filed spec paragraph 0040). Therefore, it is reasonable to expect that Otsuka’s sheet would also have a surface roughness of 1.5 to 3.0 microns. “Where the claimed and prior art products are identical or substantially identical in structure or composition, or are produced by identical or substantially identical processes, a prima facie case of either anticipation or obviousness has been established” (MPEP 2112.01 Section I). Regarding claim 2, Otsuka teaches that with respect to a particle size accumulation of the inorganic filler component, the accumulated amount of the frequency at the particle size of from 0 to 15 µm is less than 60% (figure 5). Regarding claim 4, Otsuka teaches that the first inorganic filler is different from the second inorganic filler (paragraphs 0037 and 0038, where “different” may refer to filler particle size). Response to Arguments Applicant’s arguments with respect to the base material have been considered but are moot because the new ground of rejection, Otsuka in view of Kim, does not rely on any reference applied in the prior rejection of record for any teaching or matter specifically challenged in the argument. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to Megha M Gaitonde whose telephone number is (571)270-3598. The examiner can normally be reached Monday-Friday 8:30 am to 5 pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Frank Vineis can be reached on 571-270-1547. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /MEGHA M GAITONDE/Primary Examiner, Art Unit 1781
Read full office action

Prosecution Timeline

Show 6 earlier events
May 25, 2025
Response after Non-Final Action
Jul 08, 2025
Non-Final Rejection mailed — §103
Oct 01, 2025
Response Filed
Oct 28, 2025
Final Rejection mailed — §103
Jan 27, 2026
Response after Non-Final Action
Mar 02, 2026
Request for Continued Examination
Mar 09, 2026
Response after Non-Final Action
May 15, 2026
Non-Final Rejection mailed — §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

5-6
Expected OA Rounds
40%
Grant Probability
76%
With Interview (+35.9%)
3y 7m (~1m remaining)
Median Time to Grant
High
PTA Risk
Based on 588 resolved cases by this examiner. Grant probability derived from career allowance rate.

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