Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 103
Claim(s) 12-13 and 15-16 are rejected under 35 U.S.C. 103 as being unpatentable over Chiu (PGPub No. 20200185304) in further view of Wu (PGPub No. 20180259271) and Johnson (PGPub No. 20190132994).
Regarding claim 12, Chiu teaches a thermoconductive material to be disposed between a heat generator and a heat dissipator and to be fastened together with the heat generator and the heat dissipator with a plurality of screws (Fig. 14 and [0045-47] point to a thermal interface material 208 (thermoconductive material) dispensed between a package component 100 including integrated circuit dies 50 (heat generator), a thermal module 200 (heat dissipator), and a plurality of bolts 202 (screws) used to fasten together said package component 100 and thermal module 200.), the thermoconductive material having a plurality of screw insertion portions into which the plurality of screws are to be inserted on a one-to-one basis in a thickness direction defined with respect to the thermoconductive material (Figs. 13-14 and [0046] point to a thermal interface material 208 (thermoconductive material) dispensed between a plurality of bolt holes 148 and 204, which imply that similar bolt holes (screw insertion portions) exist in the thermal interface material 208 as well.), the thermoconductive material including an inside region and an outside region, the inside region being a region located at a side of a central portion of the thermoconductive material with respect to the plurality of screw insertion portions, the outside region being a region located at a side of an outer edge portion of the thermoconductive material with respect to the inside region (Figs. 13-14 and [0047] points to a thermal interface material 208 (thermoconductive material) dispensed on the back side of the package component 100, which includes areas located between multiple bolts 202 (inside region), as well as the outer edges of the package component 100 away from the bolts 202 (outside region).), the outside region including a support portion which is at least part of the outside region (Id. points to a thermal interface material 208 (thermoconductive material) dispensed on the back side of the package component 100, which includes the outer edges of the package component 100 away from the bolts 202 (outside region).), wherein when a pressure of 500 kPa is applied in the thickness direction, an outside thickness which is a thickness of the support portion is greater than an inside thickness which is a greatest thickness of the inside region ([0055] points to the thermal interface material, or TIM, 208 experiencing at least 60 PSI, or 413.685 kPa. In the case where the claimed ranges “overlap or lie inside ranges disclosed by the prior art” a prima facie case of obviousness exists. In re Wertheim, 541 F.2d 257, 191 USPQ 90 (CCPA 1976); In re Woodruff, 919 F.2d 1575, 16 USPQ2d 1934 (Fed. Cir. 1990). Regarding the difference in thickness between the outside and inside regions, it is interpreted to be obvious that as pressure is applied to the TIM via the bolts 202, at least some portions of the TIM would move away from said bolts and towards the outer edges/outside region, which would result in a greater thickness.), the plurality of screw insertion portions include four or more screw insertion portions, four of the four or more screw insertion portions are arranged at vertices of a quadrangle (Figs. 13-14 points to at least 9 bolt holes 204/148 (screw insertion portions), with each bolt hole corresponding with adjacent bolt holes to create a square shape (quadrangle).), the plurality of screw insertion portions each have a hole shape (Figs. 13-14 and [0046] point to a thermal interface material 208 (thermoconductive material) dispensed between a plurality of bolt holes 148 and 204, which imply that similar bolt holes (screw insertion portions) of the same shape (hole shape) exist in the thermal interface material 208 as well.), the support portion is in a region of the outside region, the region being outside the quadrangle whose vertices are centers of the four screw insertion portions (Id. points to a thermal interface material 208 (thermoconductive material) dispensed on the back side of the package component 100, which includes the outer edges (outside region) of the package component 100 away from the bolts 202 (quadrangle).).
Chiu fails to teach the thermoconductive material comprising a carbonaceous substance as a main component, the thermoconductive material further comprises an overlap arranged only on the outside region of the thermoconductive material to form a laminate structure on the outside region such that the outside thickness is greater than the inside thickness, and the overlap includes two or more layers.
Wu teaches the thermoconductive material comprising a carbonaceous substance as a main component ([0015-16] point to a thermal interface material 12 (thermoconductive material) comprising a foam-like synthetic graphite (carbonaceous substrance).). Thus, it would have been obvious to a person of ordinary skill in the art (POSITA) prior to the filing date of the claimed invention to combine the teachings of Chiu and Wu, such that the thermoconductive material comprises a carbonaceous material such as synthetic graphite in order to make use of its thermal spreading ability and high thermal conductivity for better heat dissipation.
Chiu et al. still fails to teach the thermoconductive material further comprises an overlap arranged only on the outside region of the thermoconductive material to form a laminate structure on the outside region such that the outside thickness is greater than the inside thickness, and the overlap includes two or more layers.
Johnson teaches the thermoconductive material further comprises an overlap arranged only on the outside region of the thermoconductive material, the overlap overlapping the outside region of the thermoconductive material in the thickness direction, thereby forming a laminate structure on the outside region such that the outside thickness is greater than the inside thickness, and the overlap includes two or more layers overlapping in the thickness direction ([0029] points to building up a dam or one or more wall portions (overlap; laminate structure) in order to define a channel/pocket/walled off area to which a TIM (thermoconductive material) is added. [0030] further points to said dam having a height greater than the TIM, such that only a relatively thin portion (outside region) of the softer TIM protrudes beyond the dam.). Thus, it would have been obvious to a POSITA prior to the filing date of the claimed invention to combine the teachings of Chiu et al. and Johnson, such that an overlap is formed in order to reinforce the softer TIM/thermoconductive material and confine said material to a predetermined area.
Regarding claim 13, Chiu teaches a thermoconductive material to be disposed between a heat generator and a heat dissipator and to be fastened together with the heat generator and the heat dissipator with a plurality of screws (Fig. 14 and [0045-47] point to a thermal interface material 208 (thermoconductive material) dispensed between a package component 100 including integrated circuit dies 50 (heat generator), a thermal module 200 (heat dissipator), and a plurality of bolts 202 (screws) used to fasten together said package component 100 and thermal module 200.),the thermoconductive material having a plurality of screw insertion portions into which the plurality of screws are to be inserted on a one-to-one basis in a thickness direction defined with respect to the thermoconductive material (Figs. 13-14 and [0046] point to a thermal interface material 208 (thermoconductive material) dispensed between a plurality of bolt holes 148 and 204, which imply that similar bolt holes (screw insertion portions) exist in the thermal interface material 208 as well.), the thermoconductive material including an inside region and an outside region, the inside region being a region located at a side of a central portion of the thermoconductive material with respect to the plurality of screw insertion portions, the outside region being a region located at a side of an outer edge portion of the thermoconductive material with respect to the inside region (Figs. 13-14 and [0047] points to a thermal interface material 208 (thermoconductive material) dispensed on the back side of the package component 100, which includes areas located between multiple bolts 202 (inside region), as well as the outer edges of the package component 100 away from the bolts 202 (outside region).), the outside region including a support portion which is at least part of the outside region (Id. points to a thermal interface material 208 (thermoconductive material) dispensed on the back side of the package component 100, which includes the outer edges of the package component 100 away from the bolts 202 (outside region).), wherein when a pressure of 500 kPa is applied in the thickness direction, an outside thickness which is a thickness of the support portion is greater than an inside thickness which is a greatest thickness of the inside region ([0055] points to the thermal interface material, or TIM, 208 experiencing at least 60 PSI, or 413.685 kPa. In the case where the claimed ranges “overlap or lie inside ranges disclosed by the prior art” a prima facie case of obviousness exists. In re Wertheim, 541 F.2d 257, 191 USPQ 90 (CCPA 1976); In re Woodruff, 919 F.2d 1575, 16 USPQ2d 1934 (Fed. Cir. 1990). Regarding the difference in thickness between the outside and inside regions, it is interpreted to be obvious that as pressure is applied to the TIM via the bolts 202, at least some portions of the TIM would move away from said bolts and towards the outer edges/outside region, which would result in a greater thickness.), the plurality of screw insertion portions include four or more screw insertion portions, four of the four or more screw insertion portions are arranged at vertices of a quadrangle (Figs. 13-14 points to at least 9 bolt holes 204/148 (screw insertion portions), with each bolt hole corresponding with adjacent bolt holes to create a square shape (quadrangle).), the plurality of screw insertion portions each have a hole shape (Figs. 13-14 and [0046] point to a thermal interface material 208 (thermoconductive material) dispensed between a plurality of bolt holes 148 and 204, which imply that similar bolt holes (screw insertion portions) of the same shape (hole shape) exist in the thermal interface material 208 as well.), the support portion is in a region of the outside region, the region being outside the quadrangle whose vertices are centers of the four screw insertion portions (Id. points to a thermal interface material 208 (thermoconductive material) dispensed on the back side of the package component 100, which includes the outer edges (outside region) of the package component 100 away from the bolts 202 (quadrangle).).
Chiu fails to teach the thermoconductive material comprising a carbonaceous substance as a main component, the thermoconductive material further comprises an overlap arranged only on the outside region of the thermoconductive material to form a laminate structure on the outside region such that the outside thickness is greater than the inside thickness, and a material of the overlap is a resin or a metal.
Wu teaches the thermoconductive material comprising a carbonaceous substance as a main component ([0015-16] point to a thermal interface material 12 (thermoconductive material) comprising a foam-like synthetic graphite (carbonaceous substrance).). Thus, it would have been obvious to a person of ordinary skill in the art (POSITA) prior to the filing date of the claimed invention to combine the teachings of Chiu and Wu, such that the thermoconductive material comprises a carbonaceous material such as synthetic graphite in order to make use of its thermal spreading ability and high thermal conductivity for better heat dissipation.
Chiu et al. still fails to teach the thermoconductive material further comprises an overlap arranged only on the outside region of the thermoconductive material to form a laminate structure on the outside region such that the outside thickness is greater than the inside thickness, and the overlap is a resin or a metal.
Johnson teaches the thermoconductive material further comprises an overlap arranged only on the outside region of the thermoconductive material, the overlap overlapping the outside region of the thermoconductive material in the thickness direction, thereby forming a laminate structure on the outside region such that the outside thickness is greater than the inside thickness, and the overlap is a resin or a metal ([0029] points to building up a dam or one or more wall portions (overlap; laminate structure) made of PET in order to define a channel/pocket/walled off area to which a TIM (thermoconductive material) is added. [0030] further points to said dam having a height greater than the TIM, such that only a relatively thin portion (outside region) of the softer TIM protrudes beyond the dam.). Thus, it would have been obvious to a POSITA prior to the filing date of the claimed invention to combine the teachings of Chiu et al. and Johnson, such that an overlap is formed in order to reinforce the softer TIM/thermoconductive material and confine said material to a predetermined area.
Regarding claim 15, Chiu teaches an electronic component comprising: a heat generator; a heat dissipator; a thermoconductive material between the heat generator and the heat dissipator; and a plurality of screws which fasten the heat generator, the thermoconductive material, and the heat dissipator together,the plurality of screws being inserted in the thermoconductive material in a thickness direction defined with respect to the thermoconductive material (Fig. 14 and [0045-47] point to a thermal interface material 208 (thermoconductive material) dispensed between a package component 100 including integrated circuit dies 50 (heat generator), a thermal module 200 (heat dissipator), and a plurality of bolts 202 (screws) used to fasten together said package component 100 and thermal module 200 in a vertical direction (thickness direction).),the thermoconductive material including an inside region and an outside region, the inside region being a region located at a side of a central portion of the thermoconductive material with respect to central axes of the plurality of screws, the outside region being a region located at a side of an outer edge portion of the thermoconductive material with respect to the inside region (Figs. 13-14 and [0047] points to a thermal interface material 208 (thermoconductive material) dispensed on the back side of the package component 100, which includes areas located between multiple bolts 202 (inside region), as well as the outer edges of the package component 100 away from the bolts 202 (outside region).), the outside region including a support portion which is at least part of the outside region (Id. points to a thermal interface material 208 (thermoconductive material) dispensed on the back side of the package component 100, which includes the outer edges of the package component 100 away from the bolts 202 (outside region).), wherein when a pressure of 500 kPa is applied in the thickness direction, an outside thickness which is a thickness of the support portion is greater than an inside thickness which is a greatest thickness of the inside region ([0055] points to the thermal interface material, or TIM, 208 experiencing at least 60 PSI, or 413.685 kPa. In the case where the claimed ranges “overlap or lie inside ranges disclosed by the prior art” a prima facie case of obviousness exists. In re Wertheim, 541 F.2d 257, 191 USPQ 90 (CCPA 1976); In re Woodruff, 919 F.2d 1575, 16 USPQ2d 1934 (Fed. Cir. 1990). Regarding the difference in thickness between the outside and inside regions, it is interpreted to be obvious that as pressure is applied to the TIM via the bolts 202, at least some portions of the TIM would move away from said bolts and towards the outer edges/outside region, which would result in a greater thickness.), the plurality of screws include four or more screws, four of the four or more screws are arranged at vertices of a quadrangle (Figs. 13-14 points to at least 9 bolt holes 204/148 (screw insertion portions), with each bolt hole corresponding with adjacent bolt holes to create a square shape (quadrangle).), the support portion is in a region of the outside region, the region being outside the quadrangle whose vertices are centers of the four screws (Id. points to a thermal interface material 208 (thermoconductive material) dispensed on the back side of the package component 100, which includes the outer edges (outside region) of the package component 100 away from the bolts 202 (quadrangle).).
Chiu fails to teach the thermoconductive material including a carbonaceous substance as a main component, the electronic component further comprises an overlap arranged only on the outside region of the thermoconductive material to form a laminate structure on the outside region such that the outside thickness is greater than the inside thickness, and the overlap includes two or more layers.
Wu teaches the thermoconductive material comprising a carbonaceous substance as a main component ([0015-16] point to a thermal interface material 12 (thermoconductive material) comprising a foam-like synthetic graphite (carbonaceous substrance).). Thus, it would have been obvious to a person of ordinary skill in the art (POSITA) prior to the filing date of the claimed invention to combine the teachings of Chiu and Wu, such that the thermoconductive material comprises a carbonaceous material such as synthetic graphite in order to make use of its thermal spreading ability and high thermal conductivity for better heat dissipation.
Chiu et al. still fails to teach the electronic component further comprises an overlap arranged only on the outside region of the thermoconductive material to form a laminate structure on the outside region such that the outside thickness is greater than the inside thickness, and the overlap includes two or more layers.
Johnson teaches the electronic component further comprises an overlap arranged only on the outside region of the thermoconductive material, the overlap overlapping the outside region of the thermoconductive material in the thickness direction, thereby forming a laminate structure on the outside region such that the outside thickness is greater than the inside thickness, and the overlap includes two or more layers overlapping in the thickness direction ([0029] points to building up a dam or one or more wall portions (overlap; laminate structure) in order to define a channel/pocket/walled off area to which a TIM (thermoconductive material) is added. [0030] further points to said dam having a height greater than the TIM, such that only a relatively thin portion (outside region) of the softer TIM protrudes beyond the dam.). Thus, it would have been obvious to a POSITA prior to the filing date of the claimed invention to combine the teachings of Chiu et al. and Johnson, such that an overlap is formed in order to reinforce the softer TIM/thermoconductive material and confine said material to a predetermined area.
Regarding claim 16, Chiu teaches an electronic component comprising: a heat generator; a heat dissipator; a thermoconductive material between the heat generator and the heat dissipator; and a plurality of screws which fasten the heat generator, the thermoconductive material, and the heat dissipator together,the plurality of screws being inserted in the thermoconductive material in a thickness direction defined with respect to the thermoconductive material (Fig. 14 and [0045-47] point to a thermal interface material 208 (thermoconductive material) dispensed between a package component 100 including integrated circuit dies 50 (heat generator), a thermal module 200 (heat dissipator), and a plurality of bolts 202 (screws) used to fasten together said package component 100 and thermal module 200 in a vertical direction (thickness direction).),the thermoconductive material including an inside region and an outside region, the inside region being a region located at a side of a central portion of the thermoconductive material with respect to central axes of the plurality of screws, the outside region being a region located at a side of an outer edge portion of the thermoconductive material with respect to the inside region (Figs. 13-14 and [0047] points to a thermal interface material 208 (thermoconductive material) dispensed on the back side of the package component 100, which includes areas located between multiple bolts 202 (inside region), as well as the outer edges of the package component 100 away from the bolts 202 (outside region).), the outside region including a support portion which is at least part of the outside region (Id. points to a thermal interface material 208 (thermoconductive material) dispensed on the back side of the package component 100, which includes the outer edges of the package component 100 away from the bolts 202 (outside region).), wherein when a pressure of 500 kPa is applied in the thickness direction, an outside thickness which is a thickness of the support portion is greater than an inside thickness which is a greatest thickness of the inside region ([0055] points to the thermal interface material, or TIM, 208 experiencing at least 60 PSI, or 413.685 kPa. In the case where the claimed ranges “overlap or lie inside ranges disclosed by the prior art” a prima facie case of obviousness exists. In re Wertheim, 541 F.2d 257, 191 USPQ 90 (CCPA 1976); In re Woodruff, 919 F.2d 1575, 16 USPQ2d 1934 (Fed. Cir. 1990). Regarding the difference in thickness between the outside and inside regions, it is interpreted to be obvious that as pressure is applied to the TIM via the bolts 202, at least some portions of the TIM would move away from said bolts and towards the outer edges/outside region, which would result in a greater thickness.), the plurality of screws include four or more screws, four of the four or more screws are arranged at vertices of a quadrangle (Figs. 13-14 points to at least 9 bolt holes 204/148 (screw insertion portions), with each bolt hole corresponding with adjacent bolt holes to create a square shape (quadrangle).), the support portion is in a region of the outside region, the region being outside the quadrangle whose vertices are centers of the four screws (Id. points to a thermal interface material 208 (thermoconductive material) dispensed on the back side of the package component 100, which includes the outer edges (outside region) of the package component 100 away from the bolts 202 (quadrangle).).
Chiu fails to teach the thermoconductive material including a carbonaceous substance as a main component, the electronic component further comprises an overlap arranged only on the outside region of the thermoconductive material to form a laminate structure on the outside region such that the outside thickness is greater than the inside thickness, and a material of the overlap is a resin or a metal.
Wu teaches the thermoconductive material comprising a carbonaceous substance as a main component ([0015-16] point to a thermal interface material 12 (thermoconductive material) comprising a foam-like synthetic graphite (carbonaceous substrance).). Thus, it would have been obvious to a person of ordinary skill in the art (POSITA) prior to the filing date of the claimed invention to combine the teachings of Chiu and Wu, such that the thermoconductive material comprises a carbonaceous material such as synthetic graphite in order to make use of its thermal spreading ability and high thermal conductivity for better heat dissipation.
Chiu et al. still fails to teach the electronic component further comprises an overlap arranged only on the outside region of the thermoconductive material to form a laminate structure on the outside region such that the outside thickness is greater than the inside thickness, and a material of the overlap is a resin or a metal.
Johnson teaches the electronic component further comprises an overlap arranged only on the outside region of the thermoconductive material, the overlap overlapping the outside region of the thermoconductive material in the thickness direction, thereby forming a laminate structure on the outside region such that the outside thickness is greater than the inside thickness, and a material of the overlap is a resin or a metal ([0029] points to building up a dam or one or more wall portions (overlap; laminate structure) made of PET in order to define a channel/pocket/walled off area to which a TIM (thermoconductive material) is added. [0030] further points to said dam having a height greater than the TIM, such that only a relatively thin portion (outside region) of the softer TIM protrudes beyond the dam.). Thus, it would have been obvious to a POSITA prior to the filing date of the claimed invention to combine the teachings of Chiu et al. and Johnson, such that an overlap is formed in order to reinforce the softer TIM/thermoconductive material and confine said material to a predetermined area.
Response to Arguments
Applicant's arguments filed 07/27/2026 regarding amended claims 12-13 and 15-16 have been fully considered but they are not persuasive. Specifically, Applicant argues that reference Johnson fails to teach the newly amended subject matter: “the overlap overlapping the outside region of the thermoconductive material in the thickness direction”. However, Examiner argues that said subject matter is still taught by Johnson, [0029-30] in particular, and is discussed above. Thus, Applicant’s argument(s) are considered unpersuasive and fail to overcome the previous rejections.
Conclusion
THIS ACTION IS MADE FINAL. Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a).
A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to Patrick L Cullen whose telephone number is (703)756-1221. The examiner can normally be reached Monday - Friday, 8:30AM - 5PM EST.
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/PATRICK CULLEN/Assistant Examiner, Art Unit 2899
/DALE E PAGE/Supervisory Patent Examiner, Art Unit 2899
