Prosecution Insights
Last updated: July 17, 2026
Application No. 18/144,455

BEAM QUALITY MONITORING AND MULTIPLE LASER BEAM LOCATION REGISTRATION FOR HIGH-SPEED LASER MOTION SYSTEMS

Non-Final OA §103
Filed
May 08, 2023
Priority
May 09, 2022 — provisional 63/339,606
Examiner
TEKA, ABIY
Art Unit
3745
Tech Center
3700 — Mechanical Engineering & Manufacturing
Assignee
Edison Welding Institute Inc.
OA Round
1 (Non-Final)
85%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
95%
With Interview

Examiner Intelligence

Grants 85% — above average
85%
Career Allowance Rate
581 granted / 686 resolved
+14.7% vs TC avg
Moderate +10% lift
Without
With
+10.3%
Interview Lift
resolved cases with interview
Typical timeline
2y 5m
Avg Prosecution
24 currently pending
Career history
703
Total Applications
across all art units

Statute-Specific Performance

§101
1.0%
-39.0% vs TC avg
§103
51.5%
+11.5% vs TC avg
§102
32.3%
-7.7% vs TC avg
§112
14.3%
-25.7% vs TC avg
Black line = Tech Center average estimate • Based on career data from 686 resolved cases

Office Action

§103
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 103 The following is a quotation of pre-AIA 35 U.S.C. 103(a) which forms the basis for all obviousness rejections set forth in this Office action: (a) A patent may not be obtained though the invention is not identically disclosed or described as set forth in section 102 of this title, if the differences between the subject matter sought to be patented and the prior art are such that the subject matter as a whole would have been obvious at the time the invention was made to a person having ordinary skill in the art to which said subject matter pertains. Patentability shall not be negatived by the manner in which the invention was made. Claims 1-20 are rejected under 35 U.S.C. 103 as being unpatentable over Beam et al. (US 2020/0209107 A1). Regarding Claims 1 and 9 Beam teaches a system for analyzing large area laser powder bed fusion systems and other high-speed motion laser beam systems, comprising:(a) a plurality of lasers (800, par.0031) (i) wherein each laser creates a field of view such that an overlapping region is created (scanning zones that overlap see par.0038), and (ii) wherein each laser generates a non-stationary laser beam (see par.0009, 0031); (b) a build platform (build plane see Par.0009) positioned at a predetermined location relative to the field of view of the lasers (Fig 2, 7 par.0009, 0040); and (c) a plurality of portable measurement devices (300, 400, 500, 600) positioned on the build platform (Fig 2), (i) wherein the portable measurement device includes a pin-hole sensor (700) that receives laser light generated by the non-stationary laser beam (par.0037& 0040), and (ii) wherein the plurality of portable measurement (300,400, 500, 600) devices are electrically coupled to one another via the sensor (700) to form a modular array (see Fig 2).Beam further teaches the plurality of portable measurement devices (300,400, 500, 600) can be repositioned and recoupled to form a second modular array (see Fig 2). Beam is silent regarding each portable measurement device including a pin hole sensor. Beam only teaches having a single pin hole sensor for multiple portable measurement devices. However, it would have been a matter of design consideration to have formed multiple sensor devices to allow each portable measurement device to have a dedicated sensor for the purpose of forming a more precise detection device. Further, it has been held that mere duplication of the essential working parts of a device involves only routine skill in the art. Regarding Claims 2, 10 and 15 Beam teaches wherein the plurality of portable measurement devices (300-600) are positioned on the build platform (Fig 2) at any location within the field of view of each laser, within the overlapping region, or within a combination thereof (Fig 2). Regarding Claims 3, 12 and 16 Beam teaches wherein the plurality of portable measurement devices (300-600) are positioned at extremities in the field of view of each laser (Fig 2 and 7). Regarding Claim 4 Beam teaches wherein the plurality of portable measurement devices (300-400) can be moved or reconfigured singly or collectively to form a variety of modular arrays (ig 2). Regarding Claims 5 and 17 Beam teaches wherein each pin-hole sensor (400-600) measures quality of the non-stationary laser beam generated from each laser (Fig 2, par.0037 and 0039). Regarding Claims 6-7, 13 and 18-19 Beam teaches each pin-hole sensor measures location of its respective portable measurement device and the measured location of the portable measurement device is used for motion speed measurement, location precision, and calibration (Fig 2, par.0037&0039). Regarding Claims 8 and 20 Beam teaches wherein the plurality of lasers are used in large part manufacturing (par.0009). Regarding Claim 14 Beam teaches a method for analyzing large area laser powder bed fusion systems and other high-speed motion laser beam systems, providing:(a) a plurality of lasers (800, par.0031) (i) wherein each laser creates a field of view such that an overlapping region is created (scanning zones that overlap see par.0038), and (ii) wherein each laser generates a non-stationary laser beam (see par.0009, 0031); (b) positioning a build platform (build plane see Par.0009) positioned at a predetermined location relative to the field of view of the lasers (Fig 2, 7 par.0009, 0040); and (c) positioning a plurality of portable measurement devices (300, 400, 500, 600) positioned on the build platform (Fig 2), (i) wherein the portable measurement device includes a pin-hole sensor (700) that receives laser light generated by the non-stationary laser beam (par.0037& 0040), and (ii) wherein the plurality of portable measurement (300,400, 500, 600) devices are electrically coupled to one another via the sensor (700) to form a modular array (see Fig 2).Beam further teaches the plurality of portable measurement devices (300,400, 500, 600) can be repositioned and recoupled to form a second modular array (see Fig 2). Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to ABIY TEKA whose telephone number is (571)272-9804. The examiner can normally be reached M-F 11-9 PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Nathaniel Wiehe can be reached at (571) 272-8648. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /ABIY TEKA/ Primary Examiner, Art Unit 3745
Read full office action

Prosecution Timeline

May 08, 2023
Application Filed
Jun 14, 2023
Response after Non-Final Action
May 15, 2026
Non-Final Rejection mailed — §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
85%
Grant Probability
95%
With Interview (+10.3%)
2y 5m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 686 resolved cases by this examiner. Grant probability derived from career allowance rate.

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