Prosecution Insights
Last updated: August 15, 2026
Application No. 18/169,746

Methods and Systems for High Pressure Die Casting

Non-Final OA §102§DP
Filed
Feb 15, 2023
Priority
Feb 15, 2022 — provisional 63/268,049
Examiner
KESSLER, CHRISTOPHER S
Art Unit
1759
Tech Center
1700 — Chemical & Materials Engineering
Assignee
Metali LLC
OA Round
3 (Non-Final)
60%
Grant Probability
Moderate
3-4
OA Rounds
4m
Est. Remaining
74%
With Interview

Examiner Intelligence

Grants 60% of resolved cases
60%
Career Allowance Rate
485 granted / 809 resolved
-5.0% vs TC avg
Moderate +14% lift
Without
With
+14.4%
Interview Lift
resolved cases with interview
Typical timeline
3y 10m
Avg Prosecution
42 currently pending
Career history
856
Total Applications
across all art units

Statute-Specific Performance

§101
1.0%
-39.0% vs TC avg
§103
46.5%
+6.5% vs TC avg
§102
14.2%
-25.8% vs TC avg
§112
29.7%
-10.3% vs TC avg
Black line = Tech Center average estimate • Based on career data from 809 resolved cases

Office Action

§102 §DP
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Continued Examination Under 37 CFR 1.114 A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after final rejection. Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, the finality of the previous Office action has been withdrawn pursuant to 37 CFR 1.114. Applicant's submission filed on 11 May 2026 has been entered. Status of Claims Responsive to the amendment filed 11 May 2026, claim 1 and 5-7 are amended. Claims 1, and 4-7 are currently under examination. Status of Previous Rejections Responsive to the amendment filed 11 May 2026, new grounds of rejection are presented corresponding to the changes to the claims. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1-4 and 7 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Sokoluk, Maximilian, Jie Yuan, Shuaihang Pan, and Xiaochun Li. "Nanoparticles Enabled Mechanism for Hot Cracking Elimination in Aluminum Alloys." Metallurgical & Materials Transactions. Part A 52, no. 7 (2021): 3083 (hereinafter “Sokoluk”). Regarding claim 1, Sokoluk teaches a material that solves hot cracking problems in aluminum cast aluminum (See Abstract, or II. Materials and Methods). Sokoluk teaches that the aluminum alloy including the nanoparticle TiC is provided by MetaLi (p. 3084). Sokoluk teaches that a 7075NT-C alloy is formed, meaning a 7075 alloy with TiC nanoparticles (p. 3084). Sokoluk teaches that the metal with the TiC nanoparticles is cast (p. 3084). Sokoluk teaches that the hot cracking problem is solved (V. Conclusions). Sokoluk does not teach a prevention of cracking at 100 – 300 C/s cooling rate. Regarding the limitations of wherein the nanoparticle enhances the fluidity of the metal alloy to fill a die at a pressure of 30 to 100 MPa, Sokoluk does not teach this feature. Sokoluk teaches that the alloy may be made by casting. The properties not disclosed in the prior art would have been inherently present in the prior art. The same structure, the same composition, used for casting, and to solve problems of hot cracking (though at different cooling rates), would have had the same properties as claimed inherently. Applicant is directed to MPEP 2112. Regarding claim 4, Sokoluk teaches that the TiC nanoparticles can coat 7075 aluminum metal powders (see pp. 3083-3084). The disclosure reads on a core of Al and a shell of the nanoparticles. Thus the TiC nanoparticles are in the structure of an aluminum core-TiC shell particle. Regarding claims 5-6, Sokoluk teaches that metal with 0.8% TiC is provided by MetaLi (p. 3084). The amount falls within each of the claimed ranges, anticipating the entire range. Applicant is directed to MPEP 2131.03. Regarding claim 7, Sokoluk teaches that a 6061 alloy is prepared (II. Materials and Methods, Table 1). Double Patenting The nonstatutory double patenting rejection is based on a judicially created doctrine grounded in public policy (a policy reflected in the statute) so as to prevent the unjustified or improper timewise extension of the “right to exclude” granted by a patent and to prevent possible harassment by multiple assignees. A nonstatutory double patenting rejection is appropriate where the conflicting claims are not identical, but at least one examined application claim is not patentably distinct from the reference claim(s) because the examined application claim is either anticipated by, or would have been obvious over, the reference claim(s). See, e.g., In re Berg, 140 F.3d 1428, 46 USPQ2d 1226 (Fed. Cir. 1998); In re Goodman, 11 F.3d 1046, 29 USPQ2d 2010 (Fed. Cir. 1993); In re Longi, 759 F.2d 887, 225 USPQ 645 (Fed. Cir. 1985); In re Van Ornum, 686 F.2d 937, 214 USPQ 761 (CCPA 1982); In re Vogel, 422 F.2d 438, 164 USPQ 619 (CCPA 1970); In re Thorington, 418 F.2d 528, 163 USPQ 644 (CCPA 1969). A timely filed terminal disclaimer in compliance with 37 CFR 1.321(c) or 1.321(d) may be used to overcome an actual or provisional rejection based on nonstatutory double patenting provided the reference application or patent either is shown to be commonly owned with the examined application, or claims an invention made as a result of activities undertaken within the scope of a joint research agreement. See MPEP § 717.02 for applications subject to examination under the first inventor to file provisions of the AIA as explained in MPEP § 2159. See MPEP § 2146 et seq. for applications not subject to examination under the first inventor to file provisions of the AIA . A terminal disclaimer must be signed in compliance with 37 CFR 1.321(b). The filing of a terminal disclaimer by itself is not a complete reply to a nonstatutory double patenting (NSDP) rejection. A complete reply requires that the terminal disclaimer be accompanied by a reply requesting reconsideration of the prior Office action. Even where the NSDP rejection is provisional the reply must be complete. See MPEP § 804, subsection I.B.1. For a reply to a non-final Office action, see 37 CFR 1.111(a). For a reply to final Office action, see 37 CFR 1.113(c). A request for reconsideration while not provided for in 37 CFR 1.113(c) may be filed after final for consideration. See MPEP §§ 706.07(e) and 714.13. The USPTO Internet website contains terminal disclaimer forms which may be used. Please visit www.uspto.gov/patent/patents-forms. The actual filing date of the application in which the form is filed determines what form (e.g., PTO/SB/25, PTO/SB/26, PTO/AIA /25, or PTO/AIA /26) should be used. A web-based eTerminal Disclaimer may be filled out completely online using web-screens. An eTerminal Disclaimer that meets all requirements is auto-processed and approved immediately upon submission. For more information about eTerminal Disclaimers, refer to www.uspto.gov/patents/apply/applying-online/eterminal-disclaimer. Claims 1 and 4-7 are provisionally rejected on the ground of nonstatutory double patenting as being unpatentable over claims 1-19 of copending Application No. 18/364334 (reference application). Although the claims at issue are not identical, they are not patentably distinct from each other because applicant’s copending application does not disclose a “high pressure” die casting in claim 1. However, the material is considered to be essentially the same material of a metal matric with less than 4.0% silicon, and having a nanoparticle, and used for die casting. Corresponding features of the claims are met by the copending dependent claims, such as copending claim 2, copending claim 3, copending claim 4, and so on. The combination of the features of the different claims would require no more than an ordinary level of skill in the art. This is a provisional nonstatutory double patenting rejection because the patentably indistinct claims have not in fact been patented. Claims 1 and 4-7 are provisionally rejected on the ground of nonstatutory double patenting as being unpatentable over claims 1-24 of copending Application No. 18/489543 (reference application). Although the claims at issue are not identical, they are not patentably distinct from each other because applicant’s copending application does not disclose a “high pressure” die casting in claim 1. However, the material is considered to be essentially the same material of one of the selected aluminum alloys from copending claim 2 (inherently having less than 4% silicon), and having a nanoparticle, and used for casting. Corresponding features of the claims are met by the copending dependent claims, such as copending claim 2, copending claim 3, copending claim 4, and so on. The combination of the features of the different claims would require no more than an ordinary level of skill in the art. This is a provisional nonstatutory double patenting rejection because the patentably indistinct claims have not in fact been patented. Response to Arguments Applicant's arguments filed 11 May 2026 have been fully considered but they are not persuasive. Applicant argues that a terminal disclaimer has been filed. However no terminal disclaimer is in the file. The rejections under obviousness double patenting still stand. Applicant argues that the prior art Martin does not make obvious the invention of claim 1. While not necessarily agreeing to applicant’s arguments, the arguments are moot in view of new grounds of rejection, which are accordingly NON-final. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to CHRISTOPHER S KESSLER whose telephone number is (571)272-6510. The examiner can normally be reached 9-5:30. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Curt Mayes can be reached at 571-272-1234. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. CHRISTOPHER S. KESSLER Primary Examiner Art Unit 1734 /CHRISTOPHER S KESSLER/ Examiner, Art Unit 1759
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Prosecution Timeline

Feb 15, 2023
Application Filed
Aug 27, 2025
Non-Final Rejection mailed — §102, §DP
Nov 24, 2025
Response Filed
Mar 11, 2026
Final Rejection mailed — §102, §DP
May 11, 2026
Request for Continued Examination
May 13, 2026
Response after Non-Final Action
Jun 30, 2026
Non-Final Rejection mailed — §102, §DP (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

3-4
Expected OA Rounds
60%
Grant Probability
74%
With Interview (+14.4%)
3y 10m (~4m remaining)
Median Time to Grant
High
PTA Risk
Based on 809 resolved cases by this examiner. Grant probability derived from career allowance rate.

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