Prosecution Insights
Last updated: April 19, 2026
Application No. 18/190,727

LASER LIGHT SOURCE AND METHOD OF MANUFACTURING THE SAME

Final Rejection §103
Filed
Mar 27, 2023
Examiner
CARTER, MICHAEL W
Art Unit
2828
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Furukawa Electric Co. Ltd.
OA Round
2 (Final)
74%
Grant Probability
Favorable
3-4
OA Rounds
2y 6m
To Grant
90%
With Interview

Examiner Intelligence

Grants 74% — above average
74%
Career Allow Rate
626 granted / 844 resolved
+6.2% vs TC avg
Strong +16% interview lift
Without
With
+16.1%
Interview Lift
resolved cases with interview
Typical timeline
2y 6m
Avg Prosecution
28 currently pending
Career history
872
Total Applications
across all art units

Statute-Specific Performance

§101
0.4%
-39.6% vs TC avg
§103
54.3%
+14.3% vs TC avg
§102
19.0%
-21.0% vs TC avg
§112
21.6%
-18.4% vs TC avg
Black line = Tech Center average estimate • Based on career data from 844 resolved cases

Office Action

§103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 103 The text of those sections of Title 35, U.S. Code not included in this action can be found in a prior Office action. Claims 17-18 are rejected under 35 U.S.C. 103 as being unpatentable over JP-2002232064 (Miyajima). For claim 17, Miyajima’s embodiment of fig. 5 and 6 teaches a laser light source (fig. 5 and 6) comprising: a supporting member (fig. 5 and 6, 21 and 14); a submount fixed to an upper surface of the supporting member (fig. 5, 13; fig. 6, shows the stacked array with repeating elements 11-14, but only labels the top 11-13 whereas fig. 5 labels the lower grouping of elements 11-13; [0042]); a semiconductor laser element fixed to an upper surface of the submount (fig. 5-6, bottom laser 11), the semiconductor laser element having a light-exiting surface through which laser light is to be emitted (fig. 6, left end of 11 corresponding to 20a; [0040]); a lens member (fig. 5 and 6, bottom lens 15) having a light incident surface on which the laser light is incident (fig. 5 and 6, 20c of bottom lens 15; [0043]), and a bonding surface that extends laterally with respect to the light incident surface (fig. 5 and 6, 20d of bottom lens 15; [0043]), wherein the supporting member connects the lens member and the submount together so that the light incident surface of the lens member faces the light-exiting surface of the semiconductor laser element (fig. 5-6); and a bonding layer bonding the bonding surface of the lens member and the supporting member together (fig. 5-6, 17; [0043]). Miyajima does not explicitly teach the bonding layer is inorganic. However, the examiner previously took official notice that inorganic bonding layers were well-known in the art before the filing date of the claimed invention. The applicant did not traverse. It is therefore, taken to be admitted prior art. See MPEP 2144.03 C. It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to use a well-known inorganic bonding layer as a simple substitution for the adhesive of Miyajima as the substituted components and their functions were known in the art and the substitution would have yielded predictable results. In the present case, the substituted component provides an alternative bonding material for the lens member. See MPEP 2143 I.B. The embodiment of figs. 5 and 6 does not teach between the light incident surface and the bonding surface, the lens member has a surface extending in a direction intersecting the light incident surface and the bonding surface. However, the embodiment of fig. 16 teaches a light incident surface (large flat surface of 15, 20c; [0060]) and a bonding surface (fig. 16, left vertical side of cutout 22), and therebetween, the lens member has a surface extending in a direction intersecting the light incident surface and the bonding surface (fig. 16, top or bottom surface of cutout 22; [0060]) in order to prevent a spacer from wobbling ([0065]). It would have been obvious to one of ordinary skill in the art to use the bonding surface and surface extending in a direction intersecting the light incident surface and the bonding surface taught in the embodiment of fig. 16 in the embodiment of fig. 5 and 6 in order to prevent a spacer from wobbling. Allowable Subject Matter Claims 1-16 are allowed. The following is a statement of reasons for the indication of allowable subject matter: Claims are allowed based on applicant’s arguments submitted 2/4/2026. Applicant’s arguments with respect to claims 17-18 have been considered but are moot because the new ground of rejection does not rely on any reference applied in the prior rejection of record for any teaching or matter specifically challenged in the argument. Conclusion Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a). A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action. /Michael Carter/ Primary Examiner, Art Unit 2828
Read full office action

Prosecution Timeline

Mar 27, 2023
Application Filed
Nov 01, 2025
Non-Final Rejection — §103
Feb 04, 2026
Response Filed
Mar 10, 2026
Final Rejection — §103 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12603471
APPARATUS AND METHOD FOR ADJUSTING THE WAVELENGTH OF LIGHT
2y 5m to grant Granted Apr 14, 2026
Patent 12597759
COMPONENT WITH STRUCTURED CONNECTION SURFACE, AND METHOD FOR OPERATING A COMPONENT
2y 5m to grant Granted Apr 07, 2026
Patent 12586980
THERMAL MANAGEMENT SYSTEM AND OPTICAL BENCH FOR DIODE LASER DEVICE
2y 5m to grant Granted Mar 24, 2026
Patent 12586972
LASER SYSTEM AND METHOD FOR GENERATING LASER PULSES
2y 5m to grant Granted Mar 24, 2026
Patent 12580362
LIGHT EMITTING MODULE
2y 5m to grant Granted Mar 17, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

AI Strategy Recommendation

Get an AI-powered prosecution strategy using examiner precedents, rejection analysis, and claim mapping.
Powered by AI — typically takes 5-10 seconds

Prosecution Projections

3-4
Expected OA Rounds
74%
Grant Probability
90%
With Interview (+16.1%)
2y 6m
Median Time to Grant
Moderate
PTA Risk
Based on 844 resolved cases by this examiner. Grant probability derived from career allow rate.

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month