Non-Final Rejection
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . This application was filed with claims 1-18.
Applicant’s election without traverse of species D, drawn to the embodiments of Figs. 8-11 and 15, in the reply filed on 3/4/2026 is acknowledged. Applicant asserts that claims 1-9 correspond to this species. The examiner does not necessarily agree, however upon further consideration in light of the search and the burdens found during the search, the restriction requirement is withdrawn to the extent that it restricted among species A-E. The restriction requirement remains applicable to the extent it restricted out species F-H, as those are considered sufficiently different of a search and examination that it remains appropriate. In other words, a divisional application drawn to any of species F-H would be considered consonant to the restriction requirement and would receive the 35 U.S.C. 121 safe harbor against double patenting, but a divisional drawn to any of species A-E would not. This does not substantially alter applicant’s election because claims 1-9 are being examined and species A-E only correspond to those claims; claims 10-18 generally correspond to species F-H. Claims 1-18 are pending and claims 1-9 are subject to examination herein.
Claims 10-18 are withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected invention, there being no allowable generic or linking claim. Again, these generally correspond to species F-H.
Drawings
The drawings are objected to under 37 CFR 1.83(a). The drawings must show every feature of the invention specified in the claims. Here the drawings are not consistent with the claims or with the specification. It appears this may be corrected either by amending the drawings or the specification.
Claim 1 reads as follows, with reference numbers from the specification added in parentheses. As will be seen, these numbers do not match what is shown in the drawings:
1. A laser emission module, comprising:
a laser emitter (11);
a heat conduction substrate (12) comprising a first board surface (123), wherein the first board surface (123) is connected to the laser emitter; and
a first support board (13) comprising a third board surface (131) facing toward the laser emitter, wherein the third board surface has a mounting region (1311), and the heat conduction substrate corresponding to the mounting region is mounted on the first support board.
The first board surface is supposed to be connected to the laser emitter. Element 123 is supposed to be the first board surface, but is only shown in the drawings in Figs. 12 and 13. This element is also clearly not connected to the laser emitter. Additionally, element 123 is discussed extensively as to other figures; it is supposed to be part of Figs. 2, 3, 4, 9, and 10 as well. See [0044], [0059]-[0064]. It is not found in any of these figures. It seems that instead the drawings use 124 for this surface, which is at the top of the heat conduction substrate and thus connected to the laser emitter 11. But the specification calls element 124 the second board surface, and says it is supposed to be “attached to the mounting surface 13111” or “attached to a bottom plane of the recess 13112.” [0073-0074]. Element 124 is also extensively discussed as to Fig. 10, and is supposed to be attached to the heat dissipation structure 21. This is not true of 124, but appears to be true of element 125 as shown in the various figures. Element 125 is called an “abutment structure” in the specification and is only discussed in paragraph [0080], discussing Figs. 12-13, though 125 is found in many of the figures. Paragraph [0080] says the abutment structure 125 is supposed to fit the restrictive portion 13119 of the hole, but this seems more relevant of element 123 as shown in Figs. 12 and 13.
Thus, it seems that the drawings have mixed up elements 123, 124, and 125. In the examiner’s view, as shown in the figures, 124 is the first board surface, 125 is the second board surface, and 123 is the abutment structure. But the specification describes 123 as the first board surface, 124 the second board surface, and 125 the abutment structure. See [0037], various citations above, and other places. Applicant needs to correct either the specification or the drawings so that these are consistent and correct.
It seems that the easiest thing to do is correct the drawings such that the numbers appropriately match up with the disclosure and the claims. Applicant may also correct this issue by amending the specification, ensuring that all instances of these reference numbers are amended to appropriately match what is in the drawings. If the drawings are corrected, corrected drawing sheets in compliance with 37 CFR 1.121(d) are required in reply to the Office action to avoid abandonment of the application. Any amended replacement drawing sheet should include all of the figures appearing on the immediate prior version of the sheet, even if only one figure is being amended. The figure or figure number of an amended drawing should not be labeled as “amended.” If a drawing figure is to be canceled, the appropriate figure must be removed from the replacement sheet, and where necessary, the remaining figures must be renumbered and appropriate changes made to the brief description of the several views of the drawings for consistency. Additional replacement sheets may be necessary to show the renumbering of the remaining figures. Each drawing sheet submitted after the filing date of an application must be labeled in the top margin as either “Replacement Sheet” or “New Sheet” pursuant to 37 CFR 1.121(d). If the changes are not accepted by the examiner, the applicant will be notified and informed of any required corrective action in the next Office action. The objection to the drawings will not be held in abeyance.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1-4 and 6 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by US 2018/0190520 (“Lin”).
Regarding claim 1, Lin discloses in Figs. 1-3 and the discussion thereof starting at [0038] a laser emission module, comprising:
a laser emitter 30;
a heat conduction substrate 20 comprising a first board surface (top of 20), wherein the first board surface is connected to the laser emitter; and
a first support board 10 comprising a third board surface (top of 10) facing toward the laser emitter, wherein the third board surface has a mounting region 12, and the heat conduction substrate corresponding to the mounting region is mounted on the first support board.
Regarding claim 2, as seen in Fig. 3 along a direction parallel to the first board surface, a size of the heat conduction substrate is unequal to a size of the laser emitter, and the difference in size is within a preset range. It is noted that the preset range is not in any way defined or limited in the claim, and no definition should be imported in from the specification. A person of ordinary skill may set the preset range to whatever value they wish, and Lin would then fall within such values. Additionally, along a direction perpendicular to the first board surface, the first board surface (top of 20) is disposed to be flush with the third board surface (top of 10).
Regarding claim 3, heat conduction substrate 20 may be ceramic or aluminum. [0041].
Regarding claim 4, Lin further discloses a first heat conduction member 40, wherein the first heat conduction member is viscous, filled between the laser emitter and the first board surface of the heat conduction substrate, and configured to connect the laser emitter to the heat conduction substrate for transmitting heat of the laser emitter to the heat conduction substrate. It is a metal solder layer, [0042], so it meets the thermal functions and solder may be considered a viscous material, particularly as “viscous” is not in any way defined.
Regarding claim 6, as seen in Fig. 3, the heat conduction substrate further comprises a second board surface (bottom of 20) relative to the first board surface (top of 20), and the first support board further comprises a fourth board surface (bottom of 10) relative to the third board surface (top of 10); and wherein the mounting region (where 20 and 10 meet) is concavely provided with a recess in a direction facing toward the fourth board surface, the recess is a blind recess, the second board surface of the heat conduction substrate is attached to a bottom plane of the recess, and at least part of the heat conduction substrate is embedded in the recess (all clear in Fig. 3).
Claims 1-4 and 6-8 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by US 2016/0141831 (“Li”).
Regarding claim 1, Li discloses in Figs. 3-4 and discussion thereof a laser emission module, comprising:
a laser emitter 120 ([0023]);
a heat conduction substrate 162/172 comprising a first board surface (facing and connected to the laser, 164 or 182), wherein the first board surface is connected to the laser emitter; and
a first support board 110 comprising a third board surface facing toward the laser emitter (bottom of 110, or 112), wherein the third board surface has a mounting region, and the heat conduction substrate corresponding to the mounting region is mounted on the first support board these elements are clearly mounted to each other, see also more specific discussion of mounting region as to claim 6 below).
Regarding claim 2, as seen in Fig. 3 along a direction parallel to the first board surface, a size of the heat conduction substrate is unequal to a size of the laser emitter, and the difference in size is within a preset range. It is noted that the preset range is not in any way defined or limited in the claim, and no definition should be imported in from the specification. A person of ordinary skill may set the preset range to whatever value they wish, and Li would then fall within such values. Additionally, along a direction perpendicular to the first board surface, the first board surface (bottom of 162/172, or 164/182) is disposed to be flush with the third board surface (112).
Regarding claim 3, the heat conduction substrate 162/172 may be ceramic or aluminum. [0021]-[0022].
Regarding claim 4, Li further shows a first heat conduction member 134, wherein the first heat conduction member is viscous, filled between the laser emitter 120 and the first board surface 164/182 of the heat conduction substrate, and configured to connect the laser emitter to the heat conduction substrate for transmitting heat of the laser emitter to the heat conduction substrate. See [0013], which discusses 134 as to Fig. 1, but since it is not discussed later this description would also apply to the same element 134 Figs. 3-4. Element 134 is thermally conductive so it meets the claimed function, and it is an epoxy so it may be considered “viscous” as epoxy is viscous, particularly as the amount of viscosity is not in any way defined.
Regarding claim 6, the heat conduction substrate 162/182 further comprises a second board surface 166/186 relative to the first board surface 164/182, and the first support board further comprises a fourth board surface 114 relative to the third board surface 112; and wherein
the mounting region has a through hole penetrating through the third board surface 112 and the fourth board surface 114, at least part of the heat conduction substrate 162/182 is embedded in the through hole, and the second board surface 166/186 is in one of the following configurations: located inside the through hole, flush with the fourth board surface, or located outside the through hole (all clearly seen in Figs. 3 or 4).
Regarding claim 7, the first through hole limitation is met as in claim 6 above, the second board surface 166/186 of the heat conduction substrate 162/182 comes into contact with a heat dissipation structure 140 via a first heat conduction element 142, the first heat conduction element is configured to transmit heat absorbed by the heat conduction substrate to the heat dissipation structure, and the heat dissipation structure is configured to perform heat dissipation processing on the heat conduction substrate.
Regarding claim 8, as in Fig. 3, the second board surface 166 is flush with the fourth board surface 114, and the heat dissipation structure has a plane structure 142 attached to the second board surface on a side facing toward the second board surface.
Claim Rejections - 35 USC § 103
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
Claim 5 is rejected under 35 U.S.C. 103 as being unpatentable over Lin.
Claim 5 is rejected under 35 U.S.C. 103 as being unpatentable over Li.
Regarding claim 5, neither Lin nor Li state the first heat conduction member is a silver paste. The examiner takes Official Notice that it is well known in the art that a laser and submount may be connected with silver paste. It would have been obvious to a person of ordinary skill in the art to do so as it provides a sufficient connection while also providing some thermal conductivity, which is clearly the point here in Lin and Li. Additionally, it is generally considered obvious to select known materials and use them for their intended purpose. MPEP 2144.07.
Claim 9 is rejected under 35 U.S.C. 103 as being unpatentable over Li in view of US 5,459,639 (“Izumi”).
Li does not show the specifics of the through hole and how the heat conduction substrate relates to it as claimed.
Izumi in Fig. 1 and discussion thereof starting at col. 3 line 25 shows a heat generating element 2A formed on a heat conduction substrate 3, which is in turn mounted on a support board 1. The support board has a through hole with a first sub-hole 1A penetrating through the third board surface (i.e. the top near the heat generating element) and a second sub-hole 1B penetrating through the fourth board surface (i.e. at the bottom), the first sub-hole communicates with the second sub-hole, a diameter of the first sub-hole is greater than a diameter of the second sub-hole to form a stepped structure, and the heat conduction substrate is located in the first sub-hole and supported on a stepped surface of the stepped structure (all clearly seen in Fig. 1). It would have been obvious to a person of ordinary skill in the art to use this configuration as it provides stable and efficient heat radiation without making assembly difficult, as taught by Izumi. Col. 1 lines 60-65. This also provides shoulder parts which are an additional way of mounting the heat conduction substrate to the support board, such as via screws or spring mounts. Col. 4 lines 11-27. Additionally this could be considered the simple substitution of one known element for another to yield predictable results. MPEP 2143 I.B. Li is a similar type of device but has a different type of through hole in which the heat conduction substrate is disposed, but this type of through hole in the support board is found in Izumi. A person of ordinary skill could have used the Izumi style of through hole and the result would have been predictable because it essentially does the same exact thing as in Li—is a place for allowing the heat conduction substrate to be within the support board to conduct heat to the bottom away from the heat generating device.
Conclusion
US 10,785,864 also has a heat generating component on a heat conduction substrate in through holes somewhat similar to claim 9.
JP 2006-066519 and JP 2007-311510 appear to show heat conduction substrates in through holes of support boards that could also meet claim 9.
US 2010/0243872 has a relevant heat conduction substrate.
US 2018/0248336 is also by and similar to Lin.
US 5,172,301 is interesting in having heat conducting members come up through through holes in a support board.
US 6,580,611 also has heat conducting members coming up through holes in a support board.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to James Menefee whose telephone number is (571)272-1944. The examiner can normally be reached M-F 7-4.
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/JAMES A MENEFEE/Primary Examiner, Art Unit 2828