Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
Claim(s) 1,5,15 and 20 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by McNeil (US 2009/0040857).
Regarding claim 1, McNeil discloses an integrated circuit package (¶[0002], 100) comprising: a support device (100, ¶[0013]); first (102, ¶[0015]) and second (106 ¶[0016]) integrated circuits mounted on the support device (100); and a first power jumper circuit (124a, 132a) selectable (a - n) to couple a first decoupling capacitor (128a) to one of a first power supply input of the first integrated circuit or a second power supply input (122) of the second integrated circuit (106).
Regarding claim 5|1, McNeil discloses the integrated circuit package wherein the first decoupling capacitor is an on-package decoupling capacitor (FIG 3).
Regarding claim 15, McNeil discloses a method for selecting (a - n) decoupling capacitance (128a-n) in an integrated circuit package (100), the method comprising:
mounting first (102) and second (106) integrated circuits on a support device (substrate or circuit board, 100) in the integrated circuit package; and
coupling a first decoupling capacitor (128a) to one of a first power supply input of the first integrated circuit or a second power supply input (122) of the second integrated circuit through a first power jumper circuit (124a, 132a).
Regarding claim 20|15, McNeil discloses the method wherein the support device is a package substrate.
Allowable Subject Matter
Claims 10-14 are allowed.
Claims 2-4, 6-9 and 16-19 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
The following is a statement of reasons for the indication of allowable subject matter: none of the cited references discloses nor suggests the claimed invention including “resistor” recited in claims 2-3 and 9; “external terminal” recited in claims 4, 16 and 19; “second power jumper circuit” as set forth in claims 6-8 and 17-18.
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure.
Chun (US 2013/0161788) discloses a semiconductor package including stacked memory chips and a redistribution layer showing external terminals and data and power pads and logic chip and decoupling capacitor.
Sundareswaran (US 2014/0282340) discloses decoupling capacitor in an integrated circuit.
Bartley (US 2009/0179669) discloses switchable decoupling capacitors for an integrated circuit.
Vidhani (US 6,694,499) discloses an integrated circuit selectively establishing connections between decoupling capacitors and driver elements.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to Joseph Chang whose telephone number is (571)272-1759. The examiner can normally be reached M-F 7:00- 17:00.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Menatoallah M Youssef can be reached at 571-270-3684. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/JOSEPH CHANG/Primary Examiner, Art Unit 2836
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