Notice of Pre-AIA or AIA Status
Election/Restrictions
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claims 7-19 are withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected invention, there being no allowable generic or linking claim. Election was made without traverse in the reply filed on 8/12/2026.
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 1-6 and 20 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
Regarding claim 1, it is not clear what the structural relationship is between “a pad” as recited in line 7 of claim 7 and “the first pad” as recited in line 7 of claim 1.
Regarding claim 20, the limitation “the screen” is unclear how it is related the rest of claim 20. Furthermore, there is nothing in the drawing or the specification to allow one to decipher what the screen is. For the rejection the limitation “screen” will not be considered.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1-6 and 20 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Yu et al., US 20220157785.
Regarding claim 1, as best the examiner is able to ascertain the claimed invention, Yu discloses (fig. 7 and related text) a semiconductor assembly (170) comprising: a component (102); a semiconductor die (150, [0011]) having a semiconductor die pad (156’); and a hybrid bond (108, [0017]) connecting the semiconductor die (150) to a substrate (102), wherein the hybrid bond comprises: a via (160) that comprises a metal (164); a pad (114) that comprises a metal [0022] at a first end of the via (bottom of 160), the pad (114) bonded to the semiconductor die pad (156’); a dielectric layer (154) surrounding the pad (156’), the dielectric layer (154) bonded to the semiconductor die (150) around the semiconductor die pad (156’, fig. 7); and a second pad (106’) that comprises a metal [0016] at a second end of the via (fig. 7), the second pad (106’) bonded to the component (102/104).
Regarding claim 2, Yu discloses a dielectric material (158) surrounding the via (portion of the via where 114 is).
Regarding claim 3, Yu discloses the via (162/164), the pad (114), and the second pad (106’) comprise copper ([0014], [0021] and [0022]).
Regarding claim 4, Yu discloses the dielectric layer comprises silicon oxide [0014].
Regarding claim 5, Yu discloses the component (102) comprises a substrate [0013].
Regarding claim 6, Yu discloses the component (102/104) comprises an interconnect ([0014]).
Regarding claim 20, as best the examiner is able to the ascertain the claimed invention, Yu discloses (fig. 7 and related text) a device (170) comprising: a component (104); a semiconductor die (150, [0011]) having a semiconductor die pad (156’); and a hybrid bond (108, [0017]) connecting the semiconductor die (150) to a substrate (102), wherein the hybrid bond (108) comprises: a via (110/160) that comprises a metal (164); a first pad (114) that comprises a metal [0022] at a first end of the via (bottom of 160), the first pad (114) bonded to the semiconductor die pad (156’); a dielectric layer (154) surrounding the first metal pad (114), the dielectric layer (154) bonded to the semiconductor die (150) around the semiconductor die pad (156’); and second pad (106’) that comprises a metal [0017] at a second end of the via (fig. 7), the second pad (106’) bonded to the component (104).
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to SAMUEL A GEBREMARIAM whose telephone number is (571)272-1653. The examiner can normally be reached 8:30-4PM.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Lynne Gurley can be reached at 571-272-1670. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/SAMUEL A GEBREMARIAM/Primary Examiner, Art Unit 2811
