Prosecution Insights
Last updated: August 18, 2026
Application No. 18/212,597

IPC COATING FOR PRINTHEAD

Final Rejection §103
Filed
Jun 21, 2023
Examiner
UHLENHAKE, JASON S
Art Unit
2853
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Fujifilm Holdings Corporation
OA Round
4 (Final)
87%
Grant Probability
Favorable
5-6
OA Rounds
0m
Est. Remaining
85%
With Interview

Examiner Intelligence

Grants 87% — above average
87%
Career Allowance Rate
1037 granted / 1189 resolved
+19.2% vs TC avg
Minimal -2% lift
Without
With
+-2.2%
Interview Lift
resolved cases with interview
Fast prosecutor
2y 2m
Avg Prosecution
34 currently pending
Career history
1213
Total Applications
across all art units

Statute-Specific Performance

§101
1.1%
-38.9% vs TC avg
§103
54.9%
+14.9% vs TC avg
§102
33.3%
-6.7% vs TC avg
§112
6.8%
-33.2% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1189 resolved cases

Office Action

§103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Response to Arguments Applicant’s arguments with respect to claim(s) 1-8, 14-18 have been considered but are moot because the new ground of rejection does not rely on any reference applied in the prior rejection of record for any teaching or matter specifically challenged in the argument. Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claim(s) 1-5, 7-8 is/are rejected under 35 U.S.C. 103 as being unpatentable over Kakiuchi et al (U.S. Pub. 2019/0291437) in view of Chen et al (U.S. Pub. 2018/0281425) and Sung et al (U.S. Pub. 2013/0335483) Regarding claim 1, an ink jet print head or member thereof, comprising: a component (Figures 1-2) having at least one internal cavity for printer ink, the at least one internal cavity accessible during materials processing (Abstract; Paragraphs 0047, 0050) A protective coating (200) on the component and on a surface of the at least one internal cavity, the protective coating comprising a film of HfO2, ZrO2, or TiO2, as a conformal layer (Figures 2, 11; Paragraphs 0066, 0113) Kakiuchi discloses the protective coating (200) comprising a film having a thickness in a range (Paragraph 0067). Kakicuhi does not expressly disclose the film having a thickness in a range that avoids formation of pinholes, thin spots and nodule growth, however Chen (‘425) discloses a film having a thickness in a range that avoids formation of pinholes, thin spots and nodule growth (Paragraph 0021, 0024) Sung discloses a non-wetting coating (NWC) [hydrophobic layer 68; Figures 3A, 4; Paragraphs 0060, 0070] on top of a film of HfO-2 [diffusion barrier layer 64 of hafnium oxide; Figures 3A, 4; Paragraphs 0064] that is on the component and the surface of the at least one internal cavity [Figure 4; Abstract; Paragraphs 0070-0073]. The barrier coating, which includes the hydrophobic layer and the diffusion barrier, covers a surface of the printed circuit substrate and an inner surface and an outer surface of the jet assembly. It would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention to incorporate the teaching of Sung and Chen (‘425) into the device of Kakiuchi, for the purpose of reducing defects in the film and preventing nozzles and allowing the ink to be jetted through a jet without being absorbed by each component Regarding claim 2, wherein the thickness of the film of protective coating is between 10 nm and 50 nm, inclusive (Paragraph 0067) Regarding claim 3, the component includes at least one from a group consisting of: multiple members bonded together with a bonding material, a portion of thermoset, a MEMS die, a wafer having dies attached thereto, a carrier having dies attached thereto, and a flexible circuit board having dies attached to (Paragraph 0065) Regarding claim 4, wherein the bonding material comprises at least one selected from a group that comprises: glue, epoxy, adhesive, solder, and photoresist (Paragraph 0065) Regarding claim 5, the film of HfO2 having at least one aperture exposing a metallic surface of an electrical contact region of the component (Paragraph 0122; surface of the circuit board and the drive circuit are not covered by the protective film) Regarding claims 7-8, Kakiuchi discloses protective coating (200) on a internal cavity, the protective coating comprising a film of HfO2, ZrO2, TiO2, or a chemically resistant oxide or a nitride as a conformal layer (Figures 2, 11; Paragraphs 0066, 0113) Sung discloses a non-wetting coating (NWC) [hydrophobic layer 68; Figures 3A, 4; Paragraphs 0060, 0070] on top of a film of HfO-2 [diffusion barrier layer 64 of hafnium oxide; Figures 3A, 4; Paragraphs 0064] that is on the component and the surface of the at least one internal cavity [Figure 4; Abstract; Paragraphs 0070-0073]. The barrier coating, which includes the hydrophobic layer and the diffusion barrier, covers a surface of the printed circuit substrate and an inner surface and an outer surface of the jet assembly. It would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention to incorporate the teaching of Sung and Chen (‘425) into the device of Kakiuchi, for the purpose of reducing defects in the film and preventing nozzles and allowing the ink to be jetted through a jet without being absorbed by each component Claim(s) 6 is/are rejected under 35 U.S.C. 103 as being unpatentable over Kakiuchi et al (U.S. Pub. 2019/0291437) as modified by Chen et al (U.S. Pub. 2018/0281425) and Sung et al (U.S. Pub. 2013/0335483) and further in view of Silverbrook (U.S. Pub. 2002/0191051) Regarding claim 6, Silverbrook discloses it is known in the art to use gold plated contacts to connect with a circuit board in a print head (Paragraph 0090), therefore it would have been obvious to incorporate gold contacts with the circuit board of Kakiuchi (Kakiuchi: element 121; Paragraph 0073) It would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention to incorporate the teaching of Silverbrook into the device of Kakiuchi as modified by Chen (‘425) and Sung for the purpose of providing data and power to the print head Claim(s) 14-18 is/are rejected under 35 U.S.C. 103 as being unpatentable over Kakiuchi et al (U.S. Pub. 2019/0291437) in view of Chen et al (U.S. Pub. 2018/0281425), Silverbrook (U.S. Pub. 2002/0191051), Sugiura et al (U.S. Pat. 9,604,458) and Sung et al (U.S. Pub. 2013/0335483) Regarding claim 14, an ink jet print head or member thereof, comprising: a component (Figures 1-2) having at least one internal cavity for printer ink, the at least one internal cavity accessible during materials processing (Abstract; Paragraphs 0047, 0050) A protective coating (200) on the component and on a surface of the at least one internal cavity, the protective coating comprising a film of HfO2 as a conformal layer (Figures 2, 11; Paragraphs 0066, 0113) Kakiuchi discloses the protective coating (200) comprising a film having a thickness in a range (Paragraph 0067) and wherein the film has aperture exposing an electrical contact region of the component (Paragraph 0122; surface of the circuit board and the drive circuit are not covered by the protective film) Sugiura discloses a print head with a circuit board and a plurality of wiring members (Figure 5; Column 3, Lines 51-59), therefore it would be obvious to incorporate a print head with a plurality of wiring members which will include a plurality of apertures of the HfO2 film around the wiring members as disclosed by Kakiuchi (Kakiuchi: Paragraph 0122) Silverbrook discloses it is known in the art to use gold plated contacts to connect with a circuit board in a print head (Paragraph 0090), therefore it would have been obvious to incorporate gold contacts with the circuit board of Kakiuchi (Kakiuchi: element 121; Paragraph 0073) Chen (‘425) discloses a film having a thickness in a range that avoids formation of pinholes, thin spots and nodule growth (Paragraph 0021, 0024) Sung discloses a non-wetting coating (NWC) [hydrophobic layer 68; Figures 3A, 4; Paragraphs 0060, 0070] on top of a film of HfO-2 [diffusion barrier layer 64 of hafnium oxide; Figures 3A, 4; Paragraphs 0064] that is on the component and the surface of the at least one internal cavity [Figure 4; Abstract; Paragraphs 0070-0073]. The barrier coating, which includes the hydrophobic layer and the diffusion barrier, covers a surface of the printed circuit substrate and an inner surface and an outer surface of the jet assembly. It would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention to incorporate the teaching of Sugiura, Silverbrook, Sung and Chen (‘425) into the device of Kakiuchi, for the purpose of reducing defects in the film and preventing nozzles and allowing the ink to be jetted through a jet without being absorbed by each component Regarding claim 15, wherein the thickness of the film of protective coating is between 10 nm and 50 nm, inclusive (Paragraph 0067) Regarding claim 16, the component includes at least one from a group consisting of: multiple members bonded together with a bonding material, a portion of thermoset, a MEMS die, a wafer having dies attached thereto, a carrier having dies attached thereto, and a flexible circuit board having dies attached to (Paragraph 0065) Regarding claim 17, wherein the bonding material comprises at least one selected from a group that comprises: glue, epoxy, adhesive, solder, and photoresist (Paragraph 0065) Regarding claim 18, Kakiuchi discloses protective coating (200) on a internal cavity, the protective coating comprising a film of HfO2, ZrO2, TiO2, or a chemically resistant oxide or a nitride as a conformal layer (Figures 2, 11; Paragraphs 0066, 0113) Sung discloses a non-wetting coating (NWC) [hydrophobic layer 68; Figures 3A, 4; Paragraphs 0060, 0070] on top of a film of HfO-2 [diffusion barrier layer 64 of hafnium oxide; Figures 3A, 4; Paragraphs 0064] that is on the component and the surface of the at least one internal cavity [Figure 4; Abstract; Paragraphs 0070-0073]. The barrier coating, which includes the hydrophobic layer and the diffusion barrier, covers a surface of the printed circuit substrate and an inner surface and an outer surface of the jet assembly. It would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention to incorporate the teaching of Sugiura, Silverbrook, Sung and Chen (‘425) into the device of Kakiuchi, for the purpose of reducing defects in the film and preventing nozzles and allowing the ink to be jetted through a jet without being absorbed by each component Conclusion Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a). A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action. Any inquiry concerning this communication or earlier communications from the examiner should be directed to JASON S UHLENHAKE whose telephone number is (571)272-5916. The examiner can normally be reached Monday-Friday, 8:00 am - 5:00 pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Douglas X. Rodriguez can be reached at (571) 431-0716. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /JASON S UHLENHAKE/Primary Examiner, Art Unit 2853 July 21, 2026
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Prosecution Timeline

Show 3 earlier events
Oct 17, 2025
Final Rejection mailed — §103
Jan 16, 2026
Request for Continued Examination
Jan 26, 2026
Response after Non-Final Action
Feb 27, 2026
Non-Final Rejection mailed — §103
May 20, 2026
Examiner Interview Summary
May 20, 2026
Applicant Interview (Telephonic)
May 20, 2026
Response Filed
Jul 23, 2026
Final Rejection mailed — §103 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

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Patent 12691686
INK JET RECORDING METHOD AND INK JET RECORDING APPARATUS
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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

5-6
Expected OA Rounds
87%
Grant Probability
85%
With Interview (-2.2%)
2y 2m (~0m remaining)
Median Time to Grant
High
PTA Risk
Based on 1189 resolved cases by this examiner. Grant probability derived from career allowance rate.

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