CTNF 18/232,681 CTNF 92806 DETAILED ACTION 07-03-aia AIA 15-10-aia The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA. Information Disclosure Statement The Information Disclosure Statement (IDS) filed on 08/10/2023 and 01/29/2025 have been considered. Double Patenting 08-33 AIA The nonstatutory double patenting rejection is based on a judicially created doctrine grounded in public policy (a policy reflected in the statute) so as to prevent the unjustified or improper timewise extension of the “right to exclude” granted by a patent and to prevent possible harassment by multiple assignees. A nonstatutory double patenting rejection is appropriate where the conflicting claims are not identical, but at least one examined application claim is not patentably distinct from the reference claim(s) because the examined application claim is either anticipated by, or would have been obvious over, the reference claim(s). See, e.g., In re Berg , 140 F.3d 1428, 46 USPQ2d 1226 (Fed. Cir. 1998); In re Goodman , 11 F.3d 1046, 29 USPQ2d 2010 (Fed. Cir. 1993); In re Longi , 759 F.2d 887, 225 USPQ 645 (Fed. Cir. 1985); In re Van Ornum , 686 F.2d 937, 214 USPQ 761 (CCPA 1982); In re Vogel , 422 F.2d 438, 164 USPQ 619 (CCPA 1970); In re Thorington , 418 F.2d 528, 163 USPQ 644 (CCPA 1969). A timely filed terminal disclaimer in compliance with 37 CFR 1.321(c) or 1.321(d) may be used to overcome an actual or provisional rejection based on nonstatutory double patenting provided the reference application or patent either is shown to be commonly owned with the examined application, or claims an invention made as a result of activities undertaken within the scope of a joint research agreement. See MPEP § 717.02 for applications subject to examination under the first inventor to file provisions of the AIA as explained in MPEP § 2159. See MPEP §§ 706.02(l)(1) - 706.02(l)(3) for applications not subject to examination under the first inventor to file provisions of the AIA. A terminal disclaimer must be signed in compliance with 37 CFR 1.321(b). The USPTO Internet website contains terminal disclaimer forms which may be used. Please visit www.uspto.gov/patent/patents-forms. The filing date of the application in which the form is filed determines what form (e.g., PTO/SB/25, PTO/SB/26, PTO/AIA/25, or PTO/AIA/26) should be used. A web-based eTerminal Disclaimer may be filled out completely online using web-screens. An eTerminal Disclaimer that meets all requirements is auto-processed and approved immediately upon submission. For more information about eTerminal Disclaimers, refer to www.uspto.gov/patents/process/file/efs/guidance/eTD-info-I.jsp. Claims 1-19 are rejected on the ground of nonstatutory obviousness-type double patenting as being unpatentable over claims of U.S. Patent No. 12,505,951 and co-pending applications 18/825,357 and 18/825,361. Although the claims at issue are not identical, they are not patentably distinct from each other because, all the claimed limitations recited in the present application are transparently found in the US Patent 12,505,951 with obvious wording variations. Take an example of comparing claim (1) of pending application and claim (1) of US Patent 12,505,951: Pending Application (18/232,681) US Patent 12,505,951 1. A magnetic component comprising: a substrate or a lead frame including a primary conductive pattern and a secondary conductive pattern; a magnetic core located on or above of the substrate or the lead frame; a block coil including: a resin body that is located on or above the substrate or the lead frame and that extends over the magnetic core; a first terminal that is on or embedded in the resin body and that is connected to the primary conductive pattern; and a second terminal on or embedded in the resin body and that is connected to the secondary conductive pattern ; and an insulating material covering the substrate or the lead frame, the magnetic core, and the block coil. 1. An electronic module comprising, a substrate or a lead frame including primary conductive patterns and secondary conductive patterns; a magnetic core located on or above of the substrate or the lead frame; a block coil including: a resin body that is located on or above the substrate or the lead frame and that extends over the magnetic core ; first terminals that define a first terminal group and that are on or embedded in the resin body ; and second terminals that define a second terminal group and that on or are embedded in the resin body ; an IC located on the substrate or the lead frame; and a capacitor located on the substrate or the lead frame; wherein two first terminals of the first terminal group are connected to corresponding primary conductive patterns; two second terminals of the second terminal group are connected corresponding secondary conductive patterns; and a first primary conductive pattern is closer to a second primary conductive pattern than any of the secondary conductive patterns. Claim 7 (original): The electronic module according to Claim 1, further comprising an insulating material covering the substrate or the lead frame, the magnetic core, and the block coil . The claims of the application (18/232,681) encompass the same subject matter except the instant claims are broader and fully encompass the US Patent 12,505,951. Specifically, application 18/232,681 discloses “ a first terminal that is on or embedded in the resin body and that is connected to the primary conductive pattern ” whereas US Patent 12,505,951 claims include “ first terminals that define a first terminal group and that are on or embedded in the resin body ”. The aforementioned omissions, however, do not entirely change the results of each invention and both inventions, minus stated variations, have the same purpose and provide the same results. Pertinent Prior Art 07-96 AIA The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Tang et al. (US 20220028593) and Dirks (US4975671) . Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to MALCOLM BARNES whose telephone number is (408)918-7512. The examiner can normally be reached M-F 7:30-5:00 pm (PST). Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Shawki Ismail can be reached on 571-272-3985. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /MALCOLM BARNES/ Primary Examiner, Art Unit 2837 6/13/2026 Application/Control Number: 18/232,681 Page 2 Art Unit: 2837
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