Prosecution Insights
Last updated: April 19, 2026
Application No. 18/239,324

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

Final Rejection §102§103
Filed
Aug 29, 2023
Examiner
DUONG, DIEU HIEN
Art Unit
2845
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Amkor Technology Singapore Holding Pte. Ltd.
OA Round
6 (Final)
78%
Grant Probability
Favorable
7-8
OA Rounds
2y 9m
To Grant
95%
With Interview

Examiner Intelligence

Grants 78% — above average
78%
Career Allow Rate
803 granted / 1028 resolved
+10.1% vs TC avg
Strong +17% interview lift
Without
With
+17.0%
Interview Lift
resolved cases with interview
Typical timeline
2y 9m
Avg Prosecution
23 currently pending
Career history
1051
Total Applications
across all art units

Statute-Specific Performance

§101
0.2%
-39.8% vs TC avg
§103
49.1%
+9.1% vs TC avg
§102
31.4%
-8.6% vs TC avg
§112
15.9%
-24.1% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1028 resolved cases

Office Action

§102 §103
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claims 2, 6-10 and 14-17 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Chen (CN 208938923). PNG media_image1.png 340 736 media_image1.png Greyscale Regarding claims 2 and 10, Chen discloses in Figure 15, a semiconductor device, comprising: a substrate (103) comprising a top side and a bottom side, a substrate dielectric structure (113), and a substrate conductive structure (portions of 123 in 113), wherein the bottom side is an external side of the substrate (103); an electronic component (107) over the top side of the substrate (103) and coupled with the substrate conductive structure (portions of 123 in 113); an interconnect structure (106) on the top side of the substrate (103) and coupled with the substrate conductive structure (portions of 123 in 113), wherein the interconnect structure (106) is external to the substrate (103) and entirely outside a footprint of the electronic component (107); a first antenna conductive structure (124, 125, 144, portions of 123 on bottom surface of 113) external to the substrate (103) and below the bottom side of the substrate (103) and coupled with the substrate conductive structure; and a first antenna pattern (145) below the bottom side of the substrate (103) and coupled with the first antenna conductive structure (124, 125, 144, portions of 123 on bottom surface of 113); wherein the first antenna conductive structure (124, 125, 144, horizontal portions of 123 on bottom surface of 113) comprises a first plurality of horizontal traces (144, portion of 123 on bottom surface of 113) and a first plurality of vertical vias (124, 125), and wherein a first vertical via (125) is above a second vertical via (124), and a first horizontal trace (144) is coupled between the first vertical via (125) and the second vertical via (124); wherein the first antenna conductive structure (124, 125, 144, horizontal portions of 123 on bottom surface of 113) has a first width and the first antenna pattern (145) has a second width greater than the first width; and wherein the interconnect structure (106) is within a footprint of the first antenna pattern (145). Regarding claims 6-8 and 14-16, as applied to claims 2 and 10, Chen discloses in Figure 15, wherein: the first antenna pattern (145) is configured to radiate in a direction perpendicular to the bottom side of the substrate (103); an insulating body (134) surrounding the first antenna conductive structure; a second antenna conductive structure (see Fig. 15) external to the substrate (103) and below the bottom side of the substrate (103) and coupled with the substrate conductive structure, wherein the second antenna conductive structure comprises a second plurality of horizontal traces and a second plurality of vertical vias; and a second antenna pattern (145) below the bottom side of the substrate (103) and coupled with the second antenna conductive structure. Regarding claims 9 and 17, as applied to claim 2 and 10, Chen discloses in Figure 15, wherein: the first antenna conductive structure comprises a horizontal conductive structure and a vertical conductive structure. Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claims 4-5 and 12-13 are rejected under 35 U.S.C. 103 as being unpatentable over Chen (CN 208938923) in view of Ueda (US 2020/0035626). Regarding claims 4 and 12, Chen discloses every feature of claimed invention as expressly recited in claim 2 and 10, except for a shield covering the electronic component. Ueda discloses in Figure 1a, a shield covering (20a) the electronic component (13). It would have been obvious to one having ordinary skill in the art before the effective filing date of the claimed invention to modify the electronic component of Chen with the electronic component having a shield as taught by Ueda to reduce electrical noise from affecting the signals and reduce electromagnetic radiation that may interfere with other devices. Therefore, to employ having a shield as claimed invention would have been obvious to person skill in the art. Regarding claims 5 and 13, Chen discloses every feature of claimed invention as expressly recited in claims 2 and 10, except for the first antenna pattern configured to radiate in a direction parallel to the bottom side of the substrate. Ueda discloses in Figure 2, the first antenna pattern (36) configured to radiate in a direction parallel to the bottom side of the substrate. It would have been obvious to one having ordinary skill in the art before the effective filing date of claimed invention to modify the first antenna pattern of Chen with the antenna pattern having radiating direction as taught by Ueda by changing or rearranging direction of the antenna pattern to radiate electromagnetic wave in horizontal polarization or in direction parallel to bottom surface of the substrate. Therefore, to employ having the first antenna pattern as claimed invention would have been obvious to person skill in the art. Response to Arguments Applicant’s arguments with respect to claims 2-10, and 12-17 have been considered but are moot because the new ground of rejection does not rely on any reference applied in the prior rejection of record for any teaching or matter specifically challenged in the argument. Conclusion Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a). A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action. Inquiry Any inquiry concerning this communication or earlier communications from the examiner should be directed to DIEU HIEN T DUONG whose telephone number is (571)272-8980. The examiner can normally be reached 8:00am-4:00pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, DIMARY CRUZ LOPEZ can be reached at 571-270-7893. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /DIEU HIEN T DUONG/Primary Examiner, Art Unit 2845
Read full office action

Prosecution Timeline

Aug 29, 2023
Application Filed
Mar 19, 2024
Non-Final Rejection — §102, §103
Jun 13, 2024
Response Filed
Oct 01, 2024
Final Rejection — §102, §103
Dec 05, 2024
Request for Continued Examination
Dec 10, 2024
Response after Non-Final Action
Dec 14, 2024
Non-Final Rejection — §102, §103
Mar 28, 2025
Response Filed
Jun 19, 2025
Final Rejection — §102, §103
Aug 20, 2025
Request for Continued Examination
Aug 22, 2025
Response after Non-Final Action
Sep 02, 2025
Non-Final Rejection — §102, §103
Nov 12, 2025
Response Filed
Feb 03, 2026
Final Rejection — §102, §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

7-8
Expected OA Rounds
78%
Grant Probability
95%
With Interview (+17.0%)
2y 9m
Median Time to Grant
High
PTA Risk
Based on 1028 resolved cases by this examiner. Grant probability derived from career allow rate.

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