Office Action Predictor
Last updated: April 15, 2026
Application No. 18/243,077

DISK DEVICE

Non-Final OA §103
Filed
Sep 06, 2023
Examiner
SAWYER, STEVEN T
Art Unit
2847
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Toshiba Electronic Devices & Storage Corporation
OA Round
1 (Non-Final)
72%
Grant Probability
Favorable
1-2
OA Rounds
2y 4m
To Grant
99%
With Interview

Examiner Intelligence

Grants 72% — above average
72%
Career Allow Rate
733 granted / 1017 resolved
+4.1% vs TC avg
Strong +27% interview lift
Without
With
+27.3%
Interview Lift
resolved cases with interview
Typical timeline
2y 4m
Avg Prosecution
42 currently pending
Career history
1059
Total Applications
across all art units

Statute-Specific Performance

§101
0.1%
-39.9% vs TC avg
§103
60.4%
+20.4% vs TC avg
§102
26.9%
-13.1% vs TC avg
§112
10.6%
-29.4% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1017 resolved cases

Office Action

§103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claim(s) 1, 2, 5 and 10-12 is/are rejected under 35 U.S.C. 103 as being unpatentable over Wakaki et al. (US PG. Pub. 2004/0246626) in view of Sato (US PG. Pub. 2021/0090595). Regarding claim 1 – Wakaki teaches a disk device (figs. 1-2 [paragraph 0024] Wakaki states, “a relay flexible wiring circuit board 1 is a flexible wired circuit board used for connecting between a long-tail type suspension board with circuit 3 equipped with a magnetic head 2 of a hard disk drive”) comprising: a first flexible printed circuit board (1) including a first insulating layer (18 [paragraph 0031] Wakaki states, “insulating base layer 18”), a second insulating layer (20 [paragraph 0031] Wakaki states, “insulating cover layer 20”) covering the first insulating layer (18), a first conductive layer (19 [paragraph 0031] Wakaki states, “conductor layer 19”) between the first insulating layer (18) and the second insulating layer (20), the first conductive layer (19) being provided with a plurality of first terminals (11/13 [paragraph 0030 & 0033] Wakaki states, “terminal portion 11…terminal portions 13”), the second insulating layer (20) being provided with a plurality of holes (figure 2 shows solder bumps 26 within the holes of the second insulating layer 20) through which the plurality of first terminals (11/13) is exposed; and a second flexible printed circuit board (3 [Abstract] Wakaki states, “suspension board with circuit 3”) having a magnetic head (2 [paragraph 0024] Wakaki states, “magnetic head 2”) mounted thereon and includes: a first face (bottom face) facing the second insulating layer (20), a second face (top face) being opposite the first face, and a plurality of second terminals (12 [paragraph 0034] Wakaki states, “terminal portion 12”) provided on the first face (bottom face) and joined to the plurality of first terminals (11/13), respectively, with a conductive bonding material (26 [paragraph 0034] Wakaki states, “solder bumps 26”). Wakaki fails to teach a plurality of second flexible printed circuit boards each of which has a magnetic head mounted thereon; and wherein the second face of at least one of the plurality of second flexible printed circuit boards includes a first area being lower in lightness than a part of the first flexible printed circuit board, the part where the first conductive layer is covered by the second insulating layer. Sato teaches a disk device (figs. 1-6 [title] Sato states, “Disk Device”) having a plurality of flexible printed circuit boards (fig. 2, 43 [paragraph 0029] Sato states, “flexure 43”) each of which has a magnetic head (15 [paragraph 0031] Sato states, “magnetic heads 15”) mounted thereon; and wherein a second face (top face of second flexible printed circuit board 19) of at least one of the plurality of second flexible printed circuit boards (19 [paragraph 0012] Sato states, “FPC 19”) includes a first area being lower in lightness ([paragraph 0086] Sato states, “The joint 61 may include another dark-color layer or layers instead of the second ground planes 92. For example, the darker-color part of the base layer 19b than the rest thereof may be spaced apart from at least one of the pads 73 in a direction along the surface 71 and cover at least another one of the of pads 73 in the Z direction”) than a part of the flexible printed circuit board (43), the part where the first conductive layer (56 [paragraph 0034] Sato states, “wires 56 are laid on a conductive layer of the flexure 43”) is covered by the second insulating layer ([paragraph 0029] Sato states, “a conductive layer constituting a plurality of wires (wiring patterns) on the insulating layer, and a protective layer (insulating layer) covering the conductive layer”). It would have been obvious to a person having ordinary skill in the art before the effective filling date of the claimed invention to modify the disk device having a first and second flexible printed circuit boards connected via terminals as taught by Wakaki with the plurality of second flexible PCBs and magnetic heads having an area lower in lightness than the first flexible PCB as taught by Sato because Sato states regarding this feature, “The dark-colored parts are readily heated by means of a laser beam, for example, due to a high absorbance. By placing the second ground planes 92 away from the not-readily coolable pads 73 to cover the readily coolable pads 73, for example, the temperature of the solder 77 on the pads 73 can be adjusted at the time of connecting the pads 73 to the pads 55 by means of the solder 77 fused by a laser beam. Thus, according to the HDD 1 of the present embodiment, the FPC 19 is readily adjustable in temperature at the time of connecting the pads 55 and 73. This can avoid degradation of the quality of the FPC 19, such as a loose connection or the delamination.” [paragraph 0114]. Regarding claim 2 – Wakaki in view of Sato teach the disk device according to claim 1, wherein the second face of at least one of the plurality of second flexible printed circuit boards (Sato; fig. 2, 19) includes a second area (area shown outside of second terminals 73) spaced farther from the plurality of second terminals (73) than the first area, and the second area is higher in lightness than the first area ([paragraph 0102] Wakaki states, “In the FPC 19, the part having the second ground planes 92 mounted thereon have a darker color and a higher absorbance than the rest”). Regarding claim 5 - Wakaki in view of Sato teach the disk device according to claim 1, wherein at least one of the plurality of second flexible printed circuit boards (Sato; figs. 1-6, 19) includes: a first part (part shown having terminals 73) including the plurality of second terminals (73), and a second part (area outside of terminals 73) located outside the first part apart from the plurality of second terminals (73), the second part includes the first area, and in the first part, the second face is higher in lightness than the first area ([paragraph 0086] Sato states, “The joint 61 may include another dark-color layer or layers instead of the second ground planes 92. For example, the darker-color part of the base layer 19b than the rest thereof may be spaced apart from at least one of the pads 73 in a direction along the surface 71 and cover at least another one of the of pads 73 in the Z direction”). Regarding claim 10 - Wakaki in view of Sato teach the disk device according to claim 1, wherein the first area is lower in lightness (Sato; figs. 1-6 [paragraph 0086] Sato states, “The joint 61 may include another dark-color layer or layers instead of the second ground planes 92. For example, the darker-color part of the base layer 19b than the rest thereof may be spaced apart from at least one of the pads 73 in a direction along the surface 71 and cover at least another one of the of pads 73 in the Z direction”) than the second face of one of the plurality of second flexible printed circuit boards (19). Regarding claim 11 – Wakaki in view of Sato teach the disk device according to claim 1, wherein each of the plurality of second flexible printed circuit boards (Sato; fig. 2, 43) includes a metal plate ([paragraph 0029] Sato states, “The flexure 43 is a multilayered plate including a metal sheet (backing layer) as stainless steel”) including at least a part of the second face (upper surface having backing layer), and the metal plate is provided with the first area (claimed structure described in paragraphs 0028-0029). Regarding claim 12 – Wakaki in view of Sato teach the disk device according to claim 11, wherein the first area is provided on the entire second face of the metal plate (Sato; figs. 1-6, metal sheet backing layer is considered to extend along the entire length of the flexible printed circuit boards 43 and will meet the claimed limitation). Allowable Subject Matter Claim 15 is allowed. Claims 3-4, 6-9 and 13-14 objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Momose et al. (US PG. Pub. 2020/0154577) discloses a circuit board with a darker area. Asano (US Patent 6396665) discloses a head suspension assembly with a bonded connection between boards. Any inquiry concerning this communication or earlier communications from the examiner should be directed to STEVEN T SAWYER whose telephone number is (571)270-5469. The examiner can normally be reached M-F 8:30 am - 5pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Timothy Thompson can be reached at 5712722342. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /STEVEN T SAWYER/Primary Examiner, Art Unit 2847
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Prosecution Timeline

Sep 06, 2023
Application Filed
Dec 17, 2025
Non-Final Rejection — §103
Mar 31, 2026
Response Filed

Precedent Cases

Applications granted by this same examiner with similar technology

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CABLE TRAY ASSEMBLY WITH SPLICE PLATE ASSEMBLY AND BONDING JUMPER
2y 5m to grant Granted Mar 10, 2026
Patent 12563666
METAL SHEET MATERIAL, LAYERED BODY, INSULATED CIRCUIT BOARD, AND METAL SHEET MATERIAL MANUFACTURING METHOD
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TYPE-3 PRINTED CIRCUIT BOARDS (PCBS) WITH HYBRID LAYER COUNTS
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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
72%
Grant Probability
99%
With Interview (+27.3%)
2y 4m
Median Time to Grant
Low
PTA Risk
Based on 1017 resolved cases by this examiner. Grant probability derived from career allow rate.

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