Prosecution Insights
Last updated: April 19, 2026
Application No. 18/249,003

ELECTRICAL CONNECTING DEVICE AND METHOD FOR MANUFACTURING ELECTRICAL CONNECTING DEVICE

Non-Final OA §103
Filed
Apr 13, 2023
Examiner
LE, SON T
Art Unit
2858
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Kabushiki Kaisha Nihon Micronics
OA Round
3 (Non-Final)
82%
Grant Probability
Favorable
3-4
OA Rounds
2y 9m
To Grant
97%
With Interview

Examiner Intelligence

Grants 82% — above average
82%
Career Allow Rate
544 granted / 662 resolved
+14.2% vs TC avg
Moderate +15% lift
Without
With
+14.6%
Interview Lift
resolved cases with interview
Typical timeline
2y 9m
Avg Prosecution
16 currently pending
Career history
678
Total Applications
across all art units

Statute-Specific Performance

§101
4.9%
-35.1% vs TC avg
§103
48.6%
+8.6% vs TC avg
§102
27.3%
-12.7% vs TC avg
§112
13.5%
-26.5% vs TC avg
Black line = Tech Center average estimate • Based on career data from 662 resolved cases

Office Action

§103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Continued Examination Under 37 CFR 1.114 A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after final rejection. Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, the finality of the previous Office action has been withdrawn pursuant to 37 CFR 1.114. Applicant's submission filed on 12/05/25 has been entered. Response to Amendment Applicant's Amendment and Response filed 12/05/2025 has been entered and made of record. This application contains xx pending claims. Claims 1, 12 and 14 have been amended. Response to Arguments Applicant’s amend claim 1 to include the allowable subject matter indicated in previous action (5/27/25). However, Further consideration, examiner regretfully withdraw the allowable subject matter and allowable claim 11 based on a new found reference DOBASHI et al. (US 20200269315) which discloses “water-soluble resin include polyvinyl alcohol, polyacrylic acid, polyacrylamide, polyvinyl pyrrolidone, polyethylene oxide, and methylcellulose. Among these, a water-soluble resin is preferable and polyvinyl alcohol is more preferable”. Since Mori discloses the oxide film 40 is removeable by chemical etch, therefore a POSITA can use either oxide or polyvinyl alcohol. Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claim(s) 1-2, 4-6, 11-20 is/are rejected under 35 U.S.C. 103 as being unpatentable over Mori, and further in view of DOBASHI et al. (US 20200269315, hereinafter DOBASHI). Regarding to claim 1, Mori discloses an electrical connecting device (fig. 1 shows probe card included a guide unit 21) comprising: a first guide plate (fig. 8s[31A]) having a first guide hole (fig. 6,8s[33]); a second guide plate (fig. 8s[31B]) having a second guide hole (fig. 6,8s[33]); and an introduction film (fig. 3 shows guide unit include film 40 as shown in fig. 8) arranged between the first guide plate (fig. 6,8c[31A]) and the second guide plate (fig. 6,8[31B]) and having an introduction guide hole (fig. 8 shows hole 32 coated with layer 40 as introduction guide hole); and a probe extending through the first guide hole, the introduction guide hole, and the second guide hole (fig. 1-2 show pin 20 extended through the guide unit 21 and fig. 8 shows the guide unit 21 included a film 40 being selectively removed by chemical etching. Therefore, probe 20 would extending through the first guide hole, the introduction guide hole, and the second guide hole); wherein the introduction film is formed from a material dissolved by a specific solvent that does not dissolve the first guide plate, the second guide plate, and the probe (fig. 8 shows the oxide film 40 is selectively removed by chemical etching while not dissolve the first guide plate, the second guide plate, and the probe). PNG media_image1.png 356 714 media_image1.png Greyscale However, Mori does not disclose wherein the introduction film is formed from a material that is any of polyvinyl alcohol, starch, and gelatin. DOBASHI discloses the water-soluble resin include polyvinyl alcohol, polyacrylic acid, polyacrylamide, polyvinyl pyrrolidone, polyethylene oxide, and methylcellulose. Among these, a water-soluble resin is preferable and polyvinyl alcohol is more preferable. Therefore, at the time before the effective filing date, it would be obvious to a POSITA to use polyvinyl alcohol instead of oxide film as a matter of design choice. Regarding to claim 2, Mori in view of DOBASHI discloses the electrical connecting device according to claim 1, wherein the first guide plate (fig. 8[31A]), the second guide plate (fig. 8[31B]), and the introduction film (fig. 6[40]) are arranged such that central axes of the first guide hole (fig. 8 show first guide hole as a center hold of [31A]), the second guide hole (fig. 8 show second guide hole as a center hold of [31B]), and the introduction guide hole conform to each other (fig. 8 shows the center guide holes and the hole form the spacer 32 conform to each other). Regarding to claim 4, Mori in view of DOBASHI discloses the electrical connecting device according to claim 1, further comprising a spacer configured to not be dissolved by the specific solvent (fig. 6-8 show the spacer 32 does not dissolved by chemical etching of film 40), the spacer (fig. 6-8 show the spacer 32) being arranged between an outer circumferential part of the first guide plate (fig. 6-8 (31A)) and an outer circumferential part of the second guide plate (fig. 6-8 (31B)), wherein the introduction film is arranged in a hollow region defined by the spacer between the first guide plate and the second guide plate (see fig. 6-8 shows film 40 is arranged in a hollow region). Regarding to claim 5, Mori in view of DOBASHI discloses the electrical connecting device according to claim 4, wherein an outer circumferential part of the introduction film is interposed between partial spacers composing the spacer (see fig. 6). Regarding to claim 6, Mori in view of DOBASHI discloses the electrical connecting device according to claim 1, wherein the electrical connecting device comprises a plurality of the introduction films arranged separately from each other between the first guide plate and the second guide plate (fig. 6 shows oxide film 40 form on top and bottom of spacer 32 creates a plurality of films 40). Regarding to claim 12, Mori in view of DOBASHI discloses the electrical connecting device according to claim 1, wherein: the introduction film has a first introduction guide hole and a second introduction guide hole (fig. 8 shows film 40 with multiple guide hole); the probe is a first probe (fig. 1-2 show plurality probes thus there is a first probe among probes); the electrical connecting device further comprises a second probe fig. 1-2 show plurality probes thus there is a second probe among probes); and a respective probe extends through each introduction guide hole (fig. 1-2 show multiple probes through the guide unit 21 which includes film 40). Regarding to claim 13, Mori in view of DOBASHI discloses the electrical connecting device according to claim 12, wherein: the first guide plate has two first guide holes (fig. 4 shows plate 31A with plurality guide holes 33 thus there are two guide holes in the first guide plate); the second guide plate has two second guide holes (fig. 4 shows plate 31B with plurality guide hole 33 thus there are two guide holes in the second guide plate); and a respective probe extends through each first guide hole, introduction guide hole, and second guide hole (fig. 1-2 shows plurality probes through the guide unit 21 which includes first and second guide plates). Regarding to claim 14, Mori in view of DOBASHI discloses the electrical connecting device according to claim 1, wherein: the probe is a first probe; the electrical connecting device further comprises a second probe; (fig. 1-2 show plurality probes thus there are first and second probes); the first guide plate has two first guide holes and includes a first middle portion located between the two first guide holes (fig. 4 shows plate 31A with plurality guide holes 33 thus there are two guide holes in the first guide plate and the two holes are separated by a middle portion); the second guide plate has two second guide holes and includes a second middle portion located between the two second guide holes (fig. 4 show plate 31B with plurality guide holes 33 thus there are two guide holes in the second guide plate and the two holes are separated by a middle portion); a portion of the introduction film is located directly between the first middle portion and the second middle portion (fig. 8C shows film 40 surrounded the first and second guide plates); and a respective probe extends through each first guide hole, introduction guide hole, and second guide hole (fig. 1-2 shows plurality probes through the guide unit 21 which includes first and second guide plates). Regarding to claim 15, Mori in view of DOBASHI discloses the electrical connecting device according to claim 1, wherein: the first guide plate has two first guide holes and includes a first middle portion located between the two first guide holes (fig. 4 shows plate 31A with plurality guide holes 33 thus there are two guide holes in the first guide plate and the two holes are separated by a middle portion); the second guide plate has two second guide holes and includes a second middle portion located between the two second guide holes (fig. 4 shows plate 31B with plurality guide holes 33 thus there are two guide holes in the second guide plate and the two holes are separated by a middle portion); and a portion of the introduction film is located directly between the first middle portion and the second middle portion (fig. 8C shows film 40 surrounded the first and second guide plates). Regarding to claim 16, Mori in view of DOBASHI discloses the electrical connecting device according to claim 1, wherein: the introduction film has a first surface and an opposite second surface (fig. 8C shows film 40 with two opposite faces); the introduction guide hole extends from the first surface to the second surface (fig. 8C shows film 40 with two opposite faces and holes extended through the two faces); the first surface is uncovered adjacent to the introduction guide hole (fig. 8C); and the second surface is uncovered the introduction guide hole (fig. 8C). Regarding to claim 17, Mori in view of DOBASHI discloses the electrical connecting device according to claim 1, wherein: a hollow region is defined between the first guide plate and the second guide plate; and the introduction film spans across the hollow region (fig. 3-8 shows a hollow region 32S). Regarding to claim 18, Mori in view of DOBASHI discloses the electrical connecting device according to claim 1, wherein: a hollow region is defined between the first guide plate and the second guide plate; and the introduction film spans across the hollow region to divide a first portion of the hollow region from a second portion of the hollow region; and the introduction guide hole interconnects the first portion of the hollow region and the second portion of the hollow region (fig. 3-8 show a hollow region 32S between the first and first and second guide plates and the introduction guide hole). Regarding to claim 19, Mori in view of DOBASHI discloses the electrical connecting device according to claim 1, wherein: the probe comprises a plurality of probes (fig. 1-2 show plurality probes); the first guide plate has a plurality of first guide holes (fig. 4 shows plate 31A with plurality guide holes 33); the second guide plate has a plurality of second guide holes (fig. 4 shows plate 31B with plurality guide holes 33); and the introduction film has a plurality of introduction guide holes (fig. 8C shows film 40 with plurality guide holes); wherein each probe in the plurality of probes extends through a respective first guide hole, a respective introduction guide hole, and a respective second guide hole (fig. 1-2 show plurality probes through the guide unit 21 which includes first and second guide plates). Regarding to claim 20, Mori in view of DOBASHI discloses the electrical connecting device according to claim 19, wherein each introduction guide hole receives a single probe from the plurality of probes (fig. 1-2 show each probe inserted to corresponding hole). Regarding to claim 11, Mori discloses a method of manufacturing an electrical connecting device (abstract discloses to provide a manufacturing method of a probe card), comprising: preparing a probe head including a first guide plate (fig. 6-8[31A]) having a first guide hole (fig. 6-8[33]), a second guide plate (fig. 6-8[31B]) having a second guide hole (fig. 6-8[33]), and an introduction film having an introduction guide hole (fig. 8C shows 32 coated with layer 40 as introduction guide hole) and arranged between the first guide plate (fig. 6-8[31A]) and the second guide plate (fig. 6-8[31B]); continuously inserting a probe (fig. 1-2 shows pin 20) through the first guide hole, the introduction guide hole (pin 20 is inserted through hole 33 of first and second guide plates), and the second guide hole; and dissolving the introduction film by a specific solvent that does not dissolve the first guide plate, the second guide plate, and the probe (fig. 8 shows the oxide film 40 is selectively removed by chemical etching while not dissolve the first guide plate, the second guide plate, and the probe). However, Mori does not disclose, wherein the introduction film is formed from a material that is any of polyvinyl alcohol, starch, and gelatin. DOBASHI discloses the water-soluble resin include polyvinyl alcohol, polyacrylic acid, polyacrylamide, polyvinyl pyrrolidone, polyethylene oxide, and methylcellulose. Among these, a water-soluble resin is preferable and polyvinyl alcohol is more preferable. Therefore, at the time before the effective filing date, it would be obvious to a POSITA to use polyvinyl alcohol instead of oxide film as a matter of design choice. Claim(s) 3 is/are rejected under 35 U.S.C. 103 as being unpatentable over Mori in view of DOBASHI as applied to claim 1 above, and further in view of Ahn. Regarding to claim 3, Mori in view of DOBASHI discloses the electrical connecting device according to claim 1. Mori in view of DOBASHI does not disclose wherein a relative position of the second guide hole with respect to the first guide hole is allowed to be shifted in a direction perpendicular to an extending direction of the probe. Fig. 6-7 of Ahn shows a probe card with first and second guide plates each guide plate has corresponding guide hole and is allowed to be shifted in a direction perpendicular to an extending direction of the probe. Therefore, at the time before the effective filing date, it would be obvious to a POSITA to incorporate the design of Ahn into Mori in view of DOBASHI in order to improve surface strength, and prevent a problem of warpage deformation due to heat under a high-temperature atmosphere. Allowable Subject Matter Claims 7-11 are allowed. Regarding to claim 7, Mori discloses a method of manufacturing an electrical connecting device (abstract discloses to provide a manufacturing method of a probe card), comprising: preparing a probe head including a first guide plate (fig. 6-8[31A]) having a first guide hole (fig. 6-8[33]), a second guide plate (fig. 6-8[31B]) having a second guide hole (fig. 6-8[33]), and an introduction film (fig. 6 shows film 40) having an introduction guide hole (fig. 6[32S] as the hole of spacer 32 interpreted as introduction guide hole) and arranged between the first guide plate (fig. 6-8[31A]) and the second guide plate (fig. 6-8[31B]); continuously inserting a probe (fig. 1-2 shows pin 20) through the first guide hole, the introduction guide hole, and the second guide hole (pin 20 is inserted through hole 33 of first and second guide plates and the hole 32S of spacer 32); and dissolving the introduction film by a specific solvent that does not dissolve the first guide plate, the second guide plate, and the probe (fig. 8 shows the oxide film 40 is selectively removed by chemical etching while not dissolve the first guide plate, the second guide plate, and the probe). However, the prior arts of record, alone or in combination, do not teach or suggest “after continuously inserting the probe through the first guide hole, the introduction guide hole, and the second guide hole” including all limitations as claimed. Claims 8-10 are allowed for dependent upon claim 7. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to SON T LE whose telephone number is (571)270-5818. The examiner can normally be reached M to F, 7AM - 4PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, CATHERINE T RASTOVSKI can be reached at (571)270-0349. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /SON T LE/Primary Examiner, Art Unit 2863
Read full office action

Prosecution Timeline

Apr 13, 2023
Application Filed
May 22, 2025
Non-Final Rejection — §103
Aug 26, 2025
Response Filed
Sep 04, 2025
Final Rejection — §103
Dec 05, 2025
Request for Continued Examination
Dec 09, 2025
Response after Non-Final Action
Dec 16, 2025
Non-Final Rejection — §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

3-4
Expected OA Rounds
82%
Grant Probability
97%
With Interview (+14.6%)
2y 9m
Median Time to Grant
High
PTA Risk
Based on 662 resolved cases by this examiner. Grant probability derived from career allow rate.

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