Prosecution Insights
Last updated: July 17, 2026
Application No. 18/283,276

NOZZLE PLATE MANUFACTURING METHOD, NOZZLE PLATE, AND FLUID EJECTION HEAD

Non-Final OA §102
Filed
Jul 16, 2024
Priority
Mar 31, 2021 — nonprovisional of PCTJP2021013756
Examiner
SHENDEROV, ALEXANDER D
Art Unit
2853
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Konica Minolta Inc.
OA Round
1 (Non-Final)
90%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
96%
With Interview

Examiner Intelligence

Grants 90% — above average
90%
Career Allowance Rate
800 granted / 887 resolved
+22.2% vs TC avg
Moderate +6% lift
Without
With
+6.2%
Interview Lift
resolved cases with interview
Fast prosecutor
1y 7m
Avg Prosecution
19 currently pending
Career history
900
Total Applications
across all art units

Statute-Specific Performance

§101
0.9%
-39.1% vs TC avg
§103
70.3%
+30.3% vs TC avg
§102
13.8%
-26.2% vs TC avg
§112
11.5%
-28.5% vs TC avg
Black line = Tech Center average estimate • Based on career data from 887 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Response to Amendment Acknowledgement is made of the receipt of Preliminary Amendment filed 21 September 2023. Priority Acknowledgment is made of applicant’s claim for priority a national stage application under 35 U.S.C. 371. The requirements 35 U.S.C. 371 are met. Information Disclosure Statement The references cited on a Form PTO 1449 have been considered. Specification The specification has been checked to the extent necessary to determine the presence of all possible minor errors. However, the applicant's cooperation is requested in correcting any errors of which applicant may become aware in the specification. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1-5 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by DeBrabander et al. (U.S. 2001/0028378 A1). DeBrabander at al. disclose the following claimed limitations: Regarding independent Claim 1, a method for manufacturing a nozzle plate for a fluid ejection head (Abstract, §§0025-0028 and Figs. 27-28) through following steps 1 to 5, a nozzle plate having at least a nozzle tapered portion and a straight communication passage (Abstract, §§0025-0028 and Figs. 27-28) in a nozzle hole, the nozzle plate manufacturing method comprising: step 1: a step of preparing a single crystal silicon substrate whose surface has a crystal orientation of a [100] plane (40, §0014 and Fig. 1); step 2: a step of uniformly forming a mask layer on the surface of the single crystal silicon substrate (50, §0014 and Fig. 1); step 3: a step of forming an opening pattern in the mask layer (§0015 and Figs. 2-4); step 4: a step of forming a through hole by penetrating the single crystal silicon substrate located below the opening pattern from the surface by dry etching (§0017 and Figs. 9-10); and step 5: a step of forming a nozzle tapered portion and a straight communication passage continuous with the nozzle tapered portion by enlarging the through hole by anisotropic wet etching on the single crystal silicon substrate (§0018 and Figs. 11-12). Regarding Claim 2, wherein following steps 6 and 7 are performed between steps 3 and 4, step 6: a step of forming a hole by deep-etching the single crystal silicon substrate located below the opening pattern from the surface by dry etching (§0015 and Figs. 5-8), and step 7: a step of forming a mask layer on a side wall of the hole (§0016 and Fig. 9-10). Regarding Claim 3, wherein a step of forming a protective film covering a surface including an inside of the nozzle tapered portion and an inside of the straight communication passage is performed after step 5 (§0019 and Fig. 15). Regarding independent Claim 4, a nozzle plate for a fluid ejection head (350, 360, Abstract, §§0025-0028 and Figs. 27-28), comprising: a straight communication passage (§0018 and Figs. 11-12) in a direction in which a diameter of a nozzle tapered portion, which is formed by four [111] planes of single crystal silicon, increases. Regarding Claim 5, a fluid ejection head, comprising the nozzle plate (350, 360, Abstract, §§0025-0028 and Figs. 27-28). DeBrabander at al. disclose the following claimed limitations: Regarding independent Claim 4, the straight communication passage being formed by four [100] planes continuous in the direction in which a diameter of a nozzle tapered portion, which is formed by four [111] planes of single crystal silicon, increases. However, instant specification is also silent with respect to any particulars of how this limitation is specifically met. There is a presumption that an adequate written description of the claimed invention is present when the application is filed (see MPEP §2163 A). It is, therefore, considered that the claimed limitation is inherent in a nozzle plate meting the other limitations of Claim 4. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to ALEXANDER D SHENDEROV whose telephone number is (571)270-7049. The examiner can normally be reached M-F 9-5. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Douglas X Rodrigues can be reached at (571) 431-0716. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /ALEXANDER D SHENDEROV/Examiner, Art Unit 2853 /JASON S UHLENHAKE/Primary Examiner, Art Unit 2853
Read full office action

Prosecution Timeline

Jul 16, 2024
Application Filed
Apr 21, 2026
Non-Final Rejection mailed — §102 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

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SYSTEM AND METHOD FOR APPLYING PRIMER TO DIFFERENT SIZES OF MEDIA IN INKJET PRINTERS
2y 5m to grant Granted Jul 14, 2026
Patent 12661919
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2y 4m to grant Granted Jun 23, 2026
Patent 12661908
SYSTEM AND METHOD FOR APPLYING PRIMER TO MEDIA IN INKJET PRINTERS
2y 4m to grant Granted Jun 23, 2026
Patent 12661899
CARTRIDGE, SYSTEM, AND CARTRIDGE SET
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Patent 12654459
INK CONTAINER
2y 5m to grant Granted Jun 16, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
90%
Grant Probability
96%
With Interview (+6.2%)
1y 7m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 887 resolved cases by this examiner. Grant probability derived from career allowance rate.

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