DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Applicant’s election without traverse of Group II and the species comprising 2-hydroxybenzophenone in the reply filed on 5/5/2026 is acknowledged.
Claims 1-11 and 20-24 are withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected species, there being no allowable generic or linking claim. Election was made without traverse in the reply filed on 5/5/2026.
Priority
Receipt is acknowledged of certified copies of papers required by 37 CFR 1.55.
Information Disclosure Statement
The information disclosure statements filed 11/29/2023 and 08/15/2025 have been fully considered. Initialed copies of said IDSs are enclosed herein.
Drawings
The drawings filed 9/29/2023 are accepted.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 12-19 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Liao
(PG-PUB 2020/0239744).
With regards to claims 12 and 14, Liao teaches a release agent composition comprising: 2 hydroxy,4-methoxybenzophenone (0065), a compound that has a structure for absorbing the light and contains at least one hydroxy group [0020], [0064]-[0066]; and polydimethylsiloxane, an organosiloxane polymer [0057]-[0059].
With regards to the limitations of claim 12 that the composition is "for forming a release layer of
laminate including a semiconductor substate, a support substrate, and an adhesive layer and a release
layer that are provided between the semiconductor substrate and the support substrate," and "used of
release the semiconductor substrate and the support substrate after the release layer absorbs light
emitted form a side of the support substrate," said limitations are understood to be intended use and
purpose limitations which do not define any of the claimed invention's limitations; thus, said preamble
limitations are not considered limitations and are of no significance to claim construction (see MPEP
2111.02).
With regards to claim 13, 2 hydroxy,4-methoxybenzophenone reads on the claimed benzophenone structure.
With regards to claim 15, 2 hydroxy,4-methoxybenzophenone read on formula 1.
With regards to claim 16, 2 hydroxy,4-methoxybenzophenone comprises a hydroxy group.
With regards to claim 17, Liao teaches the siloxane polymer may be polydimethylsiloxane,
[0057]-[0059] which reads on the claimed second structure units of claim 17.
With regards to claims 18 and 19, polydimethylsiloxane reads on the claimed second structure which “is bonded to Si of any one of the M unit, the D unit, and the T unit via a single bond or
a linking group.”
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to KEVIN R KRUER whose telephone number is (571)272-1510. The examiner can normally be reached M-F 8am-5pm.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Callie Shosho can be reached at (571) 272-1123. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/KEVIN R KRUER/Primary Examiner, Art Unit 1787
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