DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 112
Claims 2-14 are rejected under 35 U.S.C. 112(d) or pre-AIA 35 U.S.C. 112, 4th paragraph, as being of improper dependent form for failing to further limit the subject matter of the claim upon which it depends, or for failing to include all the limitations of the claim upon which it depends. The wafer is not positively recited as part of the invention which means to modify the wafer is to not further limit the invention. Applicant may cancel the claim(s), amend the claim(s) to place the claim(s) in proper dependent form, rewrite the claim(s) in independent form, or present a sufficient showing that the dependent claim(s) complies with the statutory requirements.
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1 is/are rejected under 35 U.S.C. 102(a1) as being anticipated by Li et al 12220730.
Li et al disclose the claimed invention as recited in the claims as shown below:
1. An apparatus for securing a wafer (this is the workpiece which is not part of the invention.), the wafer having a first side comprising a plurality of fabricated structure regions and a second side that has at least one region that is exposed for fabrication when the wafer is secured, the apparatus comprising:
a carrier base 10 configured to receive the wafer, the carrier base comprising one or more alignment features 50 for aligning the wafer to the carrier base; and a plurality of support structures 20 arranged on the carrier base, where three or more of the support structures are each configured to contact the first side of the wafer when the wafer is secured to the carrier base, and arranged on the carrier base to contact the first side of the wafer at a location on the first side of the wafer that is between at least two of the plurality of fabricated structure regions.
Claim(s) 1 is/are rejected under 35 U.S.C. 102(a1) as being anticipated by Walker 6672576.
Walker discloses the claimed invention as recited in the claims as shown below:
1. An apparatus for securing a wafer (this is the workpiece which is not part of the invention.),, the wafer having a first side comprising a plurality of fabricated structure regions and a second side that has at least one region that is exposed for fabrication when the wafer is secured, the apparatus comprising:
a carrier base 40 configured to receive the wafer, the carrier base comprising one or more alignment features 60 for aligning the wafer to the carrier base; and a plurality of support structures 10 arranged on the carrier base, where three or more of the support structures are each configured to contact the first side of the wafer when the wafer is secured to the carrier base, and arranged on the carrier base to contact the first side of the wafer at a location on the first side of the wafer that is between at least two of the plurality of fabricated structure regions.
wafer is secured to the carrier base.
Allowable Subject Matter
Claims 15-20 are allowed.
Method teaches a specific wafer and specific holder which is neither recited nor rendered obvious by the prior art because this specific wafer has structure that works and is configured with the holder.
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. The 892 form discloses prior art being made of record.
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Any inquiry concerning this communication or earlier communications from the examiner should be directed to LEE D WILSON whose telephone number is (571)272-4499. The examiner can normally be reached M-TH 6;30-4;30.
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LEE D. WILSON
Examiner
Art Unit 3723
Ldw
/LEE D WILSON/Primary Examiner, Art Unit 3723 January 26, 2026