Prosecution Insights
Last updated: July 17, 2026
Application No. 18/303,497

COIL COMPONENT, CIRCUIT BOARD ARRANGEMENT, ELECTRONIC DEVICE AND METHOD OF MANUFACTURING COIL COMPONENT

Non-Final OA §102§112
Filed
Apr 19, 2023
Priority
Apr 25, 2022 — JP 2022-071279
Examiner
SUN, PINPING
Art Unit
2872
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Taiyo Yuden Co., Ltd.
OA Round
1 (Non-Final)
75%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
99%
With Interview

Examiner Intelligence

Grants 75% — above average
75%
Career Allowance Rate
347 granted / 464 resolved
+6.8% vs TC avg
Strong +38% interview lift
Without
With
+38.5%
Interview Lift
resolved cases with interview
Typical timeline
2y 11m
Avg Prosecution
14 currently pending
Career history
482
Total Applications
across all art units

Statute-Specific Performance

§101
0.6%
-39.4% vs TC avg
§103
89.5%
+49.5% vs TC avg
§102
3.7%
-36.3% vs TC avg
§112
3.7%
-36.3% vs TC avg
Black line = Tech Center average estimate • Based on career data from 464 resolved cases

Office Action

§102 §112
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant’s election without traverse of 1-9 in the reply filed on 2/18/2026 is acknowledged. Drawings The drawings are objected to under 37 CFR 1.83(a). The drawings must show every feature of the invention specified in the claims. Therefore, the “imaginary line is defined between the first face and the second face, the second electrode layer has a smaller dimension in a direction parallel to the imaginary line than in a direction perpendicular to the first face ” must be shown or the feature(s) canceled from the claim(s). No new matter should be entered. (note that no Figure shows the imaginary line. In addition, no figure shows the second electrode layer has a smaller dimension in a direction parallel to the imaginary line than in a direction perpendicular to the first face. [0040] of Applicant’s specification describes “ As shown in Fig. 5, …..The dimension of the second electrode layer 202 in the height direction H is smaller than the dimension of the second electrode layer 202 in the width direction W. That is, the dimension of the second electrode layer 202 in a direction perpendicular to the bottom face 101 is smaller than the dimension of the second electrode layer 202 in a direction parallel to the bottom face 101. The smaller dimension of the second electrode layer 202 in the height direction H further relaxes the stress received by the external electrode 12 from the fillet of the solder 4. It should be noted that the dimension of the second electrode layer 202 in the height direction H is a dimension perpendicular to the bottom face 101, and the dimension of the second electrode layer 202 in the width direction W is a dimension in a direction parallel to a line (ridge) defined at an interface between the first face and the second face of the base body 11. “ So Figure 5 of application describes a scenario that the second electrode layer has a smaller dimension in a direction perpendicular to the first face than in a direction parallel to the imaginary line. Not the limitation “the second electrode layer has a smaller dimension in a direction parallel to the imaginary line than in a direction perpendicular to the first face” stated in claim 3. Corrected drawing sheets in compliance with 37 CFR 1.121(d) are required in reply to the Office action to avoid abandonment of the application. Any amended replacement drawing sheet should include all of the figures appearing on the immediate prior version of the sheet, even if only one figure is being amended. The figure or figure number of an amended drawing should not be labeled as “amended.” If a drawing figure is to be canceled, the appropriate figure must be removed from the replacement sheet, and where necessary, the remaining figures must be renumbered and appropriate changes made to the brief description of the several views of the drawings for consistency. Additional replacement sheets may be necessary to show the renumbering of the remaining figures. Each drawing sheet submitted after the filing date of an application must be labeled in the top margin as either “Replacement Sheet” or “New Sheet” pursuant to 37 CFR 1.121(d). If the changes are not accepted by the examiner, the applicant will be notified and informed of any required corrective action in the next Office action. The objection to the drawings will not be held in abeyance. Claim Objections 4. Claims 8, 9 are objected to because of the following informalities: Claim 8, line 2, “ a coil component” should be – the coil component— Claim 9, line 1, “ a circuit board” should be – the circuit board— Appropriate correction is required. Claim Rejections - 35 USC § 112 The following is a quotation of 35 U.S.C. 112(b): (b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention. The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph: The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention. 5.Claims 1-9 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor, or for pre-AIA the applicant regards as the invention. Claim 1 recites a first electrode layer contains a metal material, … and said second electrode layer containing a metal material. It is unclear the metal material in the first electrode layer and the metal material in the second electrode layer are the same kind of metal material or different kind of metal material. For examination purpose, the limitations are interpreted as “a first electrode layer contains a metal material of the first electrode layer,” “said second electrode layer containing a metal material of said second electrode layer”. Claims 2-9 are rejected for the same reason because they depend on claim 1. Claim 3 recites the limitation “when an imaginary line is defined along an interface between the first face and the second face, the second electrode layer has a smaller dimension in a direction parallel to the imaginary line than in a direction perpendicular to the first face.” It is unclear where is the imaginary line is because the imaginary line was not label in the figure. In addition, it is unclear how “the second electrode layer has a smaller dimension in a direction parallel to the imaginary line than in a direction perpendicular to the first face” because the specification describes “ As shown in Fig. 5, …..The dimension of the second electrode layer 202 in the height direction H is smaller than the dimension of the second electrode layer 202 in the width direction W. That is, the dimension of the second electrode layer 202 in a direction perpendicular to the bottom face 101 is smaller than the dimension of the second electrode layer 202 in a direction parallel to the bottom face 101. The smaller dimension of the second electrode layer 202 in the height direction H further relaxes the stress received by the external electrode 12 from the fillet of the solder 4. It should be noted that the dimension of the second electrode layer 202 in the height direction H is a dimension perpendicular to the bottom face 101, and the dimension of the second electrode layer 202 in the width direction W is a dimension in a direction parallel to a line (ridge) defined at an interface between the first face and the second face of the base body 11. “so Figure 5 of application describes a scenario that the second electrode layer has a smaller dimension in a direction perpendicular to the first face than in a direction parallel to an interface between the first face and second face. For examination purpose, the claim has been interpretated as “the second electrode layer has a smaller dimension in a direction perpendicular to the first face than in a direction parallel to an interface between the first face and second face” Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale or otherwise available to the public before the effective filing date of the claimed invention. (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. 6. Claim(s) 1-9 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by HIROTAKA (JP2021141306A) With regard to claim 1, HIROTAKA (Fig. 6, Fig. 7B belong to one embodiment ) teaches A coil component comprising: a magnetic base body ( e.g., 10, Fig. 7B) formed by bonding metal magnetic particles ([0028] he substrate 10 includes a plurality of first metal magnetic particles 11, a plurality of second metal magnetic particles 12, and a binder 13) , the magnetic base body having a first face (10a, Fig. 7B) and a second face ( 10d, Fig. 7B) that is immediately adjacent to the first face; a conductor (25, Fig. 7B) provided inside and/or on a surface of the magnetic base body ( e.g., 10, Fig. 7B); and an external electrode (24A, 24B, 26, Fig.7B) electrically connected to the conductor ( 25, Fig. 1, Fig. 7B, see 7B, 24A electrically connected to 25 through 23, see abstract: and a conductor 25 that is electrically connected to the external electrodes 21 and 22, and is wound around a coil shaft Ax, and the external electrodes 21 and 22 have a first electrode layer 24A, a second electrode layer 24B covering the first electrode layer 24A, and a plating layer 26 covering the second electrode layer 24B.) and including a first electrode layer (24A, Fig. 7B), a second electrode layer ( 24B, Fig. 7B), and a third electrode layer ( 26, Fig. 7B), wherein the first electrode layer (24A, Fig. 5) contains a metal material at a first metal filling rate ( FA2, FA1, Fig. 5 [0043]) and is provided in a first predetermined area ( the area of 24A, Fig. 7B) of the first face ( 10a, Fig. 7B, see Fig. 7B, 24 A is provided at the 10 a) closer to the second face ( 10d, Fig. 7B,) than to a face ( 10c see 10c of Fig. 7B in Fig. 1) of the magnetic base body immediately adjacent to the first face ( 10a, Fig. 7B) and opposite to the second face ( 10d, Fig. 1) ( se , the second electrode layer ( 24B, Fig. 7B) is provided in a second predetermined area of the second face (10d, Fig. 7B) closer to the first face (10a, Fig. 7B) than to a face of the magnetic base body ( 10b, Fig. 7B) immediately adjacent to the second face (10d, Fig. 7B)and opposite to the first face (10a, Fig. 7B), said second electrode layer ( 24B, Fig. 5) containing a metal material at a second metal filling rate {0043}, FB2 in 24 B at 60 vol% ) lower than that the first metal filling rate ( [0043] Fa1 AT 24a IS 70%) of the first electrode layer (24A, Fig. 5)([0043]Among the plurality of filler FAs in the first electrode layer 24A, the ratio of the first filler FA1 is 30 vol% or more and 70 vol% or less, and the ratio of the second filler FA 2 is 30 vol% or more and 70 vol% or less. Among the plurality of filler FBs in the second electrode layer 24B, the ratio of the first filler FB1 is 40 vol% or more and 70 vol% or less, and the ratio of the second filler FB 2 is 30 vol% or more and 60 vol% or less. Therefore, FB2 in 24B as 60% is lower than FA1 in 24A as 70%) the third electrode layer ( 26, Fig. 7B) is configured to cover an outer surface of the first electrode layer ( 24A, Fig. 7B) and an outer surface of the second electrode layer(24B, Fig. 7B), and extends over and in contact with the first predetermined area of the first face and the second predetermined area of the second face of the magnetic base body ( see 7B, 26 extends.24A at 10a, and 24B at 10d) With regard to claim 2. HIROTAKA teaches all the limitations of claim 1, and further teaches wherein the first face of the magnetic base body faces a board when the coil component is mounted on the board ([0054]. the first plating layer 26A and the second plating layer 26B are formed by the plating method. By the above steps, the external electrodes 21 and 22 are formed, and the coil component 1 is manufactured. The manufactured coil component 1 is mounted on the circuit board by soldering the external electrodes 21 and 22 to the land portion of the circuit board, respectively., see Fig. 7B) With regard to claim 3, HIROTAKA teaches all the limitations of claim 1, and further teaches a electrode layer, an imaginary line is defined along an interface between the first face and the second face (interface between 10a and 10d, Fig. 7B), an electrode layer has a smaller dimension in a direction parallel to the imaginary line than in a direction perpendicular to the first face. (this limitation has been interpretated under 112(b) as the second electrode layer has a smaller dimension in a direction perpendicular to the first face than in a direction parallel to an interface between the first face and second face) Fig. 7B shows length of 24 B at T direction on 10d, Fig. 1 (Fig. 1 is used here to show the 3D structure of Fig. 7B and 21 in W direction) shows the length of 21 (21 including 24B) at W direction, because 1 is a rectangular, the length of 24B at T direction ( which only covers part of the length of 10d) is smaller than the length of 21 at W direction) With regard to claim 4, HIROTAKA teaches all the limitations of claim 1, and further teaches a portion of the second electrode layer (24B, Fig. 7B) overlaps a portion of the first electrode layer (24A, Fig. 7B) on the first face (10a, Fig. 7B). With regard to claim 5, HIROTAKA teaches all the limitations of claim 1, and further teaches an end of the conductor ( 25, Fig. 7B) is connected to the first electrode layer ( 24A, Fig. 7B) such that the conductor is electrically connected to the external electrode ( see abstract, see abstract: and a conductor 25 that is electrically connected to the external electrodes 21 and 22, and is wound around a coil shaft Ax, and the external electrodes 21 and 22 have a first electrode layer 24A, a second electrode layer 24B covering the first electrode layer 24A, and a plating layer 26 covering the second electrode layer 24B). With regard to claim 6, HIROTAKA teaches all the limitations of claim 1, and further teaches the second electrode layer has a metal filling rate of 60% or less ([0043] Among the plurality of filler FBs in the second electrode layer 24B, the ratio of the first filler FB1 is 40 vol% or more, so FB1 at 24B is 40%, and less than 60%) With regard to claim 7, HIROTAKA teaches all the limitations of claim 1, and further teaches the first electrode layer has a metal filling rate of 70% or more ([0043] and Among the plurality of filler FAs in the first electrode layer 24A, the ratio of the first filler FA1 is 30 vol% or more and 70 vol% or less, so FA1 in 24A can be 70%) With regard to claim 8, HIROTAKA teaches all the limitations of claim 1, and further teaches circuit board arrangement comprising: a coil component recited in claim 1 ( see abstract); and a board on which the coil component is mounted ([0054] the first plating layer 26A and the second plating layer 26B are formed by the plating method. By the above steps, the external electrodes 21 and 22 are formed, and the coil component 1 is manufactured. The manufactured coil component 1 is mounted on the circuit board by soldering the external electrodes 21 and 22 to the land portion of the circuit board, respectively.). With regard to claim 9. HIROTAKA teaches all the limitations of claim 8, and further teaches An electronic device comprising a circuit board arrangement recited in claim 8([0054] the first plating layer 26A and the second plating layer 26B are formed by the plating method. By the above steps, the external electrodes 21 and 22 are formed, and the coil component 1 is manufactured. The manufactured coil component 1 is mounted on the circuit board by soldering the external electrodes 21 and 22 to the land portion of the circuit board, respectively.). Conclusion 7. The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Choi (US 20090108984 A1) teaches about a ceramic component and a method of manufacturing the ceramic component. The ceramic component includes a previously fired insulation ceramic base, a functional ceramic sheet bonded to the insulation ceramic base by a diffusion bonding layer having an anchoring structure, internal electrodes embedded into the functional ceramic sheet, and external electrodes connected to the internal electrodes MARUYAMA(US 20180366248 A1) teaches electronic component includes: an insulator part 10 of rectangular solid shape; a coil element 32 provided inside the insulator part 10; bottom electrodes 40 provided on a bottom face 14 of the insulator part 10 and electrically connected to the coil element 32; a plating layer 62 provided in a manner overlapping each bottom electrode 40 Any inquiry concerning this communication or earlier communications from the examiner should be directed to PINPING SUN whose telephone number is (571)270-1284. The examiner can normally be reached 9-5. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /PINPING SUN/Supervisory Patent Examiner, Art Unit 2872
Read full office action

Prosecution Timeline

Apr 19, 2023
Application Filed
May 20, 2026
Non-Final Rejection mailed — §102, §112 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
75%
Grant Probability
99%
With Interview (+38.5%)
2y 11m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 464 resolved cases by this examiner. Grant probability derived from career allowance rate.

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