DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Applicant’s election without traverse of Group I, species B (claims 1, 3, 13, 14 and 16) in the reply filed on 2-2-2026 is acknowledged.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1, 3, 13, 14, and 16 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Yaku (US 2013/0181353).
[claim 1] An electronic component (fig. 12-14, fig. 1-11 could also be used, note that the only difference between the two figure sets is that fig. 1-11 and fig. 12-14 is that 1-11 has one single continuous die aligning element 18 while fig. 12-14 may have it discontinuous 32, see fig. 1 and 12, [0050]) comprising: a support that includes a die-attachment surface (16, fig. 12, 14) that defines a horizontal plane (extending side to side, fig. 12), with a vertical direction (into the page in fig. 12) being perpendicular to the horizontal plane; a first die (14, fig. 12, 14) that is vertically fixed to the die-attachment surface with a die-attach material (34, fig. 12,14, see [0053] which explains the adhesive bond between the die and the substrate); and a die-aligning element (32B, 32C, fig. 12, 14) that is adjacent to the die-attachment surface and that is integral with at least one of the support or a packaging structure that is rigidly attached to the support (fig. 14, [0053]), wherein the die-aligning element comprises a first die-alignment wall that is horizontally fixed to a first side of the first die with the die-attach material (34, fig. 14, [0053]), and wherein a second side of the first die that is opposite to the first side of the first die is horizontally unfixed (unfixed from the die-aligning element, 32, fig. 12).
[claim 3] The electronic component according to claims claim 1, wherein a vertical distance from the die-attachment surface to a bond line between the first die and the die-attach material is D (D is near zero as can be seen in fig. 14, [0053]), and a vertical height of the first die is H (side of the die 14, see fig. 14, see also fig. 5) , and wherein the first die-alignment wall has a first wall height (fig. 14, fig. 5) in the vertical direction that is greater than D and less than D + H/2 (fig. 14, fig. 5).
[claim 13] The electronic component according to claim 1, wherein the die-aligning element comprises a cuboid shape (see e.g. the example of fig. 8).
[claim 14] An electronic component (fig. 12-14, fig. 1-11 could also be used, note that the only difference between the two figure sets is that fig. 1-11 and fig. 12-14 is that 1-11 has one single continuous die aligning element 18 while fig. 12-14 may have it discontinuous 32, see fig. 1 and 12, [0050]) comprising: a support that includes a die-attachment surface (16, fig. 12, 14) that defines a horizontal plane (extending side to side, fig. 12), with a vertical direction (into the page in fig. 12) being perpendicular to the horizontal plane; a die-aligning element (32B, 32C, fig. 12, 14) that is integral with the support and that includes a first die- alignment wall that vertically extends from the die-attachment surface (fig. 14, [0053]); and a first die (14, fig. 12, 14) that is vertically fixed to the die-attachment surface with a die-attach material (34, fig. 14, [0053]) and that includes a first side that is horizontally fixed to the die-aligning element with the die- attach material (34, fig. 14, [0053]), wherein a second side of the first die that is opposite to the first side of the first die is horizontally unfixed (unfixed from the die-aligning element, 32, fig. 12).
[claim 16] The electronic component according to claims 14. wherein a vertical distance from the die-attachment surface to a bond line between the first die and the die-attach material is D (D is near zero as can be seen in fig. 14, [0053]), and a vertical height of the first die is H (side of the die 14, see fig. 14, see also fig. 5), and wherein the first die-alignment wall has a first wall height in the vertical direction that is greater than D and less than D + H/2 (fig. 14, fig. 5).
Conclusion
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/AMAR MOVVA/ Primary Examiner, Art Unit 2898
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