Prosecution Insights
Last updated: July 17, 2026
Application No. 18/322,284

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

Non-Final OA §103
Filed
May 23, 2023
Priority
May 24, 2022 — JP 2022-084784
Examiner
LIAN, MANG TIN BIK
Art Unit
2837
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Murata Manufacturing Co., Ltd.
OA Round
1 (Non-Final)
70%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
97%
With Interview

Examiner Intelligence

Grants 70% — above average
70%
Career Allowance Rate
933 granted / 1330 resolved
+2.2% vs TC avg
Strong +26% interview lift
Without
With
+26.4%
Interview Lift
resolved cases with interview
Typical timeline
2y 7m
Avg Prosecution
68 currently pending
Career history
1401
Total Applications
across all art units

Statute-Specific Performance

§101
0.1%
-39.9% vs TC avg
§103
91.7%
+51.7% vs TC avg
§102
6.4%
-33.6% vs TC avg
§112
1.2%
-38.8% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1330 resolved cases

Office Action

§103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant’s election of Group I, Species I, FIGs. 1-4, claims 1-3 and 6 in the reply filed on 04/27/2026 is acknowledged. Because applicant did not distinctly and specifically point out the supposed errors in the restriction requirement, the election has been treated as an election without traverse (MPEP § 818.01(a)). Claims 4, 5, and 7-11 are withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected Group and or Species, there being no allowable generic or linking claim. Priority Acknowledgment is made of applicant's claim for foreign priority based on an application filed in Japan on 05/24/2022. It is noted, however, that applicant has not filed a certified copy of the 2022-084784 application as required by 37 CFR 1.55. Information Disclosure Statement The information disclosure statement (IDS) submitted on 05/23/2023 and 06/28/2024 are in compliance with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statement is being considered by the examiner. Drawings The drawings received on 05/23/2023 are acceptable. Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows: 1. Determining the scope and contents of the prior art. 2. Ascertaining the differences between the prior art and the claims at issue. 3. Resolving the level of ordinary skill in the pertinent art. 4. Considering objective evidence present in the application indicating obviousness or nonobviousness. Claims 1-3 and 6 are rejected under 35 U.S.C. 103 as being unpatentable over Matsuki et al. (U.S. PG. Pub. No. 2022/0068554 A1, hereinafter “Matsuki”) in view of Yosui et al. (U.S. PG. Pub. No. 2015/0296621 A1, hereinafter “Yosui”). With respect to claim 1, Matsuki teaches an electronic component (Fig. 16) comprising: a glass substrate 10; an outer surface conductor 11 that is in contact with an outer surface (upper surface) of the glass substrate; and a protective film 14 that covers the outer surface of the glass substrate and the outer surface conductor and is in contact with the outer surface of the glass substrate and the outer surface conductor, wherein when the glass substrate has first surface roughness Ra1 at an interface S2 between the glass substrate and the outer surface conductor, the glass substrate has second surface roughness Ra2 at an interface S1 between the glass substrate and the protective film, and the outer surface conductor has third surface roughness Ra3 at an interface S3 (annotated Fig. 16) between the outer surface conductor and the protective film, Ra1<Ra2 is satisfied (para. [0141]). PNG media_image1.png 366 442 media_image1.png Greyscale Matsuki does not expressly teach Ra1<Ra3<Ra2 is satisfied. Yosui teaches an electronic component (FIG. 5A), wherein Ra1<Ra3 is satisfied (para. [0057]). Surface roughness of first principal surface 91 is greater than surface roughness of second surface 93. PNG media_image2.png 379 350 media_image2.png Greyscale The incorporation of the surface roughness teaching of Yosui to the electronic component of Matsuki would result in “Ra1<Ra3<Ra2 is satisfied” as claimed. Accordingly, it would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to incorporate the surface roughness as taught by Yousi to the electronic component of Matsuki to improve the mechanical adhesion among the outer glass substrate, the outer surface conductor and the protective film. With respect to claim 2, Matsuki in view of Yosui teaches the electronic component according to claim 1, wherein (Ra3−Ra1)<(Ra2−Ra3) is satisfied (Matsuki, para. [0141] and Yosui, para. [0057]). The combination of the Matsuki and Yosui would have the claimed limitation. With respect to claims 3 and 6, Matsuki in view of Yosui teaches the electronic component according to claims 1 and 2, respectively, further comprising: a first through conductor (front or back through wire 13) and a second through conductor (the other of front or back through wire 13) that penetrate the glass substrate, wherein the outer surface includes a bottom surface (lower surface), which is one main surface of the glass substrate, and a top surface (upper surface) located on a back side of the bottom surface, the outer surface conductor includes a bottom surface conductor (lower surface conductor 11) that is in contact with the bottom surface and a top surface (upper surface conductor 11) conductor that is in contact with the top surface, and the bottom surface conductor, the first through conductor, the top surface conductor, and the second through conductor are connected in order and configure a part of a spiral coil (Matsuki, para. [0085]). Claims 1-3 and 6 are also rejected under 35 U.S.C. 103 as being unpatentable over Mizushiro (U.S. PG. Pub. No. 2018/0158607 A1) in view of Yosui. With respect to claim 1, Mizushiro teaches an electronic component 1a (FIG. 1-3) comprising: a glass substrate 2; an outer surface conductor 6a that is in contact with an outer surface (upper or lower surface) of the glass substrate; and a protective film 7a that covers the outer surface of the glass substrate and the outer surface conductor and is in contact with the outer surface of the glass substrate and the outer surface conductor, wherein when the glass substrate has first surface roughness Ra1 Rz2 at an interface (interface at surface roughness Rz2) between the glass substrate and the outer surface conductor, the glass substrate has second surface roughness Ra2 Rz1 at an interface (interface at surface roughness Rz1) between the glass substrate and the protective film, and the outer surface conductor has third surface roughness Ra3 Rz3 (annotated FIG. 3) at an interface (interface at Rz3) between the outer surface conductor and the protective film, Ra1 <Ra2 is satisfied (para. [0045]). PNG media_image3.png 246 423 media_image3.png Greyscale Mizushiro does not expressly teach Ra1<Ra3<Ra2 is satisfied. Yosui teaches an electronic component (FIG. 5A), wherein Ra1<Ra3 is satisfied (para. [0057]). Surface roughness of first principal surface 91 is greater than surface roughness of second surface 93.The incorporation of the surface roughness teaching of Yosui to the electronic component of Mizushiro would result in “Ra1<Ra3<Ra2 is satisfied” as claimed. Accordingly, it would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to incorporate the surface roughness as taught by Yousi to the electronic component of Mizushiro to improve the mechanical adhesion among the outer glass substrate, the outer surface conductor and the protective film. With respect to claim 2, Mizushiro in view of Yosui teaches the electronic component according to claim 1, wherein (Ra3−Ra1)<(Ra2−Ra3) is satisfied (Mizushiro, para. [0045] and Yosui, para. [0057]). The combination of the Matsuki and Yosui would have the claimed limitation. With respect to claims 3 and 6, Mizushiro in view of Yosui teaches the electronic component according to claims 1 and 2 respectively, further comprising: a first through conductor 5a or 5b and a second through conductor (the other of through conductor 5a or 5b) that penetrate the glass substrate, wherein the outer surface includes a bottom surface (lower surface), which is one main surface of the glass substrate, and a top surface (upper surface) located on a back side of the bottom surface, the outer surface conductor includes a bottom surface conductor 6b that is in contact with the bottom surface and a top surface conductor 6a that is in contact with the top surface, and the bottom surface conductor, the first through conductor, the top surface conductor, and the second through conductor are connected in order and configure a part of a spiral coil (Mizushiro, para. [0045]). Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. A list of pertinent prior art is attached in form PTO-892. Any inquiry concerning this communication or earlier communications from the examiner should be directed to MANGTIN LIAN whose telephone number is (571)270-5729. The examiner can normally be reached Monday-Friday 0800-1700. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Shawki S. Ismail can be reached at 571-272-3985. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /MANG TIN BIK LIAN/ Primary Examiner, Art Unit 2837
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Prosecution Timeline

May 23, 2023
Application Filed
May 29, 2026
Non-Final Rejection mailed — §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
70%
Grant Probability
97%
With Interview (+26.4%)
2y 7m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 1330 resolved cases by this examiner. Grant probability derived from career allowance rate.

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