Prosecution Insights
Last updated: October 02, 2026
Application No. 18/322,335

METHOD FOR PREPARING A COUNTER/REFERENCE ELECTRODE

Final Rejection §103
Filed
May 23, 2023
Priority
Nov 24, 2020 — EU 20 209 558.4 +1 more
Examiner
NGUYEN, DONGHAI D
Art Unit
3729
Tech Center
3700 — Mechanical Engineering & Manufacturing
Assignee
Roche Diabetes Care Inc.
OA Round
2 (Final)
76%
Grant Probability
Favorable
3-4
OA Rounds
0m
Est. Remaining
99%
With Interview

Examiner Intelligence

Grants 76% — above average
76%
Career Allowance Rate
677 granted / 897 resolved
+5.5% vs TC avg
Strong +29% interview lift
Without
With
+29.0%
Interview Lift
resolved cases with interview
Typical timeline
3y 0m
Avg Prosecution
18 currently pending
Career history
911
Total Applications
across all art units

Statute-Specific Performance

§101
0.5%
-39.5% vs TC avg
§103
49.6%
+9.6% vs TC avg
§102
30.0%
-10.0% vs TC avg
§112
18.3%
-21.7% vs TC avg
Black line = Tech Center average estimate • Based on career data from 897 resolved cases

Office Action

§103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 103 The text of those sections of Title 35, U.S. Code not included in this action can be found in a prior Office action. Claims 1-18 are rejected under 35 U.S.C. 103 as being unpatentable over U.S. Patent 6,299,757 to Feldman et al in view of Article "The electrochemical formation and reduction of a thick AgCI deposition layer on silver substrate" by Jin et al. Regarding claim 1, Feldman et al disclose a method for manufacturing an electrode (22/24) of an analyte sensor (see Figs. 1-2), the method comprising: a) providing a substrate (30/38) having a first side and a second side and a conductive material (see Col. 8, lines 1-16) positioned on the first side; and b) applying a layer of an AgCl-containing composition onto the conductive material, wherein the layer of the AgCl-containing composition comprises an outer surface that faces away from the conductive material and an inner surface that contacts the conductive material (see Col. 24, lines 45-52); except for at least partially reducing AgCI on the outer surface and thereby forming elemental Ag on the outer surface, wherein the electrode of the analyte sensor comprises elemental Ag on the outer surface of the AgCl containing composition. Jin et al teach the process of reducing AgCI on a conductive layer (carbon, see Section 3.2) for obtaining a porous silver layer (see Fig. 13), the elemental Ag on the outer surface of the AgCl-containing composition (see Fig. 6a). Therefore, it would have been obvious to one having ordinary skill in the art before the effective filing date of the claimed invention to modify the invention Feldman et al by utilizing the process of reducing AgCI layer as taught by Jin et al for obtaining a silver layer on the conductive layer. Regarding claims 2-5, Feldman et al disclose the AgCl-containing composition applied in step b) further comprises at least one binder and/or elemental Ag, a non-conductive polymer of one or more of a PVC-based polymer and a polyurethane- based polymer or the binder is a hydrophobic polyurethane-based polymer (see Col. 59, lines 15-32). Regarding claims 6-8, Feldman et al disclose the conductive material is selected from the group consisting of gold, carbon, carbon paste and combinations thereof and comprises at least two different layers of gold layer and a carbon layer (see Col. 8, lines 8-11). Regarding claims 9-10 Jin et al disclose the AgCI is reduced by a chemical treatment and/or by an electrochemical treatment and an amount of about 0.2 µg/mm² to about 10 µg/mm² AgCI on the outer surface is reduced (see Section 3. Results and discussion). Regarding claims 11-12, Jin et al disclose a layer of Ag having a thickness from about 0.1 µm to about 5 µm is formed on the outer surface of the AgCl-containing composition (see "2. Experimental" section) and about 90 mol-% to about 99 mol-% of the AgCI in the layer of Ag is reduced to elemental Ag (see "3.1.2. Conductivity of the AgCI deposit layer". Regarding claims 13-18, Feldman et al disclose the electrode (22/24) is used as a reference electrode, a counter electrode and/or a combined counter/reference electrode of an analyte sensor (see Figs. 1-2) and providing the working electrode comprises applying a sensing material to the substrate and obtaining a working electrode of the analyte sensor on the substrate; the sensing material comprises at least one enzyme; a cross-linker and/or a polymeric metal complex and the enzyme is a glucose dehydrogenase (GOD) or a glucose oxidase (GOX, see Col. 23, lines 50-53). Response to Arguments Applicants’ arguments filed on June 19, 2026 have been fully considered but they are not persuasive. Applicant argued that Jin does not teach the formation of elemental Ag on the outer surface, wherein the electrode of the analyte sensor comprises elemental Ag on the outer surface of the AgCl-containing composition because Jin teaches the formation of the silver layer on the substrate surface (see “Remarks” page 6). The Examiner disagrees because Applicant appears to misconstrue the disclosure of Jin. It is true that the silver layer form on the surface of the (silver) substrate in the first instance of the AgCl reduction preprocess as disclosed by Jin “the top layer of AgCl deposit is not change much after the initial stage till the end of deduction” with continuation of AgCl reduction process “the front of the reduction reaction moves outward from the substrate. The formation of 60% porosity in the reduced part will cause a forced flow of electrolyte solution to fill the newly form space. The solution flux may flush the AgCl grains to broaden the channels further” (see 3.2.1 section). That means the silver layer moves outward from the surface of the substrate and the AgCl is flush back into the space between the substrate and the silver layer as shown in Fig. 6a). Conclusion Applicants’ amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a). A shortened statutory period for replying to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action. Any inquiry concerning this communication or earlier communications from the examiner should be directed to DONGHAI D NGUYEN whose telephone number is (571)272-4566. The examiner can normally be reached M-F 9:00-5:30. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Thomas J. Hong can be reached at 571-272-0993. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /DN/ /DONGHAI D NGUYEN/August 28, 2026 Primary Examiner, Art Unit 3729
Read full office action

Prosecution Timeline

May 23, 2023
Application Filed
Mar 19, 2026
Non-Final Rejection mailed — §103
May 06, 2026
Applicant Interview (Telephonic)
May 16, 2026
Examiner Interview Summary
Jun 19, 2026
Response Filed
Sep 01, 2026
Final Rejection mailed — §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

3-4
Expected OA Rounds
76%
Grant Probability
99%
With Interview (+29.0%)
3y 0m (~0m remaining)
Median Time to Grant
Moderate
PTA Risk
Based on 897 resolved cases by this examiner. Grant probability derived from career allowance rate.

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