Prosecution Insights
Last updated: October 27, 2026
Application No. 18/360,570

PACKAGE COMPRISING A SUBSTRATE WITH INDUCTORS AND A MAGNETIC LAYER

Non-Final OA §102§103
Filed
Jul 27, 2023
Examiner
FREY, KIMBERLY NEWMAN
Art Unit
2817
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Qualcomm Incorporated
OA Round
2 (Non-Final)
76%
Grant Probability
Favorable
2-3
OA Rounds
2m
Est. Remaining
96%
With Interview

Examiner Intelligence

Grants 76% — above average
76%
Career Allowance Rate
25 granted / 33 resolved
+7.8% vs TC avg
Strong +20% interview lift
Without
With
+20.4%
Interview Lift
resolved cases with interview
Typical timeline
3y 5m
Avg Prosecution
37 currently pending
Career history
110
Total Applications
across all art units

Statute-Specific Performance

§103
55.5%
+15.5% vs TC avg
§102
37.5%
-2.5% vs TC avg
§112
5.7%
-34.3% vs TC avg
Black line = Tech Center average estimate • Based on career data from 33 resolved cases

Office Action

§102 §103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 103 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claims 1-2, 11-12, and 21 are rejected under U.S.C. 103 as being unpatentable over Lambert et al.; US 2021/0125944 A1; 10/2019 in view of Cretu et al.; US 2023/0363735 A1 Claim 1: Lambert discloses a package comprising: an integrated device ( Fig. 5 die 514 ); and a substrate ( Fig. 5 substrate 502 ) coupled to the integrated device through at least a plurality of solder interconnects ( [0069] interconnect structures (e.g., the plurality of bumps disposed below the die 514 and the substrate 512 ), wherein the substrate ( Fig. 5 #502 ) comprises: at least one magnetic layer ( Fig. 5 magnetic inductor 550 ); at least one dielectric layer ( [0069] the magnetic inductors 550 may have magnetic layers, dielectric layers, substrate layers, conductive layers, and PTH vias (e.g., filled with resin and/or conductive material ); and a plurality of interconnects (Fig. 5 bumps 516, 518, and 520 ), wherein the plurality of interconnects comprise: a first set of interconnects ( Fig. 5 #518 ) that are configured to operate as a first inductor ( Fig. 5 #550 in #512 ); and a second set of interconnects ( Fig. 5 #516 ) that are configured to operate as a second inductor ( Fig. 5 #550 in #502 ). Lambert does not appear to disclose the second inductor and the first inductor are configured to operate as inductively coupled inductors. However, Cretu teaches the second inductor ( Fig. 12 inductor 102 ) and the first inductor ( Fig. 12 inductor 101 ) are configured to operate as inductively coupled inductors ( [0119] On the electrical source side (left) it is shown the source inductor 101 and source capacitor 103 magnetically coupled to the transmission inductor 102 and transmission capacitor 104 through the magnetic flux 96 ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Cretu with Lambert to implement the second inductor and the first inductor are configured to operate as inductively coupled inductors because this allows the two inductors to transfer energy or signals magnetically. Claim 2: Lambert and Cretu discloses the package of claim 1 ( as discussed above). Lambert does not appear to disclose the first inductor is configured to induce a current in the second inductor. However, Cretu teaches the first inductor ( Fig. 12 #101 ) is configured to induce a current ( Fig. 12 #102 ) in the second inductor ( [0012] According to another embodiment, there is provided a system comprising: a capacitive micromachined ultrasonic transducer (CMUT); a first alternating current voltage source; a first inductor electrically coupled to the first voltage source; and a second inductor electrically coupled to the CMUT, wherein the second inductor is physically electrically decoupled from, and configured to be wirelessly coupled to, the first inductor ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Cretu with Lambert to implement the first inductor is configured to induce a current in the second inductor because this allows for energy transfer and signal coupling between the inductors. Claim 11: Lambert discloses a substrate ( Fig. 5 substrate 502 ) comprising: at least one magnetic layer ( Fig. 5 #550 ); at least one dielectric layer ( [0069] the magnetic inductors 550 may have magnetic layers, dielectric layers, substrate layers, conductive layers, and PTH vias (e.g., filled with resin and/or conductive material ); and a plurality of interconnects ( Fig. 5 bumps 516, 518, and 520 ), wherein the plurality of interconnects comprise: a first set of interconnects that are configured to operate as a first inductor ( Fig. 5 #550 in #512 ); and a second set of interconnects ( Fig. 5 #516 ) that are configured to operate as a second inductor ( Fig. 5 #550 in #502 ). Lambert does not appear to disclose the second inductor and the first inductor are configured to operate as inductively coupled inductors. However, Cretu teaches the second inductor ( Fig. 12 inductor 102 ) and the first inductor ( Fig. 12 inductor 101 ) are configured to operate as inductively coupled inductors ( [0119] On the electrical source side (left) it is shown the source inductor 101 and source capacitor 103 magnetically coupled to the transmission inductor 102 and transmission capacitor 104 through the magnetic flux 96 ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Cretu with Lambert to implement the second inductor and the first inductor are configured to operate as inductively coupled inductors because this allows the two inductors to transfer energy or signals magnetically. Claim 12: Lambert and Cretu disclose the substrate of claim 11 ( as discussed above ). Lambert does not appear to disclose the first inductor is configured to induce a current in the second inductor. However, Cretu teaches the first inductor ( Fig. 12 #101 ) is configured to induce a current ( Fig. 12 #102 ) in the second inductor ( [0012] According to another embodiment, there is provided a system comprising: a capacitive micromachined ultrasonic transducer (CMUT); a first alternating current voltage source; a first inductor electrically coupled to the first voltage source; and a second inductor electrically coupled to the CMUT, wherein the second inductor is physically electrically decoupled from, and configured to be wirelessly coupled to, the first inductor ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Cretu with Lambert to implement the first inductor is configured to induce a current in the second inductor because this allows for energy transfer and signal coupling between the inductors. Claim 21: Lambert discloses a method for fabricating a substrate ( [0038] FIGS. 2A-2I are illustrations of cross-sectional views of a process flow to form an inductor 200 with a magnetic layer 220, a dielectric layer 230, a substrate layer 250, a plurality of PTH vias 240-241, and a plurality of conductive layers 210-211, according to some embodiments ), comprising: providing at least one magnetic layer ( Figs. 2A-2I magnetic layer 120 ); providing at least one dielectric layer ( Figs. 2A-2I dielectric layer 130 ); and forming a plurality of interconnects, wherein the plurality of interconnects comprise: a first set of interconnects that are configured to operate as a first inductor ( Fig. 5 #550 in #512 ); and a second set of interconnects that are configured to operate as a second inductor ( Fig. 5 #550 in ). Lambert does not appear to disclose the second inductor and the first inductor are configured to operate as inductively coupled inductors. However, Cretu teaches the second inductor ( Fig. 12 inductor 102 ) and the first inductor ( Fig. 12 inductor 101 ) are configured to operate as inductively coupled inductors ( [0119] On the electrical source side (left) it is shown the source inductor 101 and source capacitor 103 magnetically coupled to the transmission inductor 102 and transmission capacitor 104 through the magnetic flux 96 ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Cretu with Lambert to implement the second inductor and the first inductor are configured to operate as inductively coupled inductors because this allows the two inductors to transfer energy or signals magnetically. Claims 9, 19, and 25 are rejected under U.S.C. 103 as being unpatentable over Lambert et al.; US 2021/0125944 A1; 10/2019 in view of Cretu et al.; US 2023/0363735 A1 as it related to claim 11 above and further in view of Massolini et al.; US 2017/0178787 A1; 12/2015 Claim 9: Lambert and Cretu disclose the package of claim 1 ( as discussed above ). Neither Lambert nor Cretu appear to disclose a core layer, wherein the at least one magnetic layer includes a first magnetic layer, a second magnetic layer, wherein the at least one dielectric layer includes a first dielectric layer and a second dielectric layer, wherein the first magnetic layer is coupled to a first surface of the core layer, wherein the second magnetic layer is coupled to a second surface of the core layer, wherein the first dielectric layer is coupled to the first surface of the core layer, and wherein the second dielectric layer is coupled to the second surface of the core layer. However, Massolini teaches a core layer ( Fig. 8 core layer 830 ), wherein the at least one magnetic layer ( Fig. 8 magnetic layers 810 and 812 ) includes a first magnetic layer ( Fig. 8 #810 ), a second magnetic layer ( Fig. 8 #812 ), wherein the at least one dielectric layer includes a first dielectric layer ( [0059] a first dielectric layer surrounding the at least one conductive layer ) and a second dielectric layer ( [0059] a second dielectric layer surrounding the at least one additional conductive layer ), wherein the first magnetic layer ( Fig. 8 #810 ) is coupled to a first surface of the core layer ( Fig. 8 #830 ), wherein the second magnetic layer ( Fig. 8 #812 ) is coupled to a second surface of the core layer ( Fig. 8 #830 ), wherein the first dielectric layer ( as discussed above ) is coupled to the first surface ( [0017] In still another arrangement, a method includes providing a dielectric core material having a first surface and a second surface opposing the first surface; forming in a first conductive layer a first transformer coil overlying the first surface of the dielectric core; forming a first dielectric layer surrounding the first conductive layer ) of the core layer ( Fig. 8 #830 ), and wherein the second dielectric layer ( as discussed above ) is coupled to the second surface ( [0017] forming in a second conductive layer a second transformer coil overlying the second surface of the dielectric core; forming a second dielectric layer surrounding the second transformer coil ) of the core layer ( Fig. 8 #830 ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Massolini with Lambert and Cretu to implement a core layer, wherein the at least one magnetic layer includes a first magnetic layer, a second magnetic layer, wherein the at least one dielectric layer includes a first dielectric layer and a second dielectric layer, wherein the first magnetic layer is coupled to a first surface of the core layer, wherein the second magnetic layer is coupled to a second surface of the core layer, wherein the first dielectric layer is coupled to the first surface of the core layer, and wherein the second dielectric layer is coupled to the second surface of the core layer because this approach combines electrical isolation and capacitance control with magnetic coupling benefits. Claim 19: Lambert and Cretu disclose the substrate of claim 11 ( as discussed above ). Neither Lambert nor Cretu appear to disclose a core layer, wherein the at least one magnetic layer includes a first magnetic layer, a second magnetic layer, wherein the at least one dielectric layer includes a first dielectric layer and a second dielectric layer, wherein the first magnetic layer is coupled to a first surface of the core layer, wherein the second magnetic layer is coupled to a second surface of the core layer, wherein the first dielectric layer is coupled to the first surface of the core layer, and wherein the second dielectric layer is coupled to the second surface of the core layer. However, Massolini teaches a core layer ( Fig. 8 core layer 830 ), wherein the at least one magnetic layer ( Fig. 8 magnetic layers 810 and 812 ) includes a first magnetic layer ( Fig. 8 #810 ), a second magnetic layer ( Fig. 8 #812 ), wherein the at least one dielectric layer includes a first dielectric layer ( [0059] a first dielectric layer surrounding the at least one conductive layer ) and a second dielectric layer ( [0059] a second dielectric layer surrounding the at least one additional conductive layer ), wherein the first magnetic layer ( Fig. 8 #810 ) is coupled to a first surface of the core layer ( Fig. 8 #830 ), wherein the second magnetic layer ( Fig. 8 #812 ) is coupled to a second surface of the core layer ( Fig. 8 #830 ), wherein the first dielectric layer ( as discussed above ) is coupled to the first surface ( [0017] In still another arrangement, a method includes providing a dielectric core material having a first surface and a second surface opposing the first surface; forming in a first conductive layer a first transformer coil overlying the first surface of the dielectric core; forming a first dielectric layer surrounding the first conductive layer ) of the core layer ( Fig. 8 #830 ), and wherein the second dielectric layer ( as discussed above ) is coupled to the second surface ( [0017] forming in a second conductive layer a second transformer coil overlying the second surface of the dielectric core; forming a second dielectric layer surrounding the second transformer coil ) of the core layer ( Fig. 8 #830 ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Massolini with Lambert and Cretu to implement a core layer, wherein the at least one magnetic layer includes a first magnetic layer, a second magnetic layer, wherein the at least one dielectric layer includes a first dielectric layer and a second dielectric layer, wherein the first magnetic layer is coupled to a first surface of the core layer, wherein the second magnetic layer is coupled to a second surface of the core layer, wherein the first dielectric layer is coupled to the first surface of the core layer, and wherein the second dielectric layer is coupled to the second surface of the core layer because this approach combines electrical isolation and capacitance control with magnetic coupling benefits. Claim 25: Lambert and Cretu disclose the method of claim 21 ( as discussed above ). Neither Lambert nor Cretu appear to disclose a core layer, wherein the at least one magnetic layer includes a first magnetic layer, a second magnetic layer, wherein the at least one dielectric layer includes a first dielectric layer and a second dielectric layer, wherein the first magnetic layer is coupled to a first surface of the core layer, wherein the second magnetic layer is coupled to a second surface of the core layer, wherein the first dielectric layer is coupled to the first surface of the core layer, and wherein the second dielectric layer is coupled to the second surface of the core layer. However, Massolini teaches a core layer ( Fig. 8 core layer 830 ), wherein the at least one magnetic layer ( Fig. 8 magnetic layers 810 and 812 ) includes a first magnetic layer ( Fig. 8 #810 ), a second magnetic layer ( Fig. 8 #812 ), wherein the at least one dielectric layer includes a first dielectric layer ( [0059] a first dielectric layer surrounding the at least one conductive layer ) and a second dielectric layer ( [0059] a second dielectric layer surrounding the at least one additional conductive layer ), wherein the first magnetic layer ( Fig. 8 #810 ) is coupled to a first surface of the core layer ( Fig. 8 #830 ), wherein the second magnetic layer ( Fig. 8 #812 ) is coupled to a second surface of the core layer ( Fig. 8 #830 ), wherein the first dielectric layer ( as discussed above ) is coupled to the first surface ( [0017] In still another arrangement, a method includes providing a dielectric core material having a first surface and a second surface opposing the first surface; forming in a first conductive layer a first transformer coil overlying the first surface of the dielectric core; forming a first dielectric layer surrounding the first conductive layer ) of the core layer ( Fig. 8 #830 ), and wherein the second dielectric layer ( as discussed above ) is coupled to the second surface ( [0017] forming in a second conductive layer a second transformer coil overlying the second surface of the dielectric core; forming a second dielectric layer surrounding the second transformer coil ) of the core layer ( Fig. 8 #830 ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Massolini with Lambert and Cretu to implement a core layer, wherein the at least one magnetic layer includes a first magnetic layer, a second magnetic layer, wherein the at least one dielectric layer includes a first dielectric layer and a second dielectric layer, wherein the first magnetic layer is coupled to a first surface of the core layer, wherein the second magnetic layer is coupled to a second surface of the core layer, wherein the first dielectric layer is coupled to the first surface of the core layer, and wherein the second dielectric layer is coupled to the second surface of the core layer because this approach combines electrical isolation and capacitance control with magnetic coupling benefits. Claims 4-7, 14, and 22 are rejected under U.S.C. 103 as being unpatentable over Lambert et al.; US 2021/0125944 A1; 10/2019 in view of Cretu et al.; US 2023/0363735 A1 as it relates to claim 1 above and further in view of in view of Weis; US 11,398,334 B2; 07/2018 Claim 4: Lambert and Cretu disclose the package of claim 1 ( as discussed above). Neither Lambert nor Cretu appear to disclose the at least one magnetic layer surrounds at least part of the first set of interconnects that define the first inductor and the second set of interconnects that define the second inductor. However, Weis teaches the at least one magnetic layer ( Fig. 1: a closed magnetic core 114 ) surrounds at least part of the first set of interconnects ( Fig. 1: coil structure 110 ) that define the first inductor ( Fig. 1: top conductive element 116 ) and the second set of interconnects that define the second inductor ( Fig. 1: bottom conductive element 116 ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Weis with Lambert and Cretu to implement the at least one magnetic layer surrounds at least part of the first set of interconnects that define the first inductor and the second set of interconnects that define the second inductor because this would increase inductance and energy storage density while simultaneously reducing the physical size of the components and minimizing electromagnetic interference. Claim 5: Lambert and Cretu disclose the package of claim 1( as discussed above). Neither Lambert nor Cretu appear to disclose the at least one magnetic layer includes a first magnetic layer, wherein the at least one dielectric layer includes a first dielectric layer, a second dielectric layer and a third dielectric layer, wherein the first magnetic layer is located at least partially in the first dielectric layer, wherein the second dielectric layer is coupled to a first surface of the first dielectric layer, and wherein the third dielectric layer is coupled to a second surface of the first dielectric layer. However, Weis teaches the at least one magnetic layer ( Fig. 1 #114 ) includes a first magnetic layer ( Fig. 1: #114 ), wherein the at least one dielectric layer ( Fig. 1: dielectric matrix 118 ) includes a first dielectric layer ( Fig. 1: middle layer 118 ), a second dielectric layer ( Fig. 1: top layer 118 ) and a third dielectric layer ( Fig. 1: bottom layer 118 ), wherein the first magnetic layer ( Fig. 1 #114 ) is located at least partially in the first dielectric layer ( as shown in Fig. 1 ), wherein the second dielectric layer ( Fig. 1 top layer 118 ) is coupled to a first surface of the first dielectric layer ( Fig. 1 top surface of middle layer of 118 ), and wherein the third dielectric layer is coupled ( Fig. 1 bottom layer 118 ) to a second surface of the first dielectric layer ( Fig. 1 bottom surface of 118 ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Weis with Lambert and Cretu to implement the at least one magnetic layer includes a first magnetic layer, wherein the at least one dielectric layer includes a first dielectric layer, a second dielectric layer and a third dielectric layer, wherein the first magnetic layer is located at least partially in the first dielectric layer, wherein the second dielectric layer is coupled to a first surface of the first dielectric layer, and wherein the third dielectric layer is coupled to a second surface of the first dielectric layer because this creates an insulated, high-permeability magnetic core to maximize inductance. Claim 6: Lambert and Cretu disclose the package of claim 1 ( as discussed above ) Neither Lambert nor Cretu appear to disclose the at least one magnetic layer includes a first magnetic layer, a second magnetic layer, and a third magnetic layer, wherein the at least one dielectric layer includes a first dielectric layer, a second dielectric layer and a third dielectric layer, wherein the first magnetic layer is located at least partially in the first dielectric layer, wherein the second dielectric layer is coupled to a first surface of the first dielectric layer, wherein the third dielectric layer is coupled to a second surface of the first dielectric layer, wherein the second magnetic layer is coupled to a surface of the second dielectric layer, and wherein the third magnetic layer is coupled to a surface of the third dielectric layer. However, Weis teaches the at least one magnetic layer ( Fig. 1 #114 ) includes a first magnetic layer ( Fig. 1 #114 ), a second magnetic layer ( Fig. 1: top layer #124 ), and a third magnetic layer ( Fig. 1: bottom layer #124 ), wherein the at least one dielectric layer ( Fig. 1 #118 ) includes a first dielectric layer ( Fig. 1: middle layer #118 ), a second dielectric layer ( Fig. 1: top layer #118 ) and a third dielectric layer ( Fig. 1: bottom layer #118 ), wherein the first magnetic layer ( Fig. 1 #114 ) is located at least partially in the first dielectric layer ( as shown in Fig. 1 ), wherein the second dielectric layer ( Fig. 1 top layer #118 ) is coupled to a first surface of the first dielectric layer ( Fig. 1 top surface of middle layer #118 ), wherein the third dielectric layer ( Fig. 1 bottom layer #118 ) is coupled to a second surface of the first dielectric layer ( Fig. 1 bottom surface of middle layer #118 ), wherein the second magnetic layer ( Fig. 1 top layer #124 ) is coupled to a surface of the second dielectric layer ( Fig. 1 top layer 118 ), and wherein the third magnetic layer ( Fig. 1 bottom layer #124 ) is coupled to a surface of the third dielectric layer ( Fig. 1 bottom layer #118 ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Weis with Lambert and Cretu to implement the at least one magnetic layer includes a first magnetic layer, a second magnetic layer, and a third magnetic layer, wherein the at least one dielectric layer includes a first dielectric layer, a second dielectric layer and a third dielectric layer, wherein the first magnetic layer is located at least partially in the first dielectric layer, wherein the second dielectric layer is coupled to a first surface of the first dielectric layer, wherein the third dielectric layer is coupled to a second surface of the first dielectric layer, wherein the second magnetic layer is coupled to a surface of the second dielectric layer, and wherein the third magnetic layer is coupled to a surface of the third dielectric layer because this manages the magnetic coupling, enhances stability, and controls magnetization switching. Claim 7: Lambert, Cretu, and Weis disclose the package of claim 6 ( as discussed above ). Neither Lambert nor Cretu appear to disclose the first magnetic layer, the second magnetic layer and the third magnetic layer have a same magnetic property. However, Weis teaches the first magnetic layer ( Fig. 1 #114 ), the second magnetic layer ( Fig. 1 top magnetic layer #124 ) and the third magnetic layer ( Fig. 1 bottom magnetic layer #124 ) have a same magnetic property ( Col. 4 lines 12-13 In an embodiment, the magnetic core comprises a ferrite material ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Weis with Lambert and Cretu to implement the first magnetic layer, the second magnetic layer and the third magnetic layer have a same magnetic property because this would enhance the stability of the free layer against thermal fluctuations and increase the reading/writing efficiency. Claim 14: Lambert and Cretu disclose the substrate of claim 11 ( as discussed above). Neither Lambert nor Cretu appear to disclose the at least one magnetic layer surrounds at least part of the first set of interconnects that define the first inductor and the second set of interconnects that define the second inductor. However, Weis teaches the at least one magnetic layer ( Fig. 1: a closed magnetic core 114 ) surrounds at least part of the first set of interconnects ( Fig. 1: coil structure 110 ) that define the first inductor ( Fig. 1: top conductive element 116 ) and the second set of interconnects that define the second inductor ( Fig. 1: bottom conductive element 116 ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Weis with Lambert and Cretu to implement the at least one magnetic layer surrounds at least part of the first set of interconnects that define the first inductor and the second set of interconnects that define the second inductor because this approach enhances inductance and improves the quality factor. Claim 22: Lambert and Cretu disclose the substrate of claim 21 ( as discussed above). Neither Lambert nor Cretu appear to disclose the at least one magnetic layer surrounds at least part of the first set of interconnects that define the first inductor and the second set of interconnects that define the second inductor. However, Weis teaches the at least one magnetic layer ( Fig. 1: a closed magnetic core 114 ) surrounds at least part of the first set of interconnects ( Fig. 1: coil structure 110 ) that define the first inductor ( Fig. 1: top conductive element 116 ) and the second set of interconnects that define the second inductor ( Fig. 1: bottom conductive element 116 ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Weis with Lambert and Cretu to implement the at least one magnetic layer surrounds at least part of the first set of interconnects that define the first inductor and the second set of interconnects that define the second inductor because this approach enhances inductance and improves the quality factor. Claims 8 and 18 are rejected under U.S.C. 103 as being unpatentable over Lambert et al.; US 2021/0125944 A1; 10/2019 in view of Cretu et al.; US 2023/0363735 A1 in view of Weis; US 11,398,334 B2; 07/2018 and further in view of Chiu; US 2022/0406513 A1; 03/2022 Claim 8: Lambert, Cretu, and Weis disclose the package of claim 6 ( as discussed above). Neither Lambert nor Cretu nor Kidwell, Jr. appear to disclose one or more magnetic layers from the first magnetic layer, the second magnetic layer and/or the third magnetic layer have a different magnetic property. However, Chiu teaches one or more magnetic layers from the first magnetic layer ( Fig. 2 magnetic layer M1 ), the second magnetic layer ( Fig. 2 magnetic layer M2 ) and/or the third magnetic layer have a different magnetic property ( [0057] In the embodiments of the present disclosure, the magnetic permeability of each of the first magnetic layer M1, the second magnetic layer M2, the third magnetic layer M3, and the fourth magnetic layer M4 do not have to be the same ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Chiu with Lambert, Cretu, and Kidwell, Jr. to implement one or more magnetic layers from the first magnetic layer, the second magnetic layer and/or the third magnetic layer have a different magnetic property because this will enable spin-dependent functionalities. Claim 18: Lambert, Cretu, and Kidwell, Jr. disclose the substrate of claim 16 ( as discussed above). Neither Lambert nor Cretu nor Kidwell, Jr. appear to disclose one or more magnetic layers from the first magnetic layer, the second magnetic layer and/or the third magnetic layer have a different magnetic property. However, Chiu teaches one or more magnetic layers from the first magnetic layer ( Fig. 2 magnetic layer M1 ), the second magnetic layer ( Fig. 2 magnetic layer M2 ) and/or the third magnetic layer have a different magnetic property ( [0057] In the embodiments of the present disclosure, the magnetic permeability of each of the first magnetic layer M1, the second magnetic layer M2, the third magnetic layer M3, and the fourth magnetic layer M4 do not have to be the same ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Chiu with Lambert, Cretu, and Kidwell, Jr. to implement one or more magnetic layers from the first magnetic layer, the second magnetic layer and/or the third magnetic layer have a different magnetic property because this will enable spin-dependent functionalities. Claim 10 is rejected under U.S.C. 103 as being unpatentable over Lambert et al.; US 2021/0125944 A1; 10/2019 in view of Cretu et al.; US 2023/0363735 A1 as it related to claim 1 above and further in view of Yong et al.; US 2025/0015024 A1; 07/03/2023 Claim 10: Lambert and Cretu disclose the package of claim 1 ( as discussed above ). Neither Lambert nor Cretu appear to disclose the integrated device includes a power management integrated circuit (PMIC). However, Yong teaches the integrated device ( Fig. 4 #100 ) includes a power management integrated circuit (PMIC) ( [0037] An integrated device (e.g., 100, 300) may include a die (e.g., semiconductor bare die). The integrated device may include a power management integrated circuit (PMIC)). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Yong with Lambert and Cretu to implement the integrated device includes a power management integrated circuit (PMIC) because this approach leverages the devices energy storage and current smoothing capabilities. Claims 15-17 and 23-24 are rejected under U.S.C. 103 as being unpatentable over Lambert et al.; US 2021/0125944 A1; 10/2019 in view of Cretu et al.; US 2023/0363735 A1 in view of Kidwell, Jr. et al.; US 2019/0164681 A1; 11/2017 Claim 15: Lambert and Cretu disclose the substrate of claim 11 ( as discussed above ). Neither Lambert nor Cretu appear to disclose the at least one magnetic layer includes a first magnetic layer, wherein the at least one dielectric layer includes a first dielectric layer, a second dielectric layer and a third dielectric layer, wherein the first magnetic layer is located at least partially in the first dielectric layer, wherein the second dielectric layer is coupled to a first surface of the first dielectric layer, and wherein the third dielectric layer is coupled to a second surface of the first dielectric layer. However, Kidwell, Jr. teaches the at least one magnetic layer ( Fig. 5 magnetic layers 320, 322,324, and 326 ) includes a first magnetic layer ( Fig. 5: first magnetic layer 320 ), wherein the at least one dielectric layer ( Fig. 5 360, 562, 564, 566, and 568 ) includes a first dielectric layer ( Fig. 5: first dielectric layer 360 ), a second dielectric layer ( Fig. 5: second dielectric layer 562 ) and a third dielectric layer (Fig. 5: third dielectric layer 566 ), wherein the first magnetic layer ( Fig. 5 #320 ) is located at least partially ( as shown in Fig. 5 ) in the first dielectric layer ( Fig. 5 #360 ), wherein the second dielectric layer ( Fig. 5 #562 ) is coupled to a first surface of the first dielectric layer ( bottom surface of Fig. 5 #360 ), and wherein the third dielectric layer ( Fig. 5 #566 ) is coupled to a second surface of the first dielectric layer ( top surface of Fig. 5 #360 ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Kidwell, Jr. with Lambert and Cretu to implement the at least one magnetic layer includes a first magnetic layer, wherein the at least one dielectric layer includes a first dielectric layer, a second dielectric layer and a third dielectric layer, wherein the first magnetic layer is located at least partially in the first dielectric layer, wherein the second dielectric layer is coupled to a first surface of the first dielectric layer, and wherein the third dielectric layer is coupled to a second surface of the first dielectric layer because this design forms an integrated magnetic component. Claim 16: Lambert and Cretu disclose the substrate of claim 11 ( as discussed above ). Neither Lambert nor Cretu appear to disclose the at least one magnetic layer includes a first magnetic layer, a second magnetic layer, and a third magnetic layer, wherein the at least one dielectric layer includes a first dielectric layer, a second dielectric layer and a third dielectric layer, wherein the first magnetic layer is located at least partially in the first dielectric layer, wherein the second dielectric layer is coupled to a first surface of the first dielectric layer, wherein the third dielectric layer is coupled to a second surface of the first dielectric layer, wherein the second magnetic layer is coupled to a surface of the second dielectric layer, and wherein the third magnetic layer is coupled to a surface of the third dielectric layer. However, Kidwell, Jr. teaches the at least one magnetic layer ( Fig. 5: 320, 322, and 324 ) includes a first magnetic layer ( Fig. 5 #320 ), a second magnetic layer ( Fig. 5 #324), and a third magnetic layer ( Fig. 5 #326), wherein the at least one dielectric layer ( Fig. 5: 360, 562, 564, and 566) includes a first dielectric layer ( Fig. 5 #360 ), a second dielectric layer ( Fig. 5 #562 ) and a third dielectric layer ( Fig. 5 #566 ), wherein the first magnetic layer ( Fig. 5 #360 ) is located at least partially ( as shown in Fig. 5 ) in the first dielectric layer ( Fig. 5 #320 ), wherein the second dielectric layer ( Fig. 5 #562 ) is coupled to a first surface of the first dielectric layer ( top of Fig. 5 #360 ), wherein the third dielectric layer ( Fig. 5 #566 ) is coupled to a second surface of the first dielectric layer ( bottom of Fig. 5 #360 ), wherein the second magnetic layer ( Fig. 5 #324 ) is coupled ( as shown in Fig. 5 #324 is coupled to #562 ) to a surface of the second dielectric layer ( Fig. 5 #562 ) , and wherein the third magnetic layer ( Fig. 5 #326 ) is coupled ( as shown in Fig. 5 #326 is coupled to #566 ) to a surface of the third dielectric layer ( Fig. 5 #566 ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Kidwell, Jr. with Lambert and Cretu to implement the at least one magnetic layer includes a first magnetic layer, a second magnetic layer, and a third magnetic layer, wherein the at least one dielectric layer includes a first dielectric layer, a second dielectric layer and a third dielectric layer, wherein the first magnetic layer is located at least partially in the first dielectric layer, wherein the second dielectric layer is coupled to a first surface of the first dielectric layer, wherein the third dielectric layer is coupled to a second surface of the first dielectric layer, wherein the second magnetic layer is coupled to a surface of the second dielectric layer, and wherein the third magnetic layer is coupled to a surface of the third dielectric layer because this creates high-performance integrated magnetic components. Claim 17: Lambert, Cretu, and Kidwell, Jr. disclose the substrate of claim 16 ( as discussed above ). Neither Lambert nor Cretu appear to disclose the first magnetic layer, the second magnetic layer and the third magnetic layer have the same magnetic property. However, Kidwell, Jr. teaches the first magnetic layer ( Fig. 5 #320 ), the second magnetic layer ( Fig. 5 #324 ) and the third magnetic layer ( Fig. 5 #326 ) have the same magnetic property ( [0038] Each one or more of the first magnetic layer 320, the second magnetic layer 322, the third magnetic layer 324 and the fourth magnetic layer 326 may be comprised of the same material or of different material ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Kidwell, Jr. with Lambert and Cretu to implement the first magnetic layer, the second magnetic layer and the third magnetic layer have the same magnetic property because this establishes uniform, robust ferromagnetic ordering throughout a stacked structure. Claim 23: Lambert and Cretu disclose the method of claim 21 ( as discussed above ). Neither Lambert nor Cretu appear to disclose the at least one magnetic layer includes a first magnetic layer, wherein the at least one dielectric layer includes a first dielectric layer, a second dielectric layer and a third dielectric layer, wherein the first magnetic layer is located at least partially in the first dielectric layer, wherein the second dielectric layer is coupled to a first surface of the first dielectric layer, and wherein the third dielectric layer is coupled to a second surface of the first dielectric layer. However, Kidwell, Jr. teaches the at least one magnetic layer ( Fig. 5: 320, 322, and 324 ) includes a first magnetic layer ( Fig. 5 #320 ), a second magnetic layer ( Fig. 5 #324), and a third magnetic layer ( Fig. 5 #326), wherein the at least one dielectric layer ( Fig. 5: 360, 562, 564, and 566) includes a first dielectric layer ( Fig. 5 #360 ), a second dielectric layer ( Fig. 5 #562 ) and a third dielectric layer ( Fig. 5 #566 ), wherein the first magnetic layer ( Fig. 5 #360 ) is located at least partially ( as shown in Fig. 5 ) in the first dielectric layer ( Fig. 5 #320 ), wherein the second dielectric layer ( Fig. 5 #562 ) is coupled to a first surface of the first dielectric layer ( top of Fig. 5 #360 ), wherein the third dielectric layer ( Fig. 5 #566 ) is coupled to a second surface of the first dielectric layer ( bottom of Fig. 5 #360 ), wherein the second magnetic layer ( Fig. 5 #324 ) is coupled ( as shown in Fig. 5 #324 is coupled to #562 ) to a surface of the second dielectric layer ( Fig. 5 #562 ) , and wherein the third magnetic layer ( Fig. 5 #326 ) is coupled ( as shown in Fig. 5 #326 is coupled to #566 ) to a surface of the third dielectric layer ( Fig. 5 #566 ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Kidwell, Jr. with Lambert and Cretu to implement the at least one magnetic layer includes a first magnetic layer, a second magnetic layer, and a third magnetic layer, wherein the at least one dielectric layer includes a first dielectric layer, a second dielectric layer and a third dielectric layer, wherein the first magnetic layer is located at least partially in the first dielectric layer, wherein the second dielectric layer is coupled to a first surface of the first dielectric layer, and wherein the third dielectric layer is coupled to a second surface of the first dielectric layer because this would optimize magnetic performance. Claim 24: Lambert and Cretu disclose the method of claim 21 ( as discussed above ). Neither Lambert nor Cretu appear to disclose the at least one magnetic layer includes a first magnetic layer, a second magnetic layer, and a third magnetic layer, wherein the at least one dielectric layer includes a first dielectric layer, a second dielectric layer and a third dielectric layer, wherein the first magnetic layer is located at least partially in the first dielectric layer, wherein the second dielectric layer is coupled to a first surface of the first dielectric layer, wherein the third dielectric layer is coupled to a second surface of the first dielectric layer, wherein the second magnetic layer is coupled to a surface of the second dielectric layer, and wherein the third magnetic layer is coupled to a surface of the third dielectric layer. However, Kidwell, Jr. teaches the at least one magnetic layer ( Fig. 5: 320, 322, and 324 ) includes a first magnetic layer ( Fig. 5 #320 ), a second magnetic layer ( Fig. 5 #324), and a third magnetic layer ( Fig. 5 #326), wherein the at least one dielectric layer ( Fig. 5: 360, 562, 564, and 566) includes a first dielectric layer ( Fig. 5 #360 ), a second dielectric layer ( Fig. 5 #562 ) and a third dielectric layer ( Fig. 5 #566 ), wherein the first magnetic layer ( Fig. 5 #360 ) is located at least partially ( as shown in Fig. 5 ) in the first dielectric layer ( Fig. 5 #320 ), wherein the second dielectric layer ( Fig. 5 #562 ) is coupled to a first surface of the first dielectric layer ( top of Fig. 5 #360 ), wherein the third dielectric layer ( Fig. 5 #566 ) is coupled to a second surface of the first dielectric layer ( bottom of Fig. 5 #360 ), wherein the second magnetic layer ( Fig. 5 #324 ) is coupled ( as shown in Fig. 5 #324 is coupled to #562 ) to a surface of the second dielectric layer ( Fig. 5 #562 ) , and wherein the third magnetic layer ( Fig. 5 #326 ) is coupled ( as shown in Fig. 5 #326 is coupled to #566 ) to a surface of the third dielectric layer ( Fig. 5 #566 ). It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Kidwell, Jr. with Lambert and Cretu to implement the at least one magnetic layer includes a first magnetic layer, a second magnetic layer, and a third magnetic layer, wherein the at least one dielectric layer includes a first dielectric layer, a second dielectric layer and a third dielectric layer, wherein the first magnetic layer is located at least partially in the first dielectric layer, wherein the second dielectric layer is coupled to a first surface of the first dielectric layer, wherein the third dielectric layer is coupled to a second surface of the first dielectric layer, wherein the second magnetic layer is coupled to a surface of the second dielectric layer, and wherein the third magnetic layer is coupled to a surface of the third dielectric layer because this would manage magnetic coupling, enhance stability, and control magnetization switching. Response to Arguments Applicant’s arguments, see pages of remarks, filed 07/08/2026, with respect to the rejection of claims 1-2, 4-12, 14-19, and 21-25 under 35 U.S.C. 102 and 103 have been fully considered and are persuasive. Therefore, the rejection has been withdrawn. However, upon further consideration, a new ground(s) of rejection is made in view of Lambert, Cretu, Yong, Massolini, Weis, Kidwell, Jr., and Chiu. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to KIMBERLY N FREY whose telephone number is (571)272-5068. The examiner can normally be reached Monday - Friday 7:30 am - 5 pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Marlon Fletcher can be reached at (571)272-2063. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /K.N.F./Examiner, Art Unit 2817 /MARLON T FLETCHER/Supervisory Primary Examiner, Art Unit 2817
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Prosecution Timeline

Jul 27, 2023
Application Filed
Apr 08, 2026
Non-Final Rejection mailed — §102, §103
Jul 08, 2026
Response Filed
Sep 29, 2026
Non-Final Rejection mailed — §102, §103 (current)

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3y 5m (~2m remaining)
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