DETAILED ACTION
Notice of AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
This is the first office action in response to the Response to Claims filed on 10/02/2023
Claims 1-20 are examined
Claim Interpretation
The following is a quotation of 35 U.S.C. 112(f):
(f) Element in Claim for a Combination. – An element in a claim for a combination may be expressed as a means or step for performing a specified function without the recital of structure, material, or acts in support thereof, and such claim shall be construed to cover the corresponding structure, material, or acts described in the specification and equivalents thereof.
The claims in this application are given their broadest reasonable interpretation using the plain meaning of the claim language in light of the specification as it would be understood by one of ordinary skill in the art. The broadest reasonable interpretation of a claim element (also commonly referred to as a claim limitation) is limited by the description in the specification when 35 U.S.C. 112(f), is invoked.
As explained in MPEP § 2181, subsection I, claim limitations that meet the following three-prong test will be interpreted under 35 U.S.C. 112(f):
(A) the claim limitation uses the term “means” or “step” or a term used as a substitute for “means” that is a generic placeholder (also called a nonce term or a non-structural term having no specific structural meaning) for performing the claimed function;
(B) the term “means” or “step” or the generic placeholder is modified by functional language, typically, but not always linked by the transition word “for” (e.g., “means for”) or another linking word or phrase, such as “configured to” or “so that”; and
(C) the term “means” or “step” or the generic placeholder is not modified by sufficient structure, material, or acts for performing the claimed function.
Use of the word “means” (or “step”) in a claim with functional language creates a rebuttable presumption that the claim limitation is to be treated in accordance with 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph. The presumption that the claim limitation is interpreted under 35 U.S.C. 112(f) is rebutted when the claim limitation recites sufficient structure, material, or acts to entirely perform the recited function.
Absence of the word “means” (or “step”) in a claim creates a rebuttable presumption that the claim limitation is not to be treated in accordance with 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph. The presumption that the claim limitation is not interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, is rebutted when the claim limitation recites function without reciting sufficient structure, material or acts to entirely perform the recited function.
Claim limitations in this application that use the word “means” (or “step”) are being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, except as otherwise indicated in an Office action. Conversely, claim limitations in this application that do not use the word “means” (or “step”) are not being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, except as otherwise indicated in an Office action.
This application includes one or more claim limitations that do not use the word “means,” but are nonetheless being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, because the claim limitation(s) uses a generic placeholder that is coupled with functional language without reciting sufficient structure to perform the recited function and the generic placeholder is not preceded by a structural modifier. Such claim limitation(s) is/are: “heating element” in Claims 1-2, 8, 11-13, 16-20, “heating element segments” Claims 8 and 18.
Because this/these claim limitation(s) is/are being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, it/they is/are being interpreted to cover the corresponding structure described in the specification as performing the claimed function, and equivalents thereof.
The corresponding structure is an electrical heater and electrical heater segments (see [0018] and element 218).
If applicant does not intend to have this/these limitation(s) interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, applicant may: (1) amend the claim limitation(s) to avoid it/them being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph (e.g., by reciting sufficient structure to perform the claimed function); or (2) present a sufficient showing that the claim limitation(s) recite(s) sufficient structure to perform the claimed function so as to avoid it/them being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1-6, 11-15, and 20 are rejected under 35 U.S.C. 102(a)(1) as being anticipated Yeh (US 2023/0134957).
Regarding Claim 1: Yeh discloses a device (see annotated figure ‘957) comprising: a heating element (1200; Fig. 1B) occupying at least a portion of a layer (see annotated figure ‘957) of an integrated circuit (IC) (see annotated figure ‘957), the IC comprising a plurality of layers (see annotated figure ‘957) stacked in a lamination direction, the IC including a target component (1110; Fig. 1B); and a plurality of thermally conductive structures (see annotated figure ‘957) extending from the heating element through one or more layers of the plurality of layers of the IC (see annotated figure ‘957), the plurality of thermally conductive structures overlapping at least a portion of the target component in a lateral direction (see annotated figure ‘957) perpendicular to the lamination direction.
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Regarding Claim 2: Yeh discloses all the limitations of Claim 1, as stated above, and further discloses each thermally conductive structure comprises: a via (see annotated figure ‘957) having a first end (see annotated figure ‘957) in contact with the heating element and a second end (see annotated figure ‘957); and a plate (see annotated figure ‘957) in contact with the second end of the via, the plate extending toward the target component from the second end of the via (see annotated figure ‘957).
Regarding Claim 3: Yeh discloses all the limitations of Claim 2, as stated above, and further discloses the plate is longer than the via in a longitudinal direction perpendicular (see annotated figure ‘957) to the lamination direction and the lateral direction.
Regarding Claim 4: Yeh discloses all the limitations of Claim 1, as stated above, and further discloses wherein the plurality of thermally conductive structures is arranged along a longitudinal direction perpendicular (see annotated figure ‘957) to the lamination direction and the lateral direction.
Regarding Claim 6: Yeh discloses all the limitations of Claim 1, as stated above, and further discloses the plurality of thermally conductive structures has a respective plurality of sizes (see annotated figure ‘957) that vary along the longitudinal direction.
Regarding Claim 11: Yeh discloses all the limitations of Claim 1, as stated above, and further discloses the heating element is spaced apart from, and at least partially overlapping, the target component in the lamination direction (see annotated figure ‘957); and the device further comprises: a further plurality of thermally conductive structures (see annotated figure ‘957) extending from the heating element through one or more of the plurality of layers of the IC, the further plurality of thermally conductive structures overlapping at least a portion of the target component in a direction opposite the lateral direction (see annotated figure ‘957).
Regarding Claim 12: Yeh discloses An integrated circuit (IC) (see annotated figure ‘957) comprising: a plurality of layers (see annotated figure ‘957) stacked in a lamination direction (see annotated figure ‘957); a target component (1110; Fig. 1B); a heating element (1200; Fig. 1B) occupying at least a portion of a layer of the plurality of layers (see annotated figure ‘957); and a plurality of thermally conductive structures (see annotated figure ‘957) extending from the heating element through one or more layers of the plurality of layers (see annotated figure ‘957), the plurality of thermally conductive structures overlapping at least a portion of the target component (see annotated figure ‘957) in a lateral direction perpendicular to the lamination direction (see annotated figure ‘957).
Regarding Claim 13: Yeh discloses all the limitations of Claim 12, as stated above, and further discloses each thermally conductive structure comprises: a via (see annotated figure ‘957) having a first end (see annotated figure ‘957) in contact with the heating element and a second end (see annotated figure ‘957); and a plate (see annotated figure ‘957) in contact with the second end of the via, the plate extending toward the target component from the second end of the via (see annotated figure ‘957).
Regarding Claim 14: Yeh discloses all the limitations of Claim 13, as stated above, and further discloses the plate is longer than the via in a longitudinal direction perpendicular (see annotated figure ‘957) to the lamination direction and the lateral direction.
Regarding Claim 15: Yeh discloses all the limitations of Claim 12, as stated above, and further discloses wherein the plurality of thermally conductive structures is arranged along a longitudinal direction perpendicular (see annotated figure ‘957) to the lamination direction and the lateral direction.
Regarding Claim 19: Yeh discloses all the limitations of Claim 12, as stated above, and further discloses the heating element is spaced apart from, and at least partially overlapping, the target component in the lamination direction (see annotated figure ‘957); and the device further comprises: a further plurality of thermally conductive structures (see annotated figure ‘957) extending from the heating element through one or more of the plurality of layers of the IC, the further plurality of thermally conductive structures overlapping at least a portion of the target component in a direction opposite the lateral direction (see annotated figure ‘957).
Regarding Claim 20: Yeh discloses a method of manufacturing (the disclosure of the system discloses its method of manufacturing) an integrated circuit (IC) (see annotated figure ‘957), comprising: forming a plurality of layers (see annotated figure ‘957) of the IC stacked in a lamination direction (see annotated figure ‘957); forming a target component (1110; Fig. 1B) within a first one or more of the layers of the IC (see annotated figure ‘957); forming a heating element (1200; Fig. 1B) within a layer of the IC (see annotated figure ‘957); forming a plurality of thermally conductive vias (see annotated figure ‘957) through at least one of the first one or more layers, such that a first end (see annotated figure ‘957) of each via contacts the heating element, and such that at least one of the thermally conductive vias is in a lateral direction (see annotated figure ‘957), perpendicular to the lamination direction, from the target component; and forming, in contact with a second end of each via (see annotated figure ‘957), a thermally conductive plate (see annotated figure ‘957).
Allowable subject matter
Regarding Claims 7-10; and 16-18: Claims 7-10 and 16-18 would be allowable if rewritten, to correct the above double patent rejections, the above objections, and to include all of the limitations of the base claim and any intervening claims.
As allowable subject matter has been indicated, applicant's reply must either comply with all formal requirements or specifically traverse each requirement not complied with. See 37 CFR 1.111(b) and MPEP § 707.07(a).
The following is a statement of reasons for the indication of allowable subject matter:
Prior art fails to teach, “a first end electrical connection in contact with a first region of the heating element; and a second end electrical connection in contact with a second region of the heating element, wherein: the plurality of thermally conductive structures is located between the first region and the second region along the longitudinal direction; and the first end electrical connection and second end electrical connection are configured to pass an electrical current between the first region and the second region through the heating element”. Nota bene that in the interpretation of Yeh, the claimed “thermally conductive structures” are the electrical connections feeding the heater, and thus these electrical connections cannot be interpreted as the claimed “electrical connections”.
Pertinent Prior Art
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Please see notice of references cited.
Contact Information
Any inquiry concerning this communication or earlier communications from the examiner should be directed to RODOLPHE ANDRE CHABREYRIE whose telephone number is (571)272-3482. The examiner can normally be reached on 8:30-18:30.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Steven Crabb can be reached on 571-202-5095. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/RODOLPHE ANDRE CHABREYRIE/Primary Examiner, Art Unit 3761
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