Prosecution Insights
Last updated: April 19, 2026
Application No. 18/376,582

SYSTEMS AND METHODS FOR MONITORING THE SURFACE TEMPERATURE OF AN OBJECT USING THE TEMPERATURE-DEPENDENT ABSORPTION PROPERTIES OF SEMICONDUCTORS

Non-Final OA §102§103
Filed
Oct 04, 2023
Examiner
SADATE-MOUALEU, MIREILLE SANDRA
Art Unit
2855
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
TotalEnergies OneTech SAS
OA Round
1 (Non-Final)
90%
Grant Probability
Favorable
1-2
OA Rounds
2y 12m
To Grant
99%
With Interview

Examiner Intelligence

Grants 90% — above average
90%
Career Allow Rate
28 granted / 31 resolved
+22.3% vs TC avg
Moderate +12% lift
Without
With
+12.0%
Interview Lift
resolved cases with interview
Typical timeline
2y 12m
Avg Prosecution
17 currently pending
Career history
48
Total Applications
across all art units

Statute-Specific Performance

§103
54.3%
+14.3% vs TC avg
§102
31.4%
-8.6% vs TC avg
§112
14.4%
-25.6% vs TC avg
Black line = Tech Center average estimate • Based on career data from 31 resolved cases

Office Action

§102 §103
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claims 1-4, 7-8, 11, 13, 15-19, 22-23 and 26 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Johnson et al (US 5388909 A). Regarding claim 1, Johnson discloses in figures 1-14b a temperature monitoring system (optical method and apparatus for measuring the temperature of a substrate), comprising: an object having a surface whose temperature is to be monitored (the temperature of semiconductor substrates is measures; column 3 lines 49-51); a semiconductor member (5) mounted onto the surface of the object (Fig.1), the semiconductor member (5) having a temperature-dependent bandgap (a substrate material with a temperature dependent bandgap) with an absorption edge that varies with temperature (the absorption edge is broadened by the phonons; column 12 lines 23-24); a light source (Fig.1) configured to illuminate the semiconductor member (5) with monochromatic light (column 6 lines 66-68 and column 7 lines 2-4) having a wavelength equal to an absorption edge wavelength that is associated with the absorption edge when the semiconductor member (5) is at a specified temperature; and a detector (photodiode detector) configured to receive light reflected (Fig.1) from the semiconductor member (5) when illuminated with the monochromatic light (column 6 lines 66-68 and column 7 lines 2-4) such that a surface temperature of the object (Fig.1) is at the specified temperature (the photodiode is sensitive to a range of wavelengths spanning the optical bandgap in the temperature range of interest) when a change in an amount of reflected light that is received indicates that the wavelength of the monochromatic light (column 6 lines 66-68 and column 7 lines 2-4) is equal to the absorption edge wavelength at the specified temperature (column 6 lines 66-68 and column 7 lines 2-4). Regarding claim 2, Johnson discloses in figures 1-14b a temperature monitoring system (optical method and apparatus for measuring the temperature of a substrate), wherein the monochromatic light (Fig.1) is provided by the light source to the semiconductor member (5) over free space (column 5 lines 31-36 and Fig.1). Regarding claim 3, Johnson discloses in figures 1-14b a temperature monitoring system (optical method and apparatus for measuring the temperature of a substrate), wherein the reflected light (column 6 lines 32-33) is received by the detector (photodiode detector) from the semiconductor member (5) over free space (column 6 lines 60-67 and Fig.1). Regarding claim 4, Johnson discloses in figures 1-14b a temperature monitoring system (optical method and apparatus for measuring the temperature of a substrate), wherein the monochromatic light (column 6 lines 55-58) is provided by the light source (Fig.1) to the semiconductor member (5) over a first optical fiber (10) having a distal end (Fig.1) from which the monochromatic light (Fig.1) is emitted, the distal end (Fig.1) of the optical fiber (10) being spaced apart from the semiconductor member (5) by a gap over which the monochromatic light (column 5 lines 31-36) travels to illuminate the semiconductor member (5). Regarding claim 7, Johnson discloses in figures 1-14b a temperature monitoring system (optical method and apparatus for measuring the temperature of a substrate), wherein the light source (Fig.1) is a tunable light source (column 6 lines 65-66) configured to illuminate the semiconductor member (5) with monochromatic light that is tunable (the light that passes through the monochromator is wavelength controlled) over a range of wavelengths that encompasses the wavelength that is equal to the absorption edge (column 7 lines 1-5) wavelength that is associated with the absorption edge of the semiconductor member (5) when the semiconductor member is at the specified temperature (column 7 lines 1-5). Regarding claim 8, Johnson discloses in figures 1-14b a temperature monitoring system (optical method and apparatus for measuring the temperature of a substrate), wherein the object (Fig.9) whose surface temperature is to be monitored is a rotating object (Fig.9) and the semiconductor member (5) is mounted at a radial distance from an axis of rotation (Fig. 9) such that it is illuminated by the monochromatic light at one time during a rotation of the rotating object (Figs. 9 and 10; column 12 lines 1-3). Regarding claim 11, Johnson discloses in figures 1-14b a temperature monitoring system (optical method and apparatus for measuring the temperature of a substrate), wherein the semiconductor member (5) is a direct bandgap semiconductor (GaAs; column 12 lines 19-28). Regarding claim 13, Johnson discloses in figures 1-14b a temperature monitoring system (optical method and apparatus for measuring the temperature of a substrate), wherein the detector is a photodetector (photodiode; column 6 lines 66-67). Regarding claim 15, Johnson discloses in figures 1-14b a temperature monitoring system (optical method and apparatus for measuring the temperature of a substrate), wherein the semiconductor member (5) is GaAs (column 12 lines 19-28) or InP. Regarding claim 16, Johnson discloses in figures 1-14b a method for monitoring a surface temperature of an object (optical method and apparatus for measuring the temperature of a substrate), comprising: illuminating a semiconductor member (5) mounted onto the surface of the object (Fig.1) with monochromatic light (Fig.1), the semiconductor member (5) having a temperature-dependent bandgap (a substrate material with a temperature dependent bandgap) with an absorption edge that varies with temperature (the absorption edge is broadened by the phonons; column 12 lines 23-24), the monochromatic light having a wavelength equal to an absorption edge (column 6 lines 66-67 and column 7 lines 2-4) wavelength that is associated with the absorption edge when the semiconductor member (5) is at a specified temperature (column 6 lines 66-67 and column 7 lines 2-4); and receiving light reflected (Fig.1) from the semiconductor member (5) when illuminated with the monochromatic light (Fig.1) such that a surface temperature of the object (Fig.1) is at the specified temperature when a change in an amount of reflected light (Fig.1) that is received indicates that the wavelength of the monochromatic light is equal to the absorption edge wavelength at the specified temperature (the photodiode detector is sensitive to range of wavelengths spanning the optical bandgap in the temperature range of interest; column 6 lines 66-67 and column 7 lines 2-4). Regarding claim 17, Johnson discloses in figures 1-14b a method for monitoring a surface temperature of an object (optical method and apparatus for measuring the temperature of a substrate), further comprising providing the monochromatic light (Fig.1) to the semiconductor member (5) from the light source over free space (column 5 lines 31-36 and Fig.1). Regarding claim 18, Johnson discloses in figures 1-14b a method for monitoring a surface temperature of an object (optical method and apparatus for measuring the temperature of a substrate), further comprising receiving the reflected light (column 6 lines 32-33) from the semiconductor member (5) over free space (column 6 lines 60-67 and Fig.1). Regarding claim 19, Johnson discloses in figures 1-14b a method for monitoring a surface temperature of an object (optical method and apparatus for measuring the temperature of a substrate), further comprising providing the monochromatic light (Fig.1) to the semiconductor member (5) from the light source over a first optical fiber (10) having a distal end (Fig.1) from which the monochromatic light (Fig.1) is emitted, the distal end (Fig.1) of the optical fiber (10) being spaced apart (Fig.1) from the semiconductor member (5) by a gap over which the monochromatic light (Fig.1) travels to illuminate the semiconductor member (5). Regarding claim 22, Johnson discloses in figures 1-14b a method for monitoring a surface temperature of an object (optical method and apparatus for measuring the temperature of a substrate), wherein the light source (Fig.1) is a tunable light source (column 6 lines 65-66) configured to illuminate the semiconductor member (5) with monochromatic light that is tunable (the light that passes through the monochromator is wavelength controlled) over a range of wavelengths that encompasses the wavelength that is equal to the absorption edge (column 7 lines 1-5) wavelength that is associated with the absorption edge (column 7 lines 1-5) of the semiconductor member (5) when the semiconductor member (5) is at the specified temperature (column 7 lines 1-5). Regarding claim 23, Johnson discloses in figures 1-14b a method for monitoring a surface temperature of an object (optical method and apparatus for measuring the temperature of a substrate), wherein the object (Fig.9) whose surface temperature is to be monitored is a rotating object (Fig.9) and the semiconductor member (5) is mounted at a radial distance from an axis of rotation (Fig.9) such that it is illuminated by the monochromatic light at one time during a rotation of the rotating object (Figs. 9 and 10; column 12 lines 1-3). Regrading claim 26, Johnson discloses in figures 1-14b a temperature monitoring system (optical method and apparatus for measuring the temperature of a substrate), wherein the semiconductor member (5) is selected from the group consisting of GaAs, AlAs, InP, InSb, GaN, GaSb (GaAs which is a direct bandgap semiconductor may be used as the semiconductor substrate; column 12 lines 19-28). Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows: 1. Determining the scope and contents of the prior art. 2. Ascertaining the differences between the prior art and the claims at issue. 3. Resolving the level of ordinary skill in the pertinent art. 4. Considering objective evidence present in the application indicating obviousness or nonobviousness. Claims 5-6, 9, 20-21 and 24 are rejected under 35 U.S.C. 103 as being unpatentable over Johnson et al in view of Taylor II et al (US 20050106876 A1). Regarding claim 5, Johnson discloses in figures 1-14b a temperature monitoring system (optical method and apparatus for measuring the temperature of a substrate), wherein the reflected light (Fig.1) is received by the detector (Fig.1) from the semiconductor member (5). Johnson fails to explicitly disclose a second optical fiber. Taylor teaches a second optical fiber (an optical fiber assembly 27, including a first optical fiber 28 and a second optical fiber 30). It would have been obvious to one of ordinary skill, in the art before the effective filing date of the claimed invention, to modify Johnson’s apparatus for measuring the temperature to include multiple optical fibers as taught by Taylor because this will improve the distribution of separate optical signals to various components. Regarding claim 6, Johnson discloses in figures 1-14b a temperature monitoring system (optical method and apparatus for measuring the temperature of a substrate). Johnson fails to explicitly disclose wherein the first and second optical fibers include a common optical fiber. Taylor teaches the first (28) and second (30) optical fibers include a common optical fiber (bifurcated silica/silica fiber). It would have been obvious to one of ordinary skill, in the art before the effective filing date of the claimed invention, to modify Johnson’s apparatus for measuring the temperature to include bifurcated silica/silica fiber as taught by Taylor because this will greatly improve transmission and collection of light in the system. Regarding claim 9, Johnson discloses in figures 1-14b a temperature monitoring system (optical method and apparatus for measuring the temperature of a substrate), wherein the semiconductor member (5) Johnson fails to explicitly disclose comprises a plurality of semiconductor members that are each mounted at a common radial distance from the axis of rotation. Taylor teaches a plurality of semiconductor members (20) that are each mounted at a common radial distance from the axis of rotation (Fig.13; para [0035] and [0066]). It would have been obvious to one of ordinary skill, in the art before the effective filing date of the claimed invention, to modify Johnson’s method/apparatus for measuring the temperature to include multiple semiconductors as taught by Taylor because this will greatly improve the monitoring of surface. Regarding claim 20, Johnson discloses in figures 1-14b a method for monitoring a surface temperature of an object (optical method and apparatus for measuring the temperature of a substrate), further comprising receiving the reflected light (Fig.1) from the semiconductor member (5). Johnson fails to explicitly disclose a second optical fiber. Taylor teaches a second optical fiber (30). It would have been obvious to one of ordinary skill, in the art before the effective filing date of the claimed invention, to modify Johnson’s apparatus for measuring the temperature to include multiple optical fibers as taught by Taylor because this will improve the distribution of separate optical signals to various components. Regarding claim 21, Johnson discloses in figures 1-14b a method for monitoring a surface temperature of an object (optical method and apparatus for measuring the temperature of a substrate). Johnson fails to explicitly disclose wherein the first and second optical fibers include a common optical fiber. Taylor teaches the first (28) and second (30) optical fibers include a common optical fiber (bifurcated silica/silica fiber). It would have been obvious to one of ordinary skill, in the art before the effective filing date of the claimed invention, to modify Johnson’s apparatus for measuring the temperature to include bifurcated silica/silica fiber as taught by Taylor because this will greatly improve transmission and collection of light in the system. Regarding claim 24, Johnson discloses in figures 1-14b a method for monitoring a surface temperature of an object (optical method and apparatus for measuring the temperature of a substrate), wherein the semiconductor member (5). Johnson fails to explicitly disclose comprises a plurality of semiconductor members that are each mounted at a common radial distance from the axis of rotation. Taylor teaches a plurality of semiconductor members (20) that are each mounted at a common radial distance from the axis of rotation (Fig.13; para [0035] and [0066]). It would have been obvious to one of ordinary skill, in the art before the effective filing date of the claimed invention, to modify Johnson’s method/apparatus for measuring the temperature to include multiple semiconductors as taught by Taylor because this will greatly improve the monitoring of surface. Claims 10, 12, 14 and 25 are rejected under 35 U.S.C. 103 as being unpatentable over Johnson et al in view of Buller et al (WO 2016094827 A1). Regarding claim 10, Johnson discloses in figures 1-14b a temperature monitoring system (optical method and apparatus for measuring the temperature of a substrate). Johnson fails to explicitly disclose at least one fiducial marker located on the rotating object such that reflected light received from the at least one fiducial marker allows mechanical information concerning the rotating object to be determined. Buller teaches at least one fiducial marker (203) located on the rotating object (para [0192]) such that reflected light received from the at least one fiducial marker (203) allows mechanical information concerning the rotating object (para [0192]) to be determined. It would have been obvious to one of ordinary skill, in the art before the effective filing date of the claimed invention, to modify Johnson’s apparatus for measuring the temperature to include fiducial markers as taught by Buller because this will improve the tracking of the rotational movement of the surface. Regarding claim 12, Johnson discloses in figures 1-14b a temperature monitoring system (optical method and apparatus for measuring the temperature of a substrate); light source (Fig.1). Johnson fails to explicitly disclose wherein a laser. Buller teaches a laser (laser diode; para [0165]) It would have been obvious to one of ordinary skill, in the art before the effective filing date of the claimed invention, to modify Johnson’s apparatus for measuring the temperature to include a laser diode as taught by Buller because this will improve the non-contact temperature measurements. Regarding claim 14, Johnson discloses in figures 1-14b a temperature monitoring system (optical method and apparatus for measuring the temperature of a substrate); wherein the detector is a photodetector (photodiodes). Johnson fails to explicitly disclose array. Buller teaches array (The multiplicity of sensors may be arranged in an array or matrix). It would have been obvious to one of ordinary skill, in the art before the effective filing date of the claimed invention, to modify Johnson’s apparatus for measuring the temperature to include a sensor array as taught by Buller because this will improve temperature monitoring by allowing the signals to be read at different angles. Regarding claim 25, Johnson discloses in figures 1-14b a method for monitoring a surface temperature of an object (optical method and apparatus for measuring the temperature of a substrate). Johnson fails to explicitly disclose further comprising receiving reflected light from at least one fiducial marker located on the rotating object such that the reflected light received from the at least one fiducial marker allows mechanical information concerning the rotating object to be determined. Buller teaches receiving reflected light (para [0192]) from at least one fiducial marker (203) located on the rotating object (para [0192]) such that the reflected light received (para [0192]) from the at least one fiducial marker (203) allows mechanical information concerning the rotating object to be determined (para [0192]). It would have been obvious to one of ordinary skill, in the art before the effective filing date of the claimed invention, to modify Johnson’s apparatus for measuring the temperature to include fiducial markers as taught by Buller because this will improve the tracking of the rotational movement of the surface. Claim 27 is rejected under 35 U.S.C. 103 as being unpatentable over Johnson et al in view of Bour et al (US 20120118224 A1). Regarding claim 27, Johnson discloses in figures 1-14b a temperature monitoring system (optical method and apparatus for measuring the temperature of a substrate), wherein the semiconductor member (5). Johnson fails to explicitly disclose selected from the group consisting of AlGaAs, InGaP, InGaN, InGaP Bour teaches selected from the group consisting of AlGaAs, InGaP, InGaN, InGaP (the semiconductor disposed on the substrate may be InGaN; para [0024]). It would have been obvious to one of ordinary skill, in the art before the effective filing date of the claimed invention, to modify Johnson’s apparatus for measuring the temperature to include the semiconductor InGaN as taught by Bour because this will greatly improve temperature monitoring of specific temperature ranges. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to MIREILLE SANDRA SADATE-MOUALEU whose telephone number is (571)272-2862. The examiner can normally be reached Mon-Fri 0730-1700. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Peter Macchiarolo can be reached at 571-272-2375. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /MIREILLE S SADATE-MOUALEU/ Examiner, Art Unit 2855 /PETER J MACCHIAROLO/ Supervisory Patent Examiner, Art Unit 2855
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Prosecution Timeline

Oct 04, 2023
Application Filed
Dec 05, 2025
Non-Final Rejection — §102, §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
90%
Grant Probability
99%
With Interview (+12.0%)
2y 12m
Median Time to Grant
Low
PTA Risk
Based on 31 resolved cases by this examiner. Grant probability derived from career allow rate.

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