Last updated: July 05, 2026

Application No. 18/416,041

MANUFACTURING DEVICE AND MANUFACTURING METHOD FOR SINTERED BODY

Non-Final OA

Filed

Jan 18, 2024

Priority

Jan 30, 2023 — JP 2023-011893 +1 more

Examiner

PATEL, DEVANG R

Art Unit

1735

Tech Center

1700 — Chemical & Materials Engineering

Assignee

Samsung Electronics Co., Ltd.

OA Round

1 (Non-Final)

Interview Optional

— +39.3% interview lift. Interview already conducted in this application's prosecution history. This examiner has a 65% grant rate with +39.3% interview lift. Since an interview has already been tried, recommend written response with narrowed claims based on precedent claim evolution patterns.

Based on 1025 resolved cases, 2023–2026

Examiner Intelligence

PATEL, DEVANG R View full profile →

Grants 65% — above average

Career Allowance Rate

669 granted / 1025 resolved

At TC average

Strong +39% interview lift

Without

With

+39.3%

Interview Lift

resolved cases with interview

Typical timeline

2y 10m

Avg Prosecution

40 currently pending

Career history

1084

Total Applications

across all art units

Statute-Specific Performance

§103

90.0%

+50.0% vs TC avg

§102

3.6%

-36.4% vs TC avg

§112

2.3%

-37.7% vs TC avg

Black line = Tech Center average estimate • Based on career data from 1025 resolved cases

Prosecution Timeline

Jan 18, 2024

Application Filed

Apr 07, 2026

Non-Final Rejection mailed

May 18, 2026

Examiner Interview Summary

May 18, 2026

Applicant Interview (Telephonic)

Precedent Cases

Applications granted by this same examiner with similar technology

18/973,520

Patent 12667901

HEAT TREATMENT FURNACE APPARATUS

1y 6m to grant Granted Jun 30, 2026

18/431,083

Patent 12662720

COPPER ALLOY, SEMIFINISHED PRODUCT AND ELECTRICAL CONNECTING ELEMENT COMPRISING A COPPER ALLOY

2y 4m to grant Granted Jun 23, 2026

18/588,348

Patent 12654248

SYSTEM AND METHOD FOR COMBINED WAVE SOLDER FLOW DESIGN

2y 3m to grant Granted Jun 16, 2026

18/609,294

Patent 12654223

PRESSURE-SINTERING METHOD EMPLOYING DEFORMATION UPTAKE MEANS

2y 2m to grant Granted Jun 16, 2026

19/024,282

Patent 12654253

METHOD FOR FRICTION STIR PROCESSING FOR THE END SURFACE OF AGE-HARDENING ALUMINUM ALLOY PLATES

1y 5m to grant Granted Jun 16, 2026

Study what changed to get past this examiner. Based on 5 most recent grants.

Strategy Recommendation AI-generated — please review before filing

Get a prosecution strategy drawn from examiner precedents, rejection analysis, and claim mapping.

Typically takes 5-10 seconds — AI-generated, attorney review required before filing

Prosecution Projections

1-2

Expected OA Rounds

65%

Grant Probability

99%

With Interview (+39.3%)

2y 10m (~5m remaining)

Median Time to Grant

Low

PTA Risk

Based on 1025 resolved cases by this examiner. Grant probability derived from career allowance rate.