Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Applicant’s election without traverse of Specie shown in fig. 4 in the reply filed on January 15, 2026 is acknowledged. Applicant withdraws claim 7 as it claims a non-elected specie. Examiner notices that claim 12 claims a non-elected specie shown in fig. 5. Thus, claim 12 is also withdrawn from consideration.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 9-11, 13, 14 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Bonkohara (PG Pub 2011/0122303 A1).
Regarding claim 9, Bonkohara teaches an integrated assembly for an imaging device comprising: a pixel array (23, fig. 1); a transparent substrate (SOG 50) affixed to the pixel array; a non-flat film (60) disposed on the transparent substrate; and a light shield (63, abstract) configured to block light at a periphery of the pixel array, wherein the light shield is disposed on the transparent substrate.
Regarding claim 10, Bonkohara teaches the integrated assembly of claim 9, wherein the transparent substrate comprises a glass substrate (spin on glass, SOG, 50, paragraph [0158]) that is bonded to the pixel array and wherein the light shield is formed on a periphery of the glass substrate.
Regarding claim 11, Bonkohara teaches the integrated assembly of claim 10, wherein the pixel array and glass substrate are part of a chip size package (fig. 1).
Regarding claim 13, Bonkohara teaches an imaging device, comprising a lens group (22, fig. 1) and an integrated assembly according to claim 9.
Regarding claim 14, Bonkohara teaches a camera module including an imaging apparatus, the imaging apparatus comprising: integrated assembly according to claim 9; and a plurality of lenses (22, fig. 1) mounted apart from the pixel array.
Claim Rejections - 35 USC § 103
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows:
1. Determining the scope and contents of the prior art.
2. Ascertaining the differences between the prior art and the claims at issue.
3. Resolving the level of ordinary skill in the pertinent art.
4. Considering objective evidence present in the application indicating obviousness or nonobviousness.
Claim(s) 1 is/are rejected under 35 U.S.C. 103 as being unpatentable over Bonkohara (PG Pub 2011/0122303 A1) and Shibazaki et al (PG Pub 2012/0140100 A1).
Regarding claim 1, Bonkohara teaches an electronic apparatus comprising: a solid state image sensor comprising: an integrated assembly comprising: a pixel array (23, fig. 1); an optical assembly comprising one or more transparent materials (60) mounted with the pixel array in the integrated assembly; and a light shield (63, abstract) arranged to block light at a periphery of the integrated assembly, wherein a part of the light shield is disposed on at least one of the one or more transparent materials and wherein a width of a substrate (50 or 11) including the pixel array is the same as a width of the optical assembly; a plurality of lenses (22) mounted apart from the pixel array.
Bonkohara does not teach a signal processing circuit arranged to receive signals from sensors in the pixel array; a memory arranged to store image data; a monitor arranged to display image data; and a control circuit configured to control transfer of signal electric charges in the solid state image sensor.
In the same field of endeavor, Shibazaki teaches a signal processing circuit (202, fig. 1, paragraph [0060]) arranged to receive signals from sensors in the pixel array; a memory (207/203) arranged to store image data; a monitor (209) arranged to display image data; and a control circuit (201) configured to control transfer of signal electric charges in the solid state image sensor, for the benefits of processing light into images for display.
Thus, it would have been obvious to the skilled in the art before the effective filing date of the invention to include a signal processing circuit arranged to receive signals from sensors in the pixel array; a memory arranged to store image data; a monitor arranged to display image data; and a control circuit configured to control transfer of signal electric charges in the solid state image sensor, for the benefits of processing light into images for display.
Claim(s) 2-6 and 8 is/are rejected under 35 U.S.C. 103 as being unpatentable over Arayama et al (PG Pub 2016/0091643 A1) and Hamada et al (PG Pub 2017/0283587 A1).
Regarding claim 2, Arayama teaches an integrated assembly for an imaging device comprising: a pixel array (100, figs. 1 and 2); an optical assembly comprising one or more transparent materials (30/42, paragraph [0400]) mounted with the pixel array in the integrated assembly; wherein a width of a substrate including the pixel array is the same as a width of the optical assembly (fig. 2), wherein the optical assembly comprises a glass substrate (30, paragraph [0400]) and an infrared filter (42, paragraph [0400]), the integrated assembly further comprising a non-flat film (40) disposed on the infrared filter.
Arayama does not teach a light shield arranged to block light at a periphery of the integrated assembly, wherein a part of the light shield is disposed on at least one of the one or more transparent materials.
In the same field of endeavor, Hamada teaches a light shield (11, fig. 4) arranged to block light at a periphery of the integrated assembly (3 and 6), wherein a part of the light shield is disposed on at least one of the one or more transparent materials (IR filter 6), for the benefit of reducing reflection (paragraphs [0005][0006]).
Thus, it would have been obvious to the skilled in the art before the effective filing date of the invention to arrange a light shield to block light at a periphery of the integrated assembly, wherein a part of the light shield was disposed on at least one of the one or more transparent materials for the benefit of reducing reflection.
Regarding claim 3, Arayama teaches the integrated assembly of claim 2, wherein the glass substrate is bonded directly to the pixel array with an adhesive layer (20, paragraph [0492]).
Regarding claim 4, Arayama teaches an integrated assembly for an imaging device comprising: a pixel array (in 100, figs. 1 and 2); a glass substrate (30, paragraph [0400]) affixed to the pixel array with an adhesive layer (20, paragraph [0492]); an infrared filter (42, paragraph [0400]) affixed to the glass substrate; a non-flat film (40) affixed to the infrared filter.
Arayama does not teach a light shield configured to block light at a periphery of the pixel array, wherein the light shield is disposed on the glass substrate or on the infrared filter.
In the same field of endeavor, Hamada teaches a light shield (11, fig. 4) configured to block light at a periphery of the pixel array (3), wherein the light shield is disposed on the glass substrate or on the infrared filter (6), for the benefit of reducing reflection (paragraphs [0005][0006]).
Thus, it would have been obvious to the skilled in the art before the effective filing date of the invention to configure a light shield to block light at a periphery of the pixel array, wherein the light shield was disposed on the glass substrate or on the infrared filter.
Regarding claim 5, Arayama teaches the integrated assembly of claim 4, wherein the glass substrate and the adhesive layer are in direct contact with each other and wherein the pixel array and the adhesive layer are in direct contact with each other (figs. 1 and 2).
Regarding claim 6, Arayama teaches the integrated assembly of claim 4, wherein the glass substrate is affixed to the pixel array with no cavity between the glass substrate and the pixel array (figs. 1 and 2).
Regarding claim 8, Arayama teaches the integrated assembly of claim 4, wherein a width of a substrate (10, figs. 1 and 2) including the pixel array is the same as a width of the glass substrate.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to FEIFEI YEUNG LOPEZ whose telephone number is (571)270-1882. The examiner can normally be reached M-F: 8am to 4pm EST.
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Dale Page can be reached at 571 270 7877. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000.
/FEIFEI YEUNG LOPEZ/Primary Examiner, Art Unit 2899