DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 1-10 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
Wit regards to claim 1, it is not understood as to what is being claimed as to “a construction of the semiconductor device”, “affords at least one of the sensor layer”, “the sensor protection against further mechanical stresses” as the DETAILED DESCRIPTION fails to suggest or discloses as to how the “semiconductor device” is constructed, what the term “affords” at least on of the sensor layer as the term “affords is vague and undetermined, how the sensor protection against further mechanical stresses is determined and / or provided, thus rendering the claim as indefinite.
With regards to claim 2, it is not understood as to what is being claimed as to “a deformable component which is configured to protect the at least one of the sensor layer” as the DETAILED DESCRIPTION fails to suggest or discloses as to how this function is to be performed, thus rendering the claim as indefinite. Claims 3 & 4 are depended therefrom claim 2.
With regards to claim 5, it is not understood as to what is being claimed as to the “deformable component” and “an adhesive connection of the sensor chip to a wall of the cavity housing” as the DETAILED DESCRIPTION fails to suggest or discloses as to these limitations are referring to thus rendering the claim as indefinite.
With regards to claim 6, it is not understood as to what is being claimed as to “mechanical stress of the sensor is dependent on one or more of a piezoresistive effect or a piezomagnetic effect” as the DETAILED DESCRIPTION fails to suggest or discloses as to these limitations are referring to thus rendering the claim as indefinite. With regards to claim 8 depends thereof claim 6.
With regards to claim 7, it is not understood as to what is being claimed as to “mechanical stress of the sensor comprises a difference measurement” as the DETAILED DESCRIPTION fails to suggest or discloses as to these limitations are referring to thus rendering the claim as indefinite.
With regards to claim 9, it is not understood as to what is being claimed as to “a construction of the semiconductor device”, “an exposed sensor layer”, “at least one of the sensor layer or the sensor against thermally induced further mechanical stresses” as the DETAILED DESCRIPTION fails to suggest or discloses as to these limitations are referring to thus rendering the claim as indefinite.
With regards to claim 10, it is not understood as to what is being claimed as to “a construction of the semiconductor device”, “contacting the sensor layer with the medium”, “detecting the change in the mechanical stress of the sensor layer using the sensor” as the DETAILED DESCRIPTION fails to suggest or discloses as to these limitations are referring to thus rendering the claim as indefinite.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to FRANCIS C GRAY whose telephone number is (571)270-3348. The examiner can normally be reached Monday-Friday 7am-5pm.
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/FRANCIS C GRAY/ Primary Examiner, Art Unit 2852