Prosecution Insights
Last updated: October 26, 2026
Application No. 18/503,886

INDUCTOR COMPONENT

Non-Final OA §102§103
Filed
Nov 07, 2023
Priority
Nov 08, 2022 — JP 2022-178845
Examiner
HINSON, RONALD
Art Unit
Tech Center
Assignee
Murata Manufacturing Co., Ltd.
OA Round
1 (Non-Final)
74%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
88%
With Interview

Examiner Intelligence

Grants 74% — above average
74%
Career Allowance Rate
590 granted / 798 resolved
+13.9% vs TC avg
Moderate +14% lift
Without
With
+14.1%
Interview Lift
resolved cases with interview
Typical timeline
3y 0m
Avg Prosecution
35 currently pending
Career history
833
Total Applications
across all art units

Statute-Specific Performance

§101
0.1%
-39.9% vs TC avg
§103
57.0%
+17.0% vs TC avg
§102
23.4%
-16.6% vs TC avg
§112
15.5%
-24.5% vs TC avg
Black line = Tech Center average estimate • Based on career data from 798 resolved cases

Office Action

§102 §103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant’s election of Species 4 (Figure 7, claims 1-3, 5, 7-11, 16, 17, 19 and 20) in the reply filed on 09/01/26 is acknowledged. Because applicant did not distinctly and specifically point out the supposed errors in the restriction requirement, the election has been treated as an election without traverse (MPEP § 818.01(a)). Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. 1 Claims 1 and 5 are rejected under 35 U.S.C. 102a1 as being anticipated by Hirai et al.(US 20190244743). Regarding claim 1, Hirai et al. (figures 1-2, 4-5 and 0058-0094/0131-0145) discloses an element body (see figure 2) which includes a magnetic layer (10) and includes a first principal surface and a second principal surface opposite to each other (see figures 2/4-5); a coil (21) which is in the element body (see figures 2/4-5); and an insulation layer (15) which covers a part of an outer surface of the coil (see figures 2/4-5); the coil including a first inductor wire wound along a plane orthogonal to a first direction which is orthogonal to the first principal surface and is from the second principal surface toward the first principal surface (see figures 2/4-5); and at least a part of an inner peripheral surface of an innermost periphery of the first inductor wire being in contact with the magnetic layer (see figures 2/4-5). Regarding claim 5, Hirai et al. (figures 1-2 and figures 4-5) discloses wherein the first inductor wire includes a top surface facing a side of the first direction, at least a 110part of the top surface of the first inductor wire is in contact with the magnetic layer (see figures 2/4-5)., and a portion of the top surface of the first inductor wire, the portion being in contact with the magnetic layer, is continuous with the inner peripheral surface of the innermost periphery of the first inductor wire(see figures 2/4-5). 2. Claim 1 is rejected under 35 U.S.C. 102a1 as being anticipated by Lee et al.(US 20090322458). Regarding claim 1, Lee et al. (figure 3a, 4-5 and 0039-0041) discloses an element body (see figure 3a) which includes a magnetic layer (106) and includes a first principal surface and a second principal surface opposite to each other (see figure 3a); a coil (102) which is in the element body (see figure 3a); and an insulation layer (112) which covers a part of an outer surface of the coil (see figure 3a); the coil including a first inductor wire wound along a plane orthogonal to a first direction which is orthogonal to the first principal surface and is from the second principal surface toward the first principal surface (see figure 3a); and at least a part of an inner peripheral surface of an innermost periphery of the first inductor wire being in contact with the magnetic layer (see figure 3a). 3. Claim 1 is rejected under 35 U.S.C. 102a1 as being anticipated by Hamada et al.(US 20200027646). Regarding claim 1, Hamada et al. (figures 1a-2b and 0059-0100) discloses an element body (see figure 1b) which includes a magnetic layer (12) and includes a first principal surface and a second principal surface opposite to each other (see figure 1b); a coil (21) which is in the element body (see figure 1b); and an insulation layer (12a) which covers a part of an outer surface of the coil (see figure 2b); the coil including a first inductor wire wound along a plane orthogonal to a first direction which is orthogonal to the first principal surface and is from the second principal surface toward the first principal surface (see figure 1b); and at least a part of an inner peripheral surface of an innermost periphery of the first inductor wire being in contact with the magnetic layer (see figure 1b). Claim Rejections - 35 USC § 103 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. 2 Claims 1-3, 5, 10-11 are rejected under 35 U.S.C. 103 as being unpatentable over Yoshioka et al.(US 20190074125) in view of Hirai et al.(US 20190244743). Regarding claim 1, Yoshioka et al.(figures 1-2, 7a-7b and 0064-0110/0149-0160) discloses an element body (see figure 2/7b) which includes a magnetic layer (10) and includes a first principal surface and a second principal surface opposite to each other (see figure 2/7b); a coil (21) which is in the element body(see figure 2/7b); and an insulation layer (15) which covers a part of an outer surface of the coil(see figure 2/7b), the coil including a first inductor wire wound along a plane orthogonal to a first direction which is orthogonal to the first principal surface and is from the second principal surface toward the first principal surface(see figure 2/7b). Yoshioka et al (para 0106) discloses a teaching wherein may not cover the coil wire but does not expressly disclose at least a part of an inner peripheral surface of an innermost periphery of the first inductor wire being in contact with the magnetic layer. Hirai et al. (figures 1-2 and figures 4-5) discloses a teaching wherein at least a part of an inner peripheral surface of an innermost periphery of the first inductor wire being in contact with the magnetic layer. Accordingly, it would have been obvious to one of ordinary skill in the art before the effective filing date of the applicant claimed invention to design wherein at least a part of an inner peripheral surface of an innermost periphery of the first inductor wire being in contact with the magnetic layer as taught by Hirai et al. to the inductive device of Yoshioka et al so as to reduce the magnetic reluctance thereby maximizing the inductance of the coil. Regarding claim 2, Yoshioka et al.(figures 7a-7b and para 0149-0160) discloses wherein the coil further comprises a second inductor wire (22) wound along a plane orthogonal to the first direction, the second inductor wire is on a side of a second direction opposite to the first direction with respect to the first inductor wire and is electrically connected to the first inductor wire (see figure 7b), and the insulation layer is at least between the first inductor wire and the second inductor wire and covers an inner peripheral surface of an innermost periphery of the second inductor wire(see figure 7b). Regarding claim 3, Yoshioka et al.(figures 7a-7b and para 0152) an extended wire (31) which is connected to an end portion of the first inductor wire in an extension direction of the first inductor wire, wherein the extended wire extends in the first direction, and is exposed from an outer surface of the element body(see figure 7b). Regarding claim 5, Hirai et al. (figures 1-2 and figures 4-5) discloses wherein the first inductor wire includes a top surface facing a side of the first direction, at least a part of the top surface of the first inductor wire is in contact with the magnetic layer (see figures 2/4-5)., and a portion of the top surface of the first inductor wire, the portion being in contact with the magnetic layer, is continuous with the inner peripheral surface of the innermost periphery of the first inductor wire(see figures 2/4-5). Regarding claim 10, Hirai et al. (figures 1-2 and figures 4-5) discloses wherein the first inductor wire includes a top surface facing a side of the first direction, at least a part of the top surface of the first inductor wire is in contact with the magnetic layer (see figures 2/4-5)., and a portion of the top surface of the first inductor wire, the portion being in contact with the magnetic layer, is continuous with the inner peripheral surface of the innermost periphery of the first inductor wire(see figures 2/4-5). Regarding claim 11, Hirai et al. (figures 1-2 and figures 4-5) discloses wherein the first inductor wire includes a top surface facing a side of the first direction, at least a part of the top surface of the first inductor wire is in contact with the magnetic layer (see figures 2/4-5)., and a portion of the top surface of the first inductor wire, the portion being in contact with the magnetic layer, is continuous with the inner peripheral surface of the innermost periphery of the first inductor wire(see figures 2/4-5). 3 Claims 7-9 are rejected under 35 U.S.C. 103 as being unpatentable over Hamada et al.(US 20200027646) in view of Ohkubo et al.(US 20140009254). Regarding claim 7, Hamada et al. (figures 1a-2b and 0059-0100) discloses wherein the first inductor wire includes a seed layer (211) and a plating layer (212) which is partially in contact with the seed layer (see figures 1b-2b) which is in contact with the magnetic layer, of the inner peripheral surface of the innermost periphery of the first inductor wire. Hamada et al. does not expressly disclose the seed layer, which is in a portion of the first inductor wire including the innermost periphery, is shifted to a side opposite to a side of the inner peripheral surface of the innermost periphery of the first inductor wire with respect to a center of the first inductor wire in a direction orthogonal to the first direction, in a cross section which is orthogonal to an extension direction of the first inductor wire and intersects a portion. Ohkubo et al.(figure 10 and para 0078-0086) discloses a teaching wherein the seed layer, which is in a portion of the first inductor wire including the innermost periphery, is shifted to a side opposite to a side of the inner peripheral surface of the innermost periphery of the first inductor wire with respect to a center of the first inductor wire in a direction orthogonal to the first direction, in a cross section which is orthogonal to an extension direction of the first inductor wire and intersects a portion. Accordingly, it would have been obvious to one of ordinary skill in the art before the effective filing date of the applicant claimed invention to design wherein at least a part of an inner peripheral surface of an innermost periphery of the first inductor wire being in contact with the magnetic layer as taught by Ohkubo et al. to the inductive device of Hamada et al. so as to lower the alternating current resistance and minimizes eddy current losses; thereby preventing localized overheating. Regarding claim 8, Hamada et al. (figures 1a-2b and 0059-0100) discloses wherein the first inductor wire includes a bottom surface facing a side of a second direction opposite to the first direction, and the seed layer which is in a portion of the first inductor wire including the innermost periphery is at a corner portion between an outer peripheral surface opposite to the inner peripheral surface of the innermost periphery of the first inductor wire and the bottom surface of the first inductor wire. Regarding claim 9, Ohkubo et al.(figure 10 and para 0078-0086) discloses wherein the first inductor wire includes a top surface facing a side of the first direction, and a portion of the first inductor wire including the innermost periphery has a curved surface at a corner portion between the inner peripheral surface of the innermost periphery of the first inductor wire and the top surface of the first inductor wire. 4 Claims 2-3 and 16-20 are rejected under 35 U.S.C. 103 as being unpatentable over Hamada et al.(US 20200027646) in view of Ohkubo et al.(US 20140009254) in further view of Yoshioka et al.(US 20190074125). Regarding claim 2, Hamada et al. (figures 1a-2b and 0059-0100) discloses all the limitations as noted above but does expressly disclose wherein the coil further comprises a second inductor wire wound along a plane orthogonal to the first direction, the second inductor wire is on a side of a second direction opposite to the first direction with respect to the first inductor wire and is electrically connected to the first inductor wire, and the insulation layer is at least between the first inductor wire and the second inductor wire and covers an inner peripheral surface of an innermost periphery of the second inductor wire. Yoshioka et al.(figures 1-2, 7a-7b and 0064-0110/0149-0160) discloses wherein the coil further comprises a second inductor wire (22) wound along a plane orthogonal to the first direction, the second inductor wire is on a side of a second direction opposite to the first direction with respect to the first inductor wire and is electrically connected to the first inductor wire (see figure 7b), and the insulation layer is at least between the first inductor wire and the second inductor wire and covers an inner peripheral surface of an innermost periphery of the second inductor wire(see figure 7b). Accordingly, it would have been obvious to one of ordinary skill in the art before the effective filing date of the applicant claimed invention to design wherein the coil further comprises a second inductor wire wound along a plane orthogonal to the first direction, the second inductor wire is on a side of a second direction opposite to the first direction with respect to the first inductor wire and is electrically connected to the first inductor wire, and the insulation layer is at least between the first inductor wire and the second inductor wire and covers an inner peripheral surface of an innermost periphery of the second inductor wire as taught by Yoshioka et al. to the inductive device of Hamada et al. so as to allow for a higher inductance to be obtained while also improving filtering and reduce ripple current in DC circuits, which enhances overall circuit stability. Regarding claim 3, Yoshioka et al.(figures 7a-7b and para 0152) an extended wire (31) which is connected to an end portion of the first inductor wire in an extension direction of the first inductor wire, wherein the extended wire extends in the first direction, and is exposed from an outer surface of the element body(see figure 7b). Regarding claim 16, Hamada et al. (figures 1a-2b and 0059-0100) discloses wherein the first inductor wire includes a seed layer (211) and a plating layer (212) which is partially in contact with the seed layer (see figures 1b-2b) which is in contact with the magnetic layer, of the inner peripheral surface of the innermost periphery of the first inductor wire. Hamada et al. does not expressly disclose the seed layer, which is in a portion of the first inductor wire including the innermost periphery, is shifted to a side opposite to a side of the inner peripheral surface of the innermost periphery of the first inductor wire with respect to a center of the first inductor wire in a direction orthogonal to the first direction, in a cross section which is orthogonal to an extension direction of the first inductor wire and intersects a portion. Ohkubo et al.(figure 10 and para 0078-0086) discloses a teaching wherein the seed layer, which is in a portion of the first inductor wire including the innermost periphery, is shifted to a side opposite to a side of the inner peripheral surface of the innermost periphery of the first inductor wire with respect to a center of the first inductor wire in a direction orthogonal to the first direction, in a cross section which is orthogonal to an extension direction of the first inductor wire and intersects a portion. Accordingly, it would have been obvious to one of ordinary skill in the art before the effective filing date of the applicant claimed invention to design wherein at least a part of an inner peripheral surface of an innermost periphery of the first inductor wire being in contact with the magnetic layer as taught by Ohkubo et al. to the inductive device of Hamada et al. so as to lower the alternating current resistance and minimizes eddy current losses; thereby preventing localized overheating. Regarding claim 17, Hamada et al. (figures 1a-2b and 0059-0100) discloses wherein the first inductor wire includes a seed layer (211) and a plating layer (212) which is partially in contact with the seed layer (see figures 1b-2b) which is in contact with the magnetic layer, of the inner peripheral surface of the innermost periphery of the first inductor wire. Hamada et al. does not expressly disclose the seed layer, which is in a portion of the first inductor wire including the innermost periphery, is shifted to a side opposite to a side of the inner peripheral surface of the innermost periphery of the first inductor wire with respect to a center of the first inductor wire in a direction orthogonal to the first direction, in a cross section which is orthogonal to an extension direction of the first inductor wire and intersects a portion. Ohkubo et al.(figure 10 and para 0078-0086) discloses a teaching wherein the seed layer, which is in a portion of the first inductor wire including the innermost periphery, is shifted to a side opposite to a side of the inner peripheral surface of the innermost periphery of the first inductor wire with respect to a center of the first inductor wire in a direction orthogonal to the first direction, in a cross section which is orthogonal to an extension direction of the first inductor wire and intersects a portion. Accordingly, it would have been obvious to one of ordinary skill in the art before the effective filing date of the applicant claimed invention to design wherein at least a part of an inner peripheral surface of an innermost periphery of the first inductor wire being in contact with the magnetic layer as taught by Ohkubo et al. to the inductive device of Hamada et al. so as to lower the alternating current resistance and minimizes eddy current losses; thereby preventing localized overheating. Regarding claim 19, Hamada et al. (figures 1a-2b and 0059-0100) discloses wherein the first inductor wire includes a bottom surface facing a side of a second direction opposite to the first direction, and the seed layer which is in a portion of the first inductor wire including the innermost periphery is at a corner portion between an outer peripheral surface opposite to the inner peripheral surface of the innermost periphery of the first inductor wire and the bottom surface of the first inductor wire. Regarding claim 20, Ohkubo et al.(figure 10 and para 0078-0086) discloses wherein the first inductor wire includes a top surface facing a side of the first direction, and a portion of the first inductor wire including the innermost periphery has a curved surface at a corner portion between the inner peripheral surface of the innermost periphery of the first inductor wire and the top surface of the first inductor wire. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to RONALD HINSON whose telephone number is (571)270-7915. The examiner can normally be reached M to F; 8 -5. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Shawki Ismail can be reached at 571-272-3985. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /RONALD HINSON/Primary Examiner, Art Unit 2837
Read full office action

Prosecution Timeline

Nov 07, 2023
Application Filed
Oct 05, 2026
Non-Final Rejection mailed — §102, §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
74%
Grant Probability
88%
With Interview (+14.1%)
3y 0m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 798 resolved cases by this examiner. Grant probability derived from career allowance rate.

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