DETAILED ACTION
Notice of Pre-AIA or AIA Status
1. The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
2. Claims 1-9 are rejected under 35 U.S.C. 102(a)(1) and/or 35 U.S.C. 102(a)(2) as being anticipated by Kimura et al. (US 2010/0267857 A1).
Kimura et al. disclose a cationically polymerizable composition
(equivalent to the visible-laser-curable or infrared-laser-curable cationically polymerizable epoxy resin composition of the claimed invention) containing a cationic polymerization initiator (equivalent to (B) acid generator of the claimed invention). The cationic polymerization initiator has a function to polymerize cationically polymerizable compounds, such as epoxy compounds (equivalent to the (A) epoxy resin of the claimed invention), by generating an acid upon receiving energy (meeting the limitations of 6), such as light or heat. A photo-acid generator has a function to change the solubility of a resist composition into a developer by generating an acid upon receiving light energy. Various onium salts have been used as a cationic polymerization initiator and photo-acid generator and have excellent acid-generating function and exhibit superior effects. As the epoxy compound, alicyclic epoxy resin, aromatic epoxy resin, aliphatic epoxy resin and the like are suitable. Specific examples of the alicyclic epoxy resin include epoxidizing polyglycidyl ether (meeting the limitations of claims 2 and 3). Further, as other arbitrary component(s), various additives may be admixed in the cationically polymerizable composition and examples of such various additives include: silicic acid-inorganic additives such as fumed silica, fine particulate silica, and silica rock (equivalent to the inorganic filler of the claimed invention and meeting the limitations of claim 5). By irradiation with an energy beam such as ultraviolet radiation, the cationically polymerizable composition can be cured to a dry-to-the-touch condition, generally after 0.1 seconds to a several minutes
(meeting the limitations of claim 8). Any energy beam is suitable as long as it induces the decomposition of the cationic polymerization initiator; however, it is preferable to use a high-energy beam such as electromagnetic wave energy and electron beam having a wavelength of 2,000 to 7,000 angstrom, X-ray or radiation, which high-energy beam is obtained from an extra-high pressure mercury vapor lamp, high pressure mercury vapor lamp, medium-pressure mercury vapor lamp, low-pressure mercury vapor lamp, xenon lamp, carbon-arc lamp, metal-halide lamp, fluorescent lamp, tungsten-arc lamp, excimer lamp, germicidal lamp, excimer laser, nitrogen laser, argon ion laser, helium-cadmium laser, helium-neon laser, krypton ion laser, various diode lasers, YAG laser, luminous diode, CRT light source or the like (meeting the limitations of claim 4). The time of exposure to the energy beam varies depending on the strength of the energy beam, the thickness of the coated film and/or the cationically polymerizable organic compound. Examples of the application of photo-sensitive resist composition containing the cationic polymerization include the use as an ink, protective film (protective layer), coating agent, adhesive agent, insulation material, structural material, optical stereolithography, optical film, color filter, FRP, photoresist for semiconductor and the use in patterning of an ink jet printing head, as well as the use in the formation of these (meeting the limitations of claims 7 and 9) (See Abstract and paragraphs 0001, 0002, 0028, 0064-0072, 0102-0107, 0143, and 0144).
Conclusion
3. Any inquiry concerning this communication or earlier communications from the examiner should be directed to SHEEBA AHMED whose telephone number is (571)272-1504. The examiner can normally be reached Monday-Thursday 7am-6pm.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, CALLIE SHOSHO can be reached at 571-272-1123. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/SHEEBA AHMED/Primary Examiner, Art Unit 1787