DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Objections
Claim 1, line 9, “each of” should be deleted;
Claim 4, line 5, “the mezzanine control connections” lacks an antecedent basis;
Claim 8, line 7; and claim 15, line 2, “the multilayer circuit card” should be --a multilayer circuit card--;
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
Claims 1, 13 and 18 are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Talebbeydokhti et al. (12,604,759).
Regarding claims 1, 13 and 18, Talebbeydokhti et al. disclose an interposer module suitable for interconnecting a densely pitched integrated circuit with a motherboard, the interposer module comprising:
an interposer circuit card (102, Fig. 1) having an interconnection array (122) on an upper surface thereof, the interconnection array being configured for interconnection with the integrated circuit (114); the interconnection array comprising a plurality of ground connection pads, at least one power connection pad, and a plurality of AC connection pads (column 7, lines 43-46);
at least one interposer mezzanine connector (133, Fig. 1) extending from a lower surface of the interposer circuit card, the at least one interposer mezzanine connector comprising a plurality of mezzanine connections (132); and
a plurality of interposer interconnections (130) between the interconnection array and the mezzanine connections;
the mezzanine connections including a plurality of mezzanine ground connections interconnected by the interposer interconnections with the plurality of ground connection pads, at least one mezzanine power connection interconnected by the interposer interconnections with the at least one power connection pad, and a plurality of mezzanine AC connections interconnected by the interposer interconnections with the plurality of AC connection pads (Column 8, lines 57-61).
Allowable Subject Matter
Claims 2-12, 14-17 and 19-20 objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to THANH TAM T LE whose telephone number is (571)272-2094. The examiner can normally be reached 9AM-6PM.
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/THANH TAM T LE/Primary Examiner, Art Unit 2831 05/21/26
thanh-tam.le@uspto.gov
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