Prosecution Insights
Last updated: October 04, 2026
Application No. 18/552,391

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREFOR

Final Rejection §102
Filed
Sep 25, 2023
Priority
Apr 07, 2021 — CN 202110374510.5 +1 more
Examiner
MOVVA, AMAR
Art Unit
2898
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Icleague Technology Co. Ltd.
OA Round
2 (Final)
80%
Grant Probability
Favorable
3-4
OA Rounds
0m
Est. Remaining
95%
With Interview

Examiner Intelligence

Grants 80% — above average
80%
Career Allowance Rate
619 granted / 779 resolved
+11.5% vs TC avg
Strong +16% interview lift
Without
With
+15.6%
Interview Lift
resolved cases with interview
Typical timeline
2y 11m
Avg Prosecution
26 currently pending
Career history
802
Total Applications
across all art units

Statute-Specific Performance

§101
1.4%
-38.6% vs TC avg
§103
53.1%
+13.1% vs TC avg
§102
31.9%
-8.1% vs TC avg
§112
10.6%
-29.4% vs TC avg
Black line = Tech Center average estimate • Based on career data from 779 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1-6 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Moon (US 2013/0234240). [claim 1] A semiconductor structure (fig. 1, specifically the embodiment of fig. 11 which slightly modifies the device of fig. 1 as explained in [0087]) comprising: a first substrate (120b, 120c, fig. 1 where 120c supports and contacts a contact plug of a lower electrode of a capacitor [0113], see also fig. 33), which has a first surface (top surface of 120c, fig. 1) and a second surface (bottom surface of 120b, fig. 1) opposite to the first surface, and comprises several discrete active areas (120b, 120c, fig. 1) arranged in a first direction (e.g. to the upper left in fig. 1) and parallel to a second direction (e.g. to the upper right in fig. 1), wherein the first direction is perpendicular to the second direction (fig. 1), an isolation layer (140, fig. 1, note that the embodiment of fig. 11 has 140 extend all the way to 110) is disposed between adjacent active areas, and the first surface and the second surface expose the isolation layer (fig. 1); a plurality of first grooves (filled in by 150, 160, and 170, fig. 1) which are disposed in the first substrate, extend from the first surface to the second surface, are arranged in the second direction (fig. 1), and run through the active areas along the first direction (fig. 1), as well as have a bottom with a distance less than the thickness of the isolation layer from the first surface (note that in fig. 11, the isolation layer 140 extends all the way to bottom of 120a, while the first groove only ext4ends to the bottom of 120b in fig. 1); a word line gate structure (160, fig. 1), which is disposed in the first grooves; a plurality of bit lines (130, fig. 11, [0087]), which are disposed on the second surface (bottom surface of 120b, fig. 11), arranged in the first direction (fig. 11), and parallel to the second direction (fig. 1), wherein one of the active areas is electrically coupled with one of the bit lines (fig. 11), wherein the isolation layers have a surface protruding from or flush with the second surface (bottom surface of isolation 140, fig. 1 directly above 130/125 is flush/at the same level as the bottom surface of 120b). [claim 2] The semiconductor structure according to claim 1, wherein the isolation layers have a second groove (filled in by 120 and 130 in fig. 11) between each other (isolation layers 140, fig. 11), wherein the second groove exposes the second surface (fig. 11), is parallel to the second direction, and is arranged in the first direction (fig. 1)n; and the bit lines (130, fig. 11) are disposed in the second groove. [claim 3] The semiconductor structure according to claim 1, further comprising a dielectric layer (172, fig. 11, [0087]), which is disposed on the second surface (on the bottom of 120b, fig. 11) and has a second groove (filled in by 120 and 130/172 in fig. 11) exposing a surface of the active areas therein (top of 120c is exposed by second grooves, fig. 11), wherein the second groove is parallel to the second direction and arranged in the first direction (fig. 1); and the bit lines (130, fig. 11) are disposed in the second groove. [claim 4] The semiconductor structure according to claim 1, further comprising a plurality of second source/drain regions (120c,120a, fig. 11), which are disposed in each of the active areas, and extend from the first surface to the second surface (fig. 11). [claim 5] The semiconductor structure according to claim 4, further comprising a plurality of capacitors [0113], which are disposed on the first surface, and each of which is electrically coupled with one of the second source/drain regions (120c, fig. 11). [claim 6] The semiconductor structure according to claim 2, further comprising a first source/drain region (120c,120a, fig. 11), which is disposed in the active areas, and extends from a bottom of the second groove to the first surface (fig. 11). Response to Arguments Applicant's arguments filed 7-6-2026 have been fully considered but they are not persuasive. Applicant argues that the elements 110/120a/120b/120c of Moon conform to the claimed substrate rather than 120b and 120c as noted in the rejection. However, a substrate is defined as underlying substance or layer (see e.g. https://en.thefreedictionary.com/substrate). In Moon 120b/120c supports and contacts a contact plug of a lower electrode of a capacitor [0113], see figs. 1 and 33. Therefore under the broadest reasonable interpretation, 120b/120c can be interpreted as the substrate. Applicant further argues that amended claim 1 requires thinning the substrate and non-buried bit lines. However claim 1 says nothing about thinning the substate or non-buried bit lines. Applicants arguments regarding the amendment are not persuasive since as noted in the rejection isolation 140, fig. 1 directly above 130/125 is flush/at the same level as the bottom surface of 120b. Conclusion Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a). A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action. Any inquiry concerning this communication or earlier communications from the examiner should be directed to AMAR MOVVA whose telephone number is (571)272-9009. The examiner can normally be reached Monday-Friday 9AM-5PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Julio Maldonado can be reached at 571-272-1864. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /AMAR MOVVA/Primary Examiner, Art Unit 2898
Read full office action

Prosecution Timeline

Sep 25, 2023
Application Filed
Apr 06, 2026
Non-Final Rejection mailed — §102
Jul 06, 2026
Response Filed
Sep 04, 2026
Final Rejection mailed — §102 (current)

Precedent Cases

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

3-4
Expected OA Rounds
80%
Grant Probability
95%
With Interview (+15.6%)
2y 11m (~0m remaining)
Median Time to Grant
Moderate
PTA Risk
Based on 779 resolved cases by this examiner. Grant probability derived from career allowance rate.

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