Last updated: July 17, 2026

Application No. 18/567,206

HOLLOW COMPONENT, HOLLOW COMPONENT MANUFACTURING METHOD, AND HOLLOW COMPOMENT MANUFACTURING DEVICE

Non-Final OA

Filed

Dec 05, 2023

Priority

Jul 29, 2021 — RE 10-2021-0099918 +1 more

Examiner

LEARY, JOSHUA DENNIS

Art Unit

3753

Tech Center

3700 — Mechanical Engineering & Manufacturing

Assignee

LG Electronics Inc.

OA Round

1 (Non-Final)

Interview Optional

— +0.0% interview lift. Interview lift (+0.0%) is below the 15.0% threshold. A written response is recommended.

Based on 3 resolved cases, 2023–2026

Examiner Intelligence

LEARY, JOSHUA DENNIS View full profile →

Grants 100% — above average

Career Allowance Rate

3 granted / 3 resolved

+30.0% vs TC avg

Minimal +0% lift

Without

With

+0.0%

Interview Lift

resolved cases with interview

Typical timeline

2y 9m

Avg Prosecution

19 currently pending

Career history

Total Applications

across all art units

Statute-Specific Performance

§103

85.3%

+45.3% vs TC avg

§112

14.7%

-25.3% vs TC avg

Black line = Tech Center average estimate • Based on career data from 3 resolved cases

Prosecution Timeline

Dec 05, 2023

Application Filed

Jun 01, 2026

Non-Final Rejection mailed (current)

Strategy Recommendation AI-generated — please review before filing

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Prosecution Projections

1-2

Expected OA Rounds

100%

Grant Probability

99%

With Interview (+0.0%)

2y 9m (~1m remaining)

Median Time to Grant

Low

PTA Risk

Based on 3 resolved cases by this examiner. Grant probability derived from career allowance rate.