Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1, 3, 4, 5, 6, 13, 14, and 15 are rejected under 35 U.S.C. 102 (a)(1) as being anticipated by De Keyser (US 2004/0200971 A1).
1. A radiation detector (Fig. 1) comprising: a first detector module (image sensor 1) comprising, on a surface facing a radiation generation source, a sensitive portion configured to output an analog signal corresponding to incident radiation and an insensitive portion provided with at least a portion of a transmission path of the analog signal output from the sensitive portion; and a second detector module (image sensor 2) that is a detector module different from the first detector module, comprising, on a surface (a conversion layer 9) facing the radiation generation source, a sensitive portion (pixel grid 8) configured to output an analog signal corresponding to the incident radiation and an insensitive portion (non-sensitive edge 7) provided with at least a portion of a transmission path of the analog signal output from the sensitive portion, wherein the sensitive portion of the first detector module is arranged so as to overlap on a surface of the insensitive portion of the second detector module on a side closer to the radiation generation source (Fig. 1 shows grid 8 overlaps edge 7 of image sensor 2).
PNG
media_image1.png
990
1167
media_image1.png
Greyscale
3. The radiation detector according to claim 1, wherein the sensitive portion comprises: a scintillator configured to convert the incident radiation into light (conversion layer); and a photodiode array (pixel grid 8) that is optically connected to the scintillator, and in which a plurality of photodiodes each configured to convert the light into the analog signal are arranged.
4. The radiation detector according to claim 1, wherein the sensitive portion comprises a semiconductor crystal configured to output the analog signal corresponding to energy contained in the incident radiation (conversion layer 9 and pixel grid 8).
5. The radiation detector according to claim 1, wherein the first detector module and the second detector module are arranged in one row in a same direction along a row direction so as to form one row direction detector module group (Fig. 1).
6. The radiation detector according to claim 5, wherein the first detector module and the second detector module are arranged at a same tilt angle with respect to the row direction so that respective planes of incidence of the radiation face in a same direction (Figs 1 and 4).
13. An X-ray computer tomographic apparatus, comprising an X-ray tubes (this is a typical makeup of a medical imaging device including the example as mentioned in paragraph 0006) and an X-ray detector, wherein the X-ray detector comprises: a first detector module (image sensor 1) comprising, on a surface facing the X-ray tube, a sensitive portion configured to output an analog signal corresponding to incident X-rays and an insensitive portion provided with at least a portion of a transmission path of the analog signal output from the sensitive portion; and a second detector module (image sensor 2) that is a detector module different from the first detector module, comprising, on a surface (conversion layer 9) facing the X-ray tube, a sensitive portion configured to output an analog signal corresponding to the incident X-rays and an insensitive portion provided with at least a portion of a transmission path of the analog signal output from the sensitive portion, wherein the sensitive portion of the first detector module is arranged so as to overlap on a surface of the insensitive portion of the second detector module (Fig. 1) .
14. A manufacturing method of a radiation detector that comprises a first detector module (image sensor 1) comprising, on a surface facing a radiation generation source, a sensitive portion configured to output an analog signal corresponding to incident radiation and an insensitive portion provided with at least a portion of a transmission path of the analog signal output from the sensitive portion, and a second detector module (image sensor 2) that is a detector module different from the first detector module, comprising, on a surface facing the radiation generation source, a sensitive portion configured to output an analog signal corresponding to the incident radiation and an insensitive portion provided with at least a portion of a transmission path of the analog signal output from the sensitive portion, the manufacturing method comprising arranging the sensitive portion of the first detector module and the insensitive portion of the second detector module so that the sensitive portion of the first detector module is arranged to overlap on a surface of the insensitive portion of the second detector module on on a side closer to the radiation generation source. (Fir. 1)
15. A radiation detector, comprising: a first detector module comprising, on a surface facing a radiation generation source, a sensitive portion configured to output an analog signal corresponding to incident radiation and an insensitive portion provided with at least a portion of a transmission path of the analog signal output from the sensitive portion; and a second detector module that is a detector module different from the first detector module, comprising, on a surface facing the radiation generation source, a sensitive portion configured to output an analog signal corresponding to the incident radiation and an insensitive portion provided with at least a portion of a transmission path of the analog signal output from the sensitive portion, wherein the first detector module and the second detector module are arranged in one row in a same direction along a row direction so as to form one row direction detector module group, wherein the first detector module and the second detector module are arranged individually at different tilt angles with respect to the row direction so that respective planes of incidence of the radiation face a focal point of the radiation generation source, wherein the sensitive portion of the first detector module and the insensitive portion of the second detector module are arranged so as to overlap each other (Fig 1).
Claims 2, 7-12 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
The following is a statement of reasons for the indication of allowable subject matter: De Keyser does not teach the details of claims 2, and 7-12.
Applicant’s arguments with respect to claims 1-6 and 11-14 have been considered but are moot because the new ground of rejection does not rely on any reference applied in the prior rejection of record for any teaching or matter specifically challenged in the argument.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to DON KITSUN WONG whose telephone number is (571)272-1834. The examiner can normally be reached on Monday – Friday 9:00am – 6:00pm.
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Uzma Alam can be reached on 571 272 3995. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
Information regarding the status of an application may be obtained from the Patent Application Information Retrieval (PAIR) system. Status information for published applications may be obtained from either Private PAIR or Public PAIR. Status information for unpublished applications is available through Private PAIR only. For more information about the PAIR system, see http://pair-direct.uspto.gov. Should you have questions on access to the Private PAIR system, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative or access to the automated information system, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000.
/DON K WONG/ Primary Examiner, Art Unit 2884