Prosecution Insights
Last updated: May 29, 2026
Application No. 18/615,018

RESIN MOLDED PRODUCT AND IN-VEHICLE INFORMATION DEVICE

Non-Final OA §102
Filed
Mar 25, 2024
Priority
Aug 24, 2023 — JP 2023-136338
Examiner
TILAHUN, ALAZAR
Art Unit
2424
Tech Center
2400 — Computer Networks
Assignee
Denso Ten Limited
OA Round
1 (Non-Final)
71%
Grant Probability
Favorable
1-2
OA Rounds
9m
Est. Remaining
86%
With Interview

Examiner Intelligence

Grants 71% — above average
71%
Career Allowance Rate
475 granted / 667 resolved
+13.2% vs TC avg
Moderate +14% lift
Without
With
+14.3%
Interview Lift
resolved cases with interview
Typical timeline
2y 11m
Avg Prosecution
18 currently pending
Career history
685
Total Applications
across all art units

Statute-Specific Performance

§101
0.6%
-39.4% vs TC avg
§103
85.9%
+45.9% vs TC avg
§102
9.0%
-31.0% vs TC avg
§112
0.5%
-39.5% vs TC avg
Black line = Tech Center average estimate • Based on career data from 667 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Priority Receipt is acknowledged of certified copies of papers required by 37 CFR 1.55. Election/Restrictions Restriction to one of the following inventions is required under 35 U.S.C. 121: I. Claims 1-16, drawn to a resin molded product (i.e., the bracket structure per se, classified in B60K2360/84. II. Claim 17, drawn to an in-vehicle information device including the resin molded product in combination with additional components (display panel and main body portion), classified in B60K35/22. The inventions are independent or distinct, each from the other because: Group I is directed to a manufacture (resin molded product per se). Group II is directed to a combination/system (in-vehicle information device including the bracket). Further, the combination of Group II requires additional elements (display panel and main body portion) that are not required by Group I. Conversely, the bracket of Group I can be made and used independently of the in-vehicle device of Group II. Examination of both groups would require a search in different fields of classification, for example: Group I: molded structural components / mechanical features (e.g., positioning pins, ribs, chamfer geometry) Group II: vehicle-mounted display systems / electronic device assemblies Thus, there would be a serious search and examination burden if restriction were not required Aan oral election without traverse of claims 1-16 was made during a telephone call with Tiffany Dewey on April 13, 2026. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. Claims 1-16 are rejected under 35 U.S.C. 102(a)(2) as being anticipated ISEKI Pub. No.: US 20110141590 (Hereinafter “ISEKI”). Regarding Claim 1, ISEKI discloses a resin molded product (see paragraph [0039]) comprising: a first surface (see fig.1: base 32); and a first positioning pin extending from the first surface in a first direction (see paragraph [0059]), wherein the first positioning pin includes chamfered portions chamfered at two positions facing each other on an outer peripheral surface of the first positioning pin when viewed from the first direction, and a parting line is formed in the chamfered portions (see paragraphs [0054], [0056], [0058], [0061]). Regarding Claim 2, ISEKI discloses the resin molded product as discussed in the rejection of claim 1. ISEKI further discloses wherein the first positioning pin includes reinforcing ribs each extending in a cross direction from a central axis to form the outer peripheral surface as an arc-shaped outer periphery when viewed from the first direction (see paragraphs [0054], [0056], [0058], [0061]). Regarding Claim 3, ISEKI discloses the resin molded product as discussed in the rejection of claim 2. ISEKI further discloses wherein the chamfered portions are disposed on the arc-shaped outer periphery of the reinforcing ribs (see paragraphs [0042], [0061]). Regarding Claim 4, ISEKI discloses the resin molded product as discussed in the rejection of claim 2. ISEKI further discloses wherein the chamfered portions are formed by chamfering a pair of corners of two adjacent reinforcing ribs that are in contact with the outer peripheral surface into a planar shape when viewed from the first direction (see paragraphs [0054], [0056], [0058], [0061]). Regarding Claim 5, ISEKI discloses the resin molded product as discussed in the rejection of claim 1. ISEKI further discloses a second positioning pin extending in a second direction from a second surface different from the first surface, wherein the first direction and the second direction are different from each other (see paragraphs [0042], [0044], [0057], [0061]). Regarding Claim 6, ISEKI discloses the resin molded product as discussed in the rejection of claim 2. ISEKI further discloses a second positioning pin extending in a second direction from a second surface different from the first surface, wherein the first direction and the second direction are different from each other (see paragraphs [0054], [0056], [0058], [0061]). Regarding Claim 7, ISEKI discloses the resin molded product as discussed in the rejection of claim 3. ISEKI further discloses a second positioning pin extending in a second direction from a second surface different from the first surface, wherein the first direction and the second direction are different from each other (see paragraphs [0054], [0056], [0058], [0061]). Regarding Claim 8, ISEKI discloses the resin molded product as discussed in the rejection of claim 4. ISEKI further discloses a second positioning pin extending in a second direction from a second surface different from the first surface, wherein the first direction and the second direction are different from each other (see paragraphs [0054], [0056], [0058], [0061]). Regarding Claim 9, ISEKI discloses the resin molded product as discussed in the rejection of claim 5. ISEKI further discloses wherein the second positioning pin extends from the second surface positioned on a back side of the first surface, wherein the first positioning pin is positioned with respect to a first device, and wherein the second positioning pin is positioned with respect to a second device (see paragraphs [0054], [0056], [0058], [0061]). Regarding Claim 10, ISEKI discloses the resin molded product as discussed in the rejection of claim 6. ISEKI further discloses wherein the second positioning pin extends from the second surface positioned on a back side of the first surface, wherein the first positioning pin is positioned with respect to a first device, and wherein the second positioning pin is positioned with respect to a second device (see paragraphs [0054], [0056], [0058], [0061]). . Regarding Claim 11, ISEKI discloses the resin molded product as discussed in the rejection of claim 7. ISEKI further discloses wherein the second positioning pin extends from the second surface positioned on a back side of the first surface, wherein the first positioning pin is positioned with respect to a first device, and wherein the second positioning pin is positioned with respect to a second device (see paragraphs [0054], [0056], [0058], [0061]). Regarding Claim 12, ISEKI discloses the resin molded product as discussed in the rejection of claim 7. ISEKI further discloses wherein the second positioning pin extends from the second surface positioned on a back side of the first surface, wherein the first positioning pin is positioned with respect to a first device, and wherein the second positioning pin is positioned with respect to a second device (see paragraphs [0054], [0056], [0058], [0061]). Regarding Claim 13, ISEKI discloses the resin molded product as discussed in the rejection of claim 9. ISEKI further discloses wherein the first device is a display panel, and the second device is a main body portion that controls the display panel (see fig.1 and paragraph [0041]). Regarding Claim 14, ISEKI discloses the resin molded product as discussed in the rejection of claim 10. ISEKI further discloses wherein the first device is a display panel, and the second device is a main body portion that controls the display panel (see fig.1 and paragraph [0041]). Regarding Claim 15, ISEKI discloses the resin molded product as discussed in the rejection of claim 11. ISEKI further discloses wherein the first device is a display panel, and the second device is a main body portion that controls the display panel (see fig.1 and paragraph [0041]). Regarding Claim 16, ISEKI discloses the resin molded product as discussed in the rejection of claim 10. ISEKI further discloses wherein the first device is a display panel, and the second device is a main body portion that controls the display panel (see fig.1 and paragraph [0041]). Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to Alazar Tilahun whose telephone number is (571)270-5712. The examiner can normally be reached Monday -Friday, From 9:00 AM-6:00 PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Benjamin Bruckart can be reached at 571-272-3982. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /ALAZAR TILAHUN/ Primary Examiner Art Unit 2424 /A.T/April 17, 2026
Read full office action

Prosecution Timeline

Mar 25, 2024
Application Filed
May 05, 2026
Non-Final Rejection mailed — §102 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
71%
Grant Probability
86%
With Interview (+14.3%)
2y 11m (~9m remaining)
Median Time to Grant
Low
PTA Risk
Based on 667 resolved cases by this examiner. Grant probability derived from career allowance rate.

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