DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claims 1-15 filed on 3/28/2024 have been reviewed and considered by this office action.
Priority
Acknowledgment is made of applicant’s claim for foreign priority under 35 U.S.C. 119 (a)-(d). The certified copy has been filed in parent Application No. TW112112061, filed on 3/29/2023.
Drawings
The drawings filed on 3/8/2024 have been reviewed and are considered acceptable.
Specification
The specification filed on 3/28/2024 has been reviewed and is considered acceptable.
Claim Interpretation
The following is a quotation of 35 U.S.C. 112(f):
(f) Element in Claim for a Combination. – An element in a claim for a combination may be expressed as a means or step for performing a specified function without the recital of structure, material, or acts in support thereof, and such claim shall be construed to cover the corresponding structure, material, or acts described in the specification and equivalents thereof.
The following is a quotation of pre-AIA 35 U.S.C. 112, sixth paragraph:
An element in a claim for a combination may be expressed as a means or step for performing a specified function without the recital of structure, material, or acts in support thereof, and such claim shall be construed to cover the corresponding structure, material, or acts described in the specification and equivalents thereof.
The claims in this application are given their broadest reasonable interpretation using the plain meaning of the claim language in light of the specification as it would be understood by one of ordinary skill in the art. The broadest reasonable interpretation of a claim element (also commonly referred to as a claim limitation) is limited by the description in the specification when 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, is invoked.
As explained in MPEP § 2181, subsection I, claim limitations that meet the following three-prong test will be interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph:
(A) the claim limitation uses the term “means” or “step” or a term used as a substitute for “means” that is a generic placeholder (also called a nonce term or a non-structural term having no specific structural meaning) for performing the claimed function;
(B) the term “means” or “step” or the generic placeholder is modified by functional language, typically, but not always linked by the transition word “for” (e.g., “means for”) or another linking word or phrase, such as “configured to” or “so that”; and
(C) the term “means” or “step” or the generic placeholder is not modified by sufficient structure, material, or acts for performing the claimed function.
Use of the word “means” (or “step”) in a claim with functional language creates a rebuttable presumption that the claim limitation is to be treated in accordance with 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph. The presumption that the claim limitation is interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, is rebutted when the claim limitation recites sufficient structure, material, or acts to entirely perform the recited function.
Absence of the word “means” (or “step”) in a claim creates a rebuttable presumption that the claim limitation is not to be treated in accordance with 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph. The presumption that the claim limitation is not interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, is rebutted when the claim limitation recites function without reciting sufficient structure, material or acts to entirely perform the recited function.
Claim limitations in this application that use the word “means” (or “step”) are being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, except as otherwise indicated in an Office action. Conversely, claim limitations in this application that do not use the word “means” (or “step”) are not being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, except as otherwise indicated in an Office action.
This application includes one or more claim limitations that do not use the word “means,” but are nonetheless being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, because the claim limitation(s) uses a generic placeholder that is coupled with functional language without reciting sufficient structure to perform the recited function and the generic placeholder is not preceded by a structural modifier. Such claim limitation(s) is/are: “reading unit” in claim 1; “error calculating unit”, in claim 1; “temperature controlling unit”, in claim 1; and “lamination unit”, in claim 1.
Because this/these claim limitation(s) is/are being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, it/they is/are being interpreted to cover the corresponding structure described in the specification as performing the claimed function, and equivalents thereof.
If applicant does not intend to have this/these limitation(s) interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, applicant may: (1) amend the claim limitation(s) to avoid it/them being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph (e.g., by reciting sufficient structure to perform the claimed function); or (2) present a sufficient showing that the claim limitation(s) recite(s) sufficient structure to perform the claimed function so as to avoid it/them being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph.
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1-15 are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Yoshiaki (JP 2011-216833A).
Regarding Claims 1 and 9; Yoshiaki teaches; A method for compensating a manufacturing error in a semiconductor process, the method being implemented using a system that includes at least one temperature controller, the method comprising: (Yoshiaki; at least Abstract; page 9, paragraphs 5-6; disclose a manufacturing system and method for joining substrates (i.e. semiconductors) which incudes a heat source for adjusting temperature of substrates for correcting alignment errors)
generating a reading signal associated with a location of an alignment symbol on a substrate; (Yoshiaki; at least page 10; disclose wherein the system and method includes detecting alignment marks located on the substrates for determining the relative displacement between an upper and lower substrate)
generating a difference signal based on the reading signal, the difference signal indicating a difference between the location of the alignment symbol and a location of a reference alignment symbol that corresponds with the alignment symbol, wherein the reference alignment symbol is on another substrate; and (Yoshiaki; at least page 12; disclose wherein the system and method includes determining a deviation between the two substrates alignment based on the detected alignment marks wherein each substrate includes an alignment mark used when aligning the substrates before joining together)
generating a temperature controlling signal based on the difference signal, the temperature controlling signal controlling operation of the temperature controller in order to control one of a temperature of an affecting part of the substrate, a temperature of an affecting part of the another substrate and a combination thereof; and (Yoshiaki; at least page 13; disclose wherein the system and method includes determining a target temperature difference between the two substrates such that the thermal expansion/contraction will result in the two substrates aligning based on the alignment marks and further, controlling the heating element for each substrate to reach the target temperature)
after controlling the one of a temperature of an affecting part of the substrate, a temperature of an affecting part of the another substrate and a combination thereof, performing a lamination process to bond the substrate and the another substrate together. (Yoshiaki; at least page 8; disclose wherein the system and method includes utilizing a pressurizing device to bond the two substrates together using a lamination process once the substrates have been sufficiently aligned).
Regarding Claims 2 and 11; Yoshiaki teaches; The method as claimed in Claim 1, wherein the reading signal includes one of an image of the substrate and a set of coordinates indicating a location of the alignment symbol on the substrate. (Yoshiaki; at least page 10; the alignment mark is determined using x and y direction driving units to generate coordinates).
Regarding Claim 3; Yoshiaki teaches; The method as claimed in Claim 1, the system including a plurality of temperature controllers that are arranged in concentric circles, wherein the temperature controlling signal includes a plurality of temperature controlling signals for controlling operations of the temperature controllers. (Yoshiaki; page 9).
Regarding Claim 4; Yoshiaki teaches; The method as claimed in Claim 1, wherein the alignment symbol is located adjacent to the affecting part of the substrate. (Yoshiaki; at least page 10).
Regarding Claim 5; Yoshiaki teaches; The method as claimed in Claim 1, wherein the substrate is formed using one of a glass material, a semiconductor material, a dielectric material, and a metal material. (Yoshiaki; at least page 7).
Regarding Claims 6 and 14; Yoshiaki teaches; The method as claimed in Claim 1, wherein in controlling operation of the temperature controller, one of the temperature of the affecting part of the substrate, the temperature of the affecting part of the another substrate and the combination thereof is adjusted, so as to cause one of the affecting part of the substrate, the affecting part of the another substrate and a combination thereof to deform for compensating the manufacturing error. (Yoshiaki; at least pages 10 and 13).
Regarding Claims 7 and 15; Yoshiaki teaches; The method as claimed in Claim 1, further comprising storing the temperature controlling signal for processing a substrate of a next batch in the semiconductor process. (Yoshiaki; at least page 21).
Regarding Claim 8; Yoshiaki teaches; The method as claimed in Claim 1, wherein the temperature controlling signal controls the temperature of the affecting part of the substrate, the method further comprising, after controlling the temperature of the affecting part of the substrate, forming a securing layer on the substrate in order to hold the substrate in a deformed state. (Yoshiaki; at least pages 8 and 13).
Regarding Claim 10; Yoshiaki teaches; The system as claimed in Claim 9, wherein: the temperature controlling unit includes a temperature controller disposed near the substrate and a controlling component connected to the temperature controller; and the controlling component, in response to the receipt of the difference signal, generates the at least one temperature controlling signal and controls operation of the temperature controller for controlling the one of the temperature of the affecting part of the substrate, and the temperature of the affecting part of the another substrate of the next batch in the semiconductor process. (Yoshiaki; at least pages 10-13).
Regarding Claim 12; Yoshiaki teaches; The system as claimed in Claim 9, further comprising a securing unit, wherein: the temperature controlling signal controls the temperature of the affecting part of the substrate; and the securing unit is for securing the substrate after the controlling of the temperature of the affecting part of the substrate is implemented. (Yoshiaki; at least page 13).
Regarding Claim 13; Yoshiaki teaches; The system as claimed in Claim 12, wherein the securing unit is a vacuum holder, and temperature controllers are disposed in the securing unit. (Yoshiaki; at least page 9).
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure.
Yamauchi (US PGPUB 20230030272): disclose a system and method for detecting a deviation amount in an alignment between two substrates in a bonding operation and in response, adjusting temperatures of the substrates in order to correct the alignment error.
Yamauchi (US PGPUB 20210313211): disclose a chip bonding system and method which utilizes alignment marks for detecting deviations between two substrates and based on the detected deviations, performing corrective actions to address the deviations.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to CHRISTOPHER W CARTER whose telephone number is (469)295-9262. The examiner can normally be reached 9-6:30.
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Robert Fennema can be reached at (571) 272-2748. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000.
/CHRISTOPHER W CARTER/Examiner, Art Unit 2117
Prosecution Insights