Prosecution Insights
Last updated: July 17, 2026
Application No. 18/641,209

INVERTER MODULE INTEGRATABLY MOUNTABLE WITH DRIVE UNIT OF VEHICLE

Non-Final OA §102
Filed
Apr 19, 2024
Priority
Apr 29, 2021 — continuation of 11/993,166
Examiner
PHAN, HAU VAN
Art Unit
3613
Tech Center
3600 — Transportation & Electronic Commerce
Assignee
Rivian Ip Holdings LLC
OA Round
1 (Non-Final)
81%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
94%
With Interview

Examiner Intelligence

Grants 81% — above average
81%
Career Allowance Rate
1209 granted / 1500 resolved
+28.6% vs TC avg
Moderate +14% lift
Without
With
+13.6%
Interview Lift
resolved cases with interview
Fast prosecutor
2y 2m
Avg Prosecution
9 currently pending
Career history
1512
Total Applications
across all art units

Statute-Specific Performance

§101
0.1%
-39.9% vs TC avg
§103
53.4%
+13.4% vs TC avg
§102
32.4%
-7.6% vs TC avg
§112
9.8%
-30.2% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1500 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Information Disclosure Statement The information disclosure statement (IDS) submitted on 11/20/2025, 7/29/2025, 3/26/2025, 7/3/2024. The submission is in compliance with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statement is being considered by the examiner. Abstract The abstract of the disclosure is objected to because it should be in narrative form. “Various disclosed embodiments include illustrative” and “given by way of non-limiting example, an illustrative module for“ should be removed. A corrected abstract of the disclosure is required and must be presented on a separate sheet, apart from any other text. See MPEP § 608.01(b). Applicant is reminded of the proper content of an abstract of the disclosure. A patent abstract is a concise statement of the technical disclosure of the patent and should include that which is new in the art to which the invention pertains. The abstract should not refer to purported merits or speculative applications of the invention and should not compare the invention with the prior art. If the patent is of a basic nature, the entire technical disclosure may be new in the art, and the abstract should be directed to the entire disclosure. If the patent is in the nature of an improvement in an old apparatus, process, product, or composition, the abstract should include the technical disclosure of the improvement. The abstract should also mention by way of example any preferred modifications or alternatives. Where applicable, the abstract should include the following: (1) if a machine or apparatus, its organization and operation; (2) if an article, its method of making; (3) if a chemical compound, its identity and use; (4) if a mixture, its ingredients; (5) if a process, the steps. Extensive mechanical and design details of an apparatus should not be included in the abstract. The abstract should be in narrative form and generally limited to a single paragraph within the range of 50 to 150 words in length. See MPEP § 608.01(b) for guidelines for the preparation of patent abstracts. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claims 1-20 are rejected under 35 U.S.C. 102(a) as being anticipated by Funahashi et al. (2003/0200761). Funahashi et al. in figures 1-19, disclose a drive unit comprising a frame (4) and an inverter module (5) comprising a housing having an open face (41) and inverter circuitry (9) disposed in at least a portion of the housing. The open face of the inverter module is coupled to a sealing surface (8) of the frame, and wherein at least a portion of the inverter circuitry extends beyond a plane of the sealing surface and into a cavity of the frame (see figure 2). Regarding claim 2, Funahashi in figures 1-2, disclose the open face of the inverter module, which faces the cavity of the frame. Regarding claim 3, Funahashi in figures 1-2, disclose a first z-height elevation between the sealing surface of the frame and a closed surface of the housing that is opposite of the open face of the housing is smaller than a second z-height elevation between the closed surface of the housing and a surface of the at least a portion of the inverter circuitry disposed in the cavity of the frame. Regarding claim 4, Funahashi in figures 1-2, disclose the at least a portion of the inverter circuitry, which is disposed in the cavity of the frame independent of direct contact with the frame. Regarding claim 5, Funahashi in figures 1-2, disclose the inverter module being coupled to the frame, which forms a common space within the housing of the inverter module and the cavity of the frame. Regarding claim 6, Funahashi in figures 1-2, disclose the sealing surface of the frame, which is configured to sealably engage a sealing surface of the housing. Regarding claim 7, Funahashi in figures 1-2, 15, disclose the frame (304) of the drive unit, which is arranged in a first orientation and the inverter module (306) is arranged in a second orientation opposite of the first orientation. Regarding claim 8, Funahashi in figures 1-18, disclose an inverter module (301) comprising a housing (341, figure 15) having an open face and inverter circuitry (305) disposed in at least a portion of the housing. The open face of the housing is configured to engage a sealing surface (308) of a frame of a drive unit. wherein at least a portion of the inverter circuitry extends beyond a plane of the sealing surface and into a cavity of the frame based on the open face of the housing engaging the sealing surface of the frame. Regarding claim 9, Funahashi in figures 1-2, 15, disclose the open face of the inverter module, which faces the cavity of the frame. Regarding claim 10, Funahashi in figures 1-2, 15, disclose a first z-height elevation between the sealing surface of the frame and a closed surface of the housing that is opposite of the open face of the housing is smaller than a second z-height elevation between the closed surface of the housing and a surface of the at least a portion of the inverter circuitry disposed in the cavity of the frame. Regarding claim 11, Funahashi in figures 1-2, 15, disclose the at least a portion of the inverter circuitry, which is disposed in the cavity of the frame independent of direct contact with the frame. Regarding claim 12, Funahashi in figures 1-2, 15, disclose the inverter module being coupled to the frame forms a common space within the housing of the inverter module and the cavity of the frame. Regarding claim 13, Funahashi in figures 1-2, 15, disclose the sealing surface of the frame, which is configured to sealably engage a sealing surface of the housing. Regarding claim 14, Funahashi in figures 1-2, 15, disclose the frame of the drive unit, which is arranged in a first orientation and the inverter module is arranged in a second orientation opposite of the first orientation. Regarding claim 15, Funahashi in figures 1-2, 10-15, disclose a vehicle comprising a drive unit (302) having a frame arranged in a first orientation and an inverter module coupled to a sealing surface of the frame. The inverter module comprising inverter circuitry (305) disposed in at least a portion of a housing of the inverter module with at least a portion of the inverter circuitry arranged in a second orientation opposite of the first orientation that extends beyond a plane of the sealing surface and into a cavity of the frame. Regarding claim 16, Funahashi in figures 1-2, 15, disclose the housing having an open face facing the cavity of the frame. Regarding claim 17, Funahashi in figures 1-2, 15, disclose a first z-height elevation between the sealing surface of the frame and a closed surface of the housing that is opposite of an open face of the housing is smaller than a second z-height elevation between the closed surface of the housing and a surface of the at least a portion of the inverter circuitry disposed in the cavity of the frame. Regarding claim 18, Funahashi in figures 1-2, 15, disclose the at least a portion of the inverter circuitry, which is disposed in the cavity of the frame independent of direct contact with the frame. Regarding claim 19, Funahashi in figures 1-2, 15, disclose the inverter module being coupled to the frame forms a common space within the housing of the inverter module and the cavity of the frame. Regarding claim 20, Funahashi in figures 1-2, 15, disclose the sealing surface of the frame sealably engages a sealing surface of the housing. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to HAU VAN PHAN whose telephone number is (571)272-6696. The examiner can normally be reached Monday to Friday 8:00 to 4:00 PST. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Marc Jimenez can be reached at 571-272-4530. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /HAU V PHAN/Primary Examiner, Art Unit 3615
Read full office action

Prosecution Timeline

Apr 19, 2024
Application Filed
Jun 26, 2026
Non-Final Rejection mailed — §102 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
81%
Grant Probability
94%
With Interview (+13.6%)
2y 2m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 1500 resolved cases by this examiner. Grant probability derived from career allowance rate.

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