DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 103
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
Claim(s) 1-11 is/are rejected under 35 U.S.C. 103 as being unpatentable over Tomimuro et al. (US 5182631) in view of Hirayama (US 20130322833) and Watanabe et al. (JP 4221884 B2).
As to claim 1, Tomimuro et al.’s figure 2 shows an electrical interconnection element (middle film carrier 207 that is coupled to the shown 201, wherein the shape of the middle film carrier 207 is similar to waveguide W5 shown in figure 11B ) for providing an improved impedance matching, the interconnection element comprising: a first connection section (narrowest end) for electrically coupling to a first electric circuit (it is inherent that package 109 comprises electric circuit); a second connection section (widest end) for electrically coupling to a second electric circuit (not shown that is coupled to the shown device at 201); and a coupling section (middle section between the ends); wherein the first connection section, the coupling section, and the second connection section are arranged next to each other in a first, longitudinal direction of the electrical interconnection element, and are electrically coupled to each other; and wherein the first connection section in a second direction that is orthogonal to the first direction is wider than the second connection section in the second direction (see W5 of figure 11B), wherein the electrical interconnection element is adapted to predefined transmission line dimensions for reducing impedance steps. The figure fails to show that the surface of the electrical interconnection elements comprising holes, slots or cavities. However, Hirayama’s figure 4 or 14A shows interconnect 12 comprising holes, slots or cavities (15s and the shown holes in 12 of figure 14A) in order to improves the impedance matching between the coplanar line 54 and the microstrip line 50 (¶0031). Therefore, it would have been obvious to one having ordinary skill in the art to includes holes, slots or cavities on Tomimuro et al.’s interconnect element for the purpose of improving impedance matching between connecting devices. The modified Tomimuro et al.’s figure further fails to show the width dimensions as claimed. However, Watanabe et al.’s figure 4 shows a similar transmission line (16) having widths Wsm and Wd within the claimed dimensions, see Comparative Example 2 in the attached translation papers. It would have been obvious to one having ordinary skill in the art to set the widths of Tomimuro et al.’s first connection section and second connection section within the claimed ranges for the purpose of achieving optimum space occupation and impedances, see MPEP 2144.05.
As to claim 2, the modified Tomimuro et al.’s figure 2 shows that the coupling section in a plane defined by the first direction and the second direction comprises a shape that narrows from the width of the first connection section to the width of the second connection section.
As to claim 3, the modified Tomimuro et al.’s figure 2 shows that the coupling section in a plane defined by the first direction and the second direction comprises a trapezoidal shape, or a shape with curved edges from the first connection section to the second connection section.
As to claim 4, the modified Tomimuro et al.’s figure 2 shows that the first connection section, and the second connection section in a plane defined by the first direction and the second direction each comprise a square shape, or a rectangular shape (see W5).
As to claim 5, Tomimuro et al.’s figure fails to show that the first connection section is electrically coupled to the second connection section by at least one of bonding, ultrasonic bonding, soldering, and gluing and the second connection section is electrically coupled to the coupling section by at least one of bonding, ultrasonic bonding, soldering, and gluing. However, connecting or transmission lines section using the above methods are well known in the art. It would have been obvious to one having ordinary skill in the art to use at least one of the above methods to connect the first section, second section and coupling section together for the purpose achieving optimum performance.
As to claim 6, the modified Tomimuro et al.’s figure 2 shows a single electrically conductive element that accommodates the first connection section, the second connection section, and the coupling section.
As to claim 7, Tomimuro et al.’s column 1, lines 26-29 teaches that “wires consisting of gold”. Aluminun is also a well-known conductor. Column 9, lines 5-10, teaches that “the pattern of the waveguide film carrier can be easily changed by using a photolithography technique”. Therefore, it would have been obvious to one having ordinary skill in the art to select the electrical interconnection element is at least one of: integrally formed; formed of gold, or aluminum; and formed by a photolithographic process for the purpose of achieving optimum desired speed.
Claim 8 recites similar limitations in claim above. Therefore, it is rejected for the same reasons.
As to claim 9, the modified Tomimuro et al.’s figure 2 shows a first substrate (it is inherent that package 109 comprises substrate); wherein the first electric circuit is arranged on the first substrate; wherein the first electric circuit comprises a first electrical connection pad (see 110 in figure 1 or 3); and wherein the first electrical connection pad is electrically coupled to the first connection section of the electrical interconnection element.
As to claim 10, Tomimuro et al.’s figure 3 shows that the first electrical connection pad is electrically coupled to the first connection section of the electrical interconnection element by at least one of bonding, ultrasonic bonding, soldering, and gluing (by bump 108 in figure 3).
As to claim 11, Tomimuro et al.’s figures 8 and 9 show the frequency characteristics of a MMIC. Therefore, it would have been obvious to one to form the first electric circuit and the first substrate as a Monolithic Microwave Integrated Circuit for the purpose of amplifying communication signals in package 109. Figure 2 further shows that the MMIC comprises at least one of an amplifier, a mixer, a switch, a multiplier, an attenuator, a filter network, a low-pass filter, a high-pass filter, and a band-pass filter (col. 7, lines 15-20).
Claim(s) 12-21 is/are rejected under 35 U.S.C. 103 as being unpatentable over Tomimuro et al. (US 5182631) in view of Hirayama (US 20130322833), Watanabe et al. (JP 4221884 B2) and Nagaishi et al. (US 10756426).
As to claim 12, the modified Tomimuro et al.’s figures fail to show that the first electric circuit further comprises an antenna structure, and a signal line that couples the antenna structure to the first electrical connection pad. However, MMIC circuit coupled to antenna is well known in the art. Nagaishi et al.’s figure 7 shows that MMIC 4 coupled to antenna 9. It would have been obvious to couple an antenna to Tomimuro et al.’s MMIC for the purpose of wirelessly communicating with external device or use arranged Nagaishi et al.’s MMIC as shown in Tomimuro et al.’s figures for the purpose of providing more precise communications and speed.
As to claim 13, Nagaishi et al.’s figure 7 further shows a housing; wherein the housing comprises a hollow waveguide (12), and wherein the antenna structure is arranged in the hollow waveguide to transform an electromagnetic wave in the hollow waveguide into an electric signal on signal line or vice versa.
As to claim 14, the modified Tomimuro et al.’s figure further shows a second substrate (i.e. Nagaishi et al.’s substrate 7); wherein the second electric circuit (Nagaishi et al.’s ICs in circuit 5 that includes passive elements 6 that communicates with circuit 4) is arranged on the second substrate; wherein the second electric circuit comprises a second electrical connection pad (inherent); and wherein the second electrical connection pad is electrically coupled to the second connection section of the electrical interconnection element.
As to claim 15, the modified Tomimuro et al.’s figure shows that the second electrical connection pad is electrically coupled to the second connection section of the electrical interconnection element by at least one of bonding, ultrasonic bonding, soldering, and gluing.
As to claim 16, the modified Tomimuro et al.’s figure shows that the second electric circuit and the second substrate together form a Monolithic Microwave Integrated Circuit (5) that comprises at least one of an amplifier, a mixer, a switch, a multiplier, an attenuator, a filter network, a low-pass filter, a high-pass filter, and a band-pass filter [passive element used as filter is well known in the art. Therefore, it would have been obvious to one having ordinary skill in the art to form a filter (high-pass, bandpass or lowpass) with passive elements 6 for the purpose of reducing noise].
Claim 17 recites similar limitations in claims above. Therefore, it is rejected for the same reasons.
As to claim 18, the modified Tomimuro et al.’s figure shows that the first electrical connection pad is arranged at the same height as the second electrical connection pad, or at a different height as the second electrical connection pad.
As to claim 19, the modified Tomimuro et al.’s figure shows that at least one of a radiometer coupled to the second electric circuit, a microwave transmitter coupled to the second electric circuit, and a microwave receiver coupled to the second electric circuit (Tomimuro et al.’s figure 2 is a microwave circuit).
Claims 20 and 21 recite similar limitations in claims above. Therefore, they are rejected for the same reasons.
Conclusion
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/QUAN TRA/
Primary Examiner
Art Unit 2843
Prosecution Insights