DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Information Disclosure Statement
The information disclosure statement (IDS) submitted on 1/26/206 was filed. The submission is in compliance with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statement is being considered by the examiner.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of pre-AIA 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1, 3-10, 12, 14, 15, 17, 19 and 20 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Goto et al US Patent Application Publication 2022/0158612.
Goto et al disclose a packaged acoustic wave device comprising: a multi-layer piezoelectric substrate including a piezoelectric layer 212 and a quartz layer 216; an interdigital transducer electrode 218 in electrical communication with the piezoelectric layer; and a packaging structure comprising a support layer 246, which can be composed of quartz having a coefficient of thermal expansion of 0.77-1.4 ppm/°C (teaching reference Ostrowicki et al US 2021/0296196 paragraph [0038]) ( greater than 0 ppm/°C and equal to or less than 35 ppm/°C) , the support layer 246 coupled to the multi-layer piezoelectric substrate, the interdigital transducer electrode positioned between the quartz substrate 216 and the support layer 246.
Figure 8A is a schematic diagram of an example transmit filter 100 that includes surface acoustic wave resonators according to an embodiment. An antenna ANT coupled to the packaged multi-layer piezoelectric substrate surface acoustic wave device. (per claim 12)
Figure 13A is a schematic diagram of a wireless communication device 420 that includes filters 423 in a radio frequency front end 422 according to an embodiment. The filters 423 can include one or more SAW resonators in accordance with any suitable principles and advantages discussed herein. The wireless communication device 420 can be any suitable wireless communication device. For instance, a wireless communication device 420 can be a mobile phone, such as a smart phone. As illustrated, the wireless communication device 420 includes an antenna 421, an RF front end 422, a transceiver 424, a processor 425, a memory 426, and a user interface 427. (per claim 17)
With regards to claims 3, 14 and 19, a difference between a coefficient of thermal expansion of the quartz substrate and a coefficient of thermal expansion of support layer 246 is 0 (13 ppm/deg or less), since but are composed of quartz.
With regards to claim 4, the packaging structure includes a functional layer 214 which can be a single crystal layer arranged to confine acoustic energy and lower a higher frequency spurious response (i.e. a shield structure base) and a frame 270 (i.e. a pillar) at least partially between the piezoelectric substrate and the functional layer.
With regards to claim 5, further including a second interdigital transducer electrode 248, at least a portion of the frame is positioned between the interdigital transducer electrode and the second interdigital transducer electrode.
With regards to claim 6, the packaging structure includes an electrode 256 (i.e. a terminal).
With regard to 7, further comprising vias 222 and metal layers 220 (i.e. a routing structure ) electrically connected to the interdigital transducer electrode. “Vias 222 extend between metal layers 220, 250 attached to the IDT electrodes 218, 248 of the first and second acoustic wave resonators or devices or dies 210, 240 .” Paragraph [0044]
With regards to claim 8, the interdigital transducer electrode is electrically coupled to the terminal at least partially through the routing structure. “The second acoustic wave device 240 has vias 254 that extend from the IDT electrode 248 to electrodes 256 on an opposite side of the support layer 246 from the IDT electrode 248”. Paragraph [0044]
With regards to claim 9, the electrode (i.e. the terminal ) is an external electrode, and the routing structure includes a metallization pattern of electrical trace (metal layer 220 ). Figure 3
With regards to claim 10, the frame is composed of copper. Paragraph [0051]
With regards to claim 15, the packaged multi-layer piezoelectric substrate surface acoustic wave device includes vias 222 and metal layer 220 (i.e. a routing structure) electrically connected to the interdigital transducer electrode, and the packaging structure includes an electrode 256 (i.e. a terminal ) electrically coupled to the interdigital transducer electrode at least partially through the routing structure. Paragraph [0044]
With regards to claim 20, the filter and other plurality of filters are included in a radio frequency front end coupled between the transceiver and the antenna. (figure 13A)
Allowable Subject Matter
Claims 2 , 11, 13, 16 and 18 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
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March 18, 2026
/K.E.G/Examiner, Art Unit 2843
/ANDREA LINDGREN BALTZELL/Supervisory Patent Examiner, Art Unit 2843