DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application is being examined under the pre-AIA first to invent provisions.
Priority
This application is a CON of 16/889,190 06/01/2020 PAT 12002762
16/889,190 is a CON of 16/135,695 09/19/2018 PAT 10672713
16/135,695 is a CON of 15/350,393 11/14/2016 PAT 10103105
15/350,393 is a CON of 14/992,535 01/11/2016 PAT 9548264
14/992,535 is a CON of 13/722,203 12/20/2012 PAT 9236366
Information Disclosure Statement
The information disclosure statement (IDS) submitted on November 27, 2024, is in compliance with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statement is being considered by the examiner.
Election/Restrictions
Applicant’s election without traverse of group I claims 8-24 in the reply filed on June 8, 2026, is acknowledged.
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 8-24 rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
Regarding claim 8:
-“a bridge in the substrate” is unclear. The claim does not specify whether the bridge is fully embedded within the substrate, partially embedded, formed as part of the substrate or mounted within a cavity of the substrate. Because the claim fails to define the structural relationship between the bridge and the substrate with reasonable certainty, one of ordinary skill in the art would not understand the metes and bounds of the claim.
- The claim recites “a layer comprising a polymer; a first metal pad over the layer; a second metal pad over the layer”. The term “over” is unclear because the claim does not specify whether the metal pads are directly on the polymer comprising layer, if they metal layers are vertically aligned with the layer, or positioned relative to the layer based on an orientation of the device.
Because the term “over” is unclear, the claim is indefinite.
The term “conductive path” is unclear because a conductive path is not itself a structural element in the mechanical sense, but it can define or shape a functional structure in electrical and electronic systems. The specification does not define a clear meaning for “conductive path” (for ex. a trace, via, conductor) and fails to inform one of ordinary skill in the art of the scope of the claim. Therefore, the claim is indefinite.
Dependent claims 9- do not cure the deficiencies of independent claim 17.
Regarding claim 17:
-Claim 17 recites the limitation "the first layer" in lines 4 and 7. There is insufficient antecedent basis for this limitation in the claim. The claim should be amended to read “the layer”.
- The claim recites that the first metal pad and second metal pad are proximate a first end of the layer and recites that the third metal pad and the second metal pad are proximate a second end of the layer. Thus, the second metal pad appears to be required to be proximate both the first end and the opposing second end. It is unclear whether this is intended, whether the second metal pad extends between both ends, or whether the reference to the second metal pad in the second-end limitation is a typographical error. Accordingly, the scope of the claim is not reasonably certain.
-the term “proximate” is a relative term which renders the claim indefinite. The term “proximate” is not defined by the claim, the specification does not provide a standard for ascertaining the requisite degree, and one of ordinary skill in the art would not be reasonably apprised of the scope of the invention.
- The claim recites that the first, second, third, and fourth metal pads are “over the first layer.” The term “over” is ambiguous because the claim does not specify whether the pads are directly on the first layer, above the first layer with intervening layers, vertically aligned with the first layer, laterally overlapping the first layer, or positioned relative to the first layer based on an arbitrary orientation of the device. Accordingly, the claim does not provide reasonably certain boundaries for the location of the pads.
-The claim recites “a first conductive path” and “a second conductive path,” but does not define the structures that constitute the conductive paths. It is unclear whether each conductive path is a trace, redistribution line, via, metal layer, plated conductor, wire, solder structure, or another conductive element. If the specification does not provide a clear structural meaning for “conductive path,” the claim is indefinite.
-The claim recites “electrically coupling” and “for electrical coupling” but does not specify whether the electrical coupling is direct or indirect, whether intervening conductive structures may be present, or what degree or type of electrical connection is required. If the specification does not define the scope of “electrically coupling,” the claim fails to inform one of ordinary skill in the art with reasonable certainty of the scope of the claimed interconnect bridge.
- The claim recites metal pads that are “for electrical coupling with the first die” and “for electrical coupling with the second die.” These phrases appear to state intended use or capability, but the claim does not recite the structural features by which the pads are adapted for such coupling, such as exposed surfaces, solderable finishes, bump pads, or other coupling structures. If these phrases are intended to limit the structure, the claim is indefinite because the required structure is unclear.
Dependent claims 18-24 do not cure the deficiencies of independent claim 17.
The following is a quotation of the first paragraph of 35 U.S.C. 112(a):
(a) IN GENERAL.—The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor or joint inventor of carrying out the invention.
The following is a quotation of the first paragraph of pre-AIA 35 U.S.C. 112:
The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor of carrying out his invention.
Claim 17 is rejected under 35 U.S.C. 112(a) or 35 U.S.C. 112 (pre-AIA ), first paragraph, as failing to comply with the written description requirement. The claim(s) contains subject matter which was not described in the specification in such a way as to reasonably convey to one skilled in the relevant art that the inventor or a joint inventor, or for applications subject to pre-AIA 35 U.S.C. 112, the inventor(s), at the time the application was filed, had possession of the claimed invention.
“a third and a fourth metal pad” is not mentioned in the applicant’s specification and appears to have no basis in the original application.
Dependent claims 18-24 do not cure the deficiencies of independent claim 17.
The examiner suggests amending the claims to read:
8. A device comprising: a substrate; a first die mounted to and electrically coupled to the substrate; a second die mounted to and electrically coupled to the substrate; and a bridge embedded within the substrate, the bridge comprising:
a polymer layer comprising:
a first metal pad disposed on the polymer layer; a second metal pad disposed the polymer layer; and a metal conductive trace disposed on the polymer layer and electrically connecting the first metal pad to the second metal pad; wherein the first die is electrically connected to the first metal pad of the bridge, and the second die is electrically connected to the second metal pad of the bridge.
17. An interconnect bridge configured to be embedded within a substrate and configured to
electrically connect a first die to a second die, the interconnect bridge comprising:
a first layer comprising an organic material; the first layer having a first end and second end opposite the first end;
a first metal pad and a second metal pad disposed on the first layer adjacent to the first end, the first metal pad and the second metal pad configured to electrically connect to the first die.
a third metal pad and a fourth metal pad disposed on the first layer adjacent to the second end, the third metal pad and the fourth metal pad configured to electrically connect to the second die;
a first conductive trace disposed on the first layer and electrically connecting the first metal pad to the third metal pad; a second conductive trace disposed on the first layer and electrically connecting the second metal layer to the fourth metal pad.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of pre-AIA 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a) the invention was known or used by others in this country, or patented or described in a printed publication in this or a foreign country, before the invention thereof by the applicant for a patent.
Claim(s) 1 is/are rejected under pre-AIA 35 U.S.C. 102(a)(1) as being anticipated by Chang (US 2011/0233764).
In regard to claim 1, Chang teaches a device comprising: a substrate (101); a first die (105) mounted to and electrically coupled to the substrate (101); a second die (107) mounted to and electrically coupled to the substrate (101); and a bridge (103) embedded within the substrate (101), the bridge (103) comprising:
a polymer layer (Revalpha #3195MS, paragraph [0018], which is a polyester (polymer)) comprising:
a first metal pad (left signal pad 109a; figure 1) disposed on the polymer layer (103); a second metal pad (right signal pad 109a; figure 1) disposed the polymer layer (103); and a metal conductive trace (109) disposed on the polymer layer (103) and electrically connecting the first metal pad (109a) to the second metal pad (109a); wherein the first die (105) is electrically connected to the first metal pad (109a) of the bridge (103), and the second die (107) is electrically connected to the second metal pad (109a) of the bridge (103).
Allowable Subject Matter
Claim 17 would be allowable if rewritten or amended to overcome the rejection(s) under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), 2nd paragraph, set forth in this Office action.
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Yoshimura (US 6,690,845) teaches interconnecting semiconductor chips. Hsuan (US 6,239,366) teaches a multi-chip package. Rostoker (US 5,563,380) teaches mounting IC chips on a mini board.
Communication
Any inquiry concerning this communication or earlier communications from the examiner should be directed to KRYSTAL ROBINSON whose telephone number is (571)272-9258. The examiner can normally be reached on 9-5 M-F.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Timothy Dole can be reached on (571)-272-2229. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/KRYSTAL ROBINSON/Examiner, Art Unit 2848
Prosecution Insights