DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Objections
Claims 5-6 are objected to because of the following informalities:
Claim 5, Lines 5-6, “one o via-hole” should be rewritten as –one via-hole—for grammatical clarity.
Claim 6, Lines 2, “moulded” should be rewritten as --molded-- for grammatical clarity.
Appropriate correction is required.
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 1-33 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention. Claims 2-4, 6-9, 13-15, 17-19, and 21-33 depend upon rejected claims 1 and 20 and inherit the deficiency thereby.
Claim 1, Line 5; and Claim 20, Line 7 recite the limitation "the first inductor coil". There is insufficient antecedent basis for this limitation in the claim.
Claim 1, Line 7; and Claim 20, Line 9, “the first conductive wire” is unclear to one of ordinary skill in the art as to which one of the “a plurality of first conductive wires” as previously defined within claims 1 and 20 are referring to, thereby leaving the boundaries of the claim unclear.
Claim 1, Line 9; and Claim 20, Line 11, “a portion of the first inductor coil” is unclear to one of ordinary skill in the art as to whether this recitation of “a portion” is the same or different than that “a portion” as previously defined in line 5 of the same claim, leaving the boundaries of the claim unclear.
Claim 5, Line 3, “a plurality of via-holes” is unclear to one of ordinary skill in the art as to how this recitation relates to the “a via-hole” as previously defined in Claim 1, from which this claim depends, thereby leaving the boundaries of the claim unclear.
Claims 10-12 and 16, all recitations of “the through-hole” are unclear to one of ordinary skill in the art as to which one of the “a plurality of through-holes” as previously defined in Claim 1, from which this claim depends, is referring to, and whether the singular “through-hole” is in reference to a corresponding respective conductive pillar, leaving the boundaries of the claim unclear.
Appropriate correction is required.
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1, 4-6, 20, 31 and 33 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Ahn (US 6756875).
As per Claims 1, 4-6, 20, 31 and 33:
Ahn Discloses in Figure 5A: An electronic device (as per Claim 33, the substrate comprising a package for an electronic device, [Col. 3, Lines 58-61]) comprising a method for manufacturing (as per claim 20, [Col. 1, Lines 35-39]) a filter with a first inductor (100, as shown in related Figure 1A), a base substrate (110) comprising a plurality of through holes (“paths”, 140) corresponding to and forming (as per claim 20, the limitations as defined throughout the claim are inherently formed to achieve the filter structure as is known to one of ordinary skill in the art) a plurality of conductive pillars (“conductive posts”, 210) being filled in the through-hole (as is evident by Figure 5A) and forming a portion of the first inductor coil (230) and being integrally molded with the first conductive layer (as per Claim 6, “bottom surface” 130 with the “conductive segments” 220, 210 and 220 form the conductor coil 230, [Col.7, Lines 27-31] and are thereby inherently integrally molded, as is known to one of ordinary skill in the art), a first conductive layer (“bottom surface”, 130 with the lower “conductive segments”, 220 inherently form a conductive layer) on a side of the base substrate (as is evident by related Figure 5C) having a first plurality of conductive wires (the lower “conductive segments”, 220 on the surface 130) between two of the conductive pillars (as is evident by Figure 5A) and forming a portion of the first inductor coil (220 are interconnected to form conductive coil 230, [Col. 7, Lines 27-31]), and a second conductive layer (“magnetic core”, 240, which is inherently a conductive material, as is known to one of ordinary skill in the art) on a side of the first conductive layer away from the base substrate (240 is disposed on the bottom surface 130 as is evident by the Figure) comprising second conductive wires (the upper “conductive segments”, 220 near surface 120) corresponding to the first and connected to the first through a via-hole (as per Claims 1 and 5, the upper and lower 220 segments are connected by paths 140), and an orthographic projection, on the base substrate (110), of the second conductive wire (upper 220) falls on an orthographic projection, on the base substrate, of the first conductive wire (as per Claims 4 and 31, lower 220, the upper and lower segments 220 intersect when placed in the projection, as is evident by related Figures 5B and 5C), and (as per Claim 5) two conductive pillars (210) are connected to a same first conductive wire (lower 220, as is evident by 2 pillars connected to each singular lower segment 220 in Figure 5A) and an orthographic projection on the base substrate of one conductive pillar is overlapped with that of a via hole and another conductive pillar is overlapped with another via-hole (210 is within path 140 and therefore is inherently overlapped in an orthographic projection).
Conclusion
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/ABIGAIL AMIR YALDO/Examiner, Art Unit 2843
/ANDREA LINDGREN BALTZELL/Supervisory Patent Examiner, Art Unit 2843
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