Prosecution Insights
Last updated: October 02, 2026
Application No. 18/691,057

ROD MANUFACTURING METHOD AND ANODE DEVICE

Non-Final OA §103
Filed
Mar 12, 2024
Priority
Oct 19, 2021 — JP 2021-170813 +1 more
Examiner
MENDEZ, ZULMARIAM
Art Unit
Tech Center
Assignee
Hitachi Ltd.
OA Round
1 (Non-Final)
66%
Grant Probability
Favorable
1-2
OA Rounds
7m
Est. Remaining
87%
With Interview

Examiner Intelligence

Grants 66% — above average
66%
Career Allowance Rate
633 granted / 958 resolved
+6.1% vs TC avg
Strong +21% interview lift
Without
With
+21.1%
Interview Lift
resolved cases with interview
Typical timeline
3y 2m
Avg Prosecution
43 currently pending
Career history
986
Total Applications
across all art units

Statute-Specific Performance

§101
0.9%
-39.1% vs TC avg
§103
62.6%
+22.6% vs TC avg
§102
22.1%
-17.9% vs TC avg
§112
9.8%
-30.2% vs TC avg
Black line = Tech Center average estimate • Based on career data from 958 resolved cases

Office Action

§103
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows: 1. Determining the scope and contents of the prior art. 2. Ascertaining the differences between the prior art and the claims at issue. 3. Resolving the level of ordinary skill in the pertinent art. 4. Considering objective evidence present in the application indicating obviousness or non-obviousness. Claims 1-4 are rejected under 35 U.S.C. 103 as being unpatentable over Liu et al. (CN 108950625) in view of Singh et al. (US Patent Application Publication no. 2007/0068819). Regarding claim 1, Liu discloses a method for manufacturing a rod/workpiece (8; figures 1, 3-4) by plating the rod (paragraphs 5, 46), comprising: a step of arranging the rod/workpiece (8) in a first tube body formed by arranging a plurality of rod-shaped members (42) in an annular shape (figures 3, 6), a step of plating the rod (8) by causing a plating liquid to flow in one direction through a first flow path between the first tube body (paragraph 53 – the electrolyte flows through the inlet 23 from the bottom of the working tank 2 through the outlet 22), and wherein each of the rod-shaped members is covered with a platinum at least on a surface facing the rod (paragraph 47). Liu fails to teach wherein each of the rod-shaped members has a polyqonal column shape. Singh discloses a method for electroplating conductive materials on a desired substrate comprising a plurality of anode elements having a surface selected from a variety of shapes including a triangle, rectangle, square, and hexagon, among others. The anode elements may be arranged in hexagonal, rectangular, or circular arrangements in order to reduce the terminal effect, promote uniform plating thickness, compensate uneven plating and control electroplating profiles (paragraphs 50, 55, 70). It would have been obvious to one having ordinary skill in the art at the time of filing to select polygonal-shaped members as the anodes of Liu because as taught by Singh, this arrangement reduces the terminal effect, promotes uniform plating thickness, compensates uneven plating and controls electroplating profiles as desired. It is important to note that it has been held by the courts that the shape of an element is an obvious matter of design choice, absent persuasive evidence that the particular configuration is significant. MPEP 2144.04.IV.B. Regarding claim 2, Liu teaches that each of the rod-shaped members is covered with platinum at least on a surface facing the rod (paragraph 47), wherein a first surface is caused to face the rod (figure 3), and the plating liquid is caused to flow between the first surface and the rod/workpiece (8; paragraph 53 – the electrolyte flows through the inlet 23 from the bottom of the working tank 2 through the outlet 22). Liu fails to teach wherein the rod-shaped member has a rectangular column shape having a first surface formed by first side portions and second side portions that are shorter than the first side portions and a second surface formed by third side portions that are shorter than the first sides and the second sides. Singh discloses a method for electroplating conductive materials on a desired substrate comprising a plurality of anode elements having a surface selected from a variety of shapes including a triangle, rectangle, square, and hexagon, among others. The anode elements may be arranged in hexagonal, rectangular, or circular arrangements in order to reduce the terminal effect, promote uniform plating thickness, compensate uneven plating and control electroplating profiles (paragraphs 50, 55, 70). It would have been obvious to one having ordinary skill in the art at the time of filing to select polygonal-shaped members as the anodes of Liu because as taught by Singh, this arrangement reduces the terminal effect, promotes uniform plating thickness, compensates uneven plating and controls electroplating profiles as desired. Regarding claim 3, Liu further teaches wherein a gap is provided between the rod-shaped members (42) adjacent to each other (figures 3, 6). The electrolyte solution flows in one direction through the inlet (23) from the bottom of the working tank (2) through the outlet (22) and recirculates back into the working tank (2; paragraph 57). Given that Liu teaches recirculation of the electrolyte to conduct a second working process, it would have been obvious to one having ordinary skill in the art at the time of filing to dispose a second tube body/working tank (2) on an outer peripheral side of the first tube body (2) so that the electrolyte with adjusted temperature and composition enters a second working tank (paragraph 57). Regarding claim 4, Liu discloses an anode device (paragraphs 15-19, 47-49) comprising a plurality of rod-shaped members (42) that are disposed in an annular shape to form a first tube body (as shown in figures 3, 6) and form a space through which a plating liquid flows between the first tube body and a rod/workpiece (8) disposed in the first tube body (paragraph 53 – the electrolyte flows through the inlet 23 from the bottom of the working tank 2 through the outlet 22), wherein a positive voltage is applied to the anode device wherein each of the rod-shaped members (42) is covered with a platinum at least on a surface facing the rod (8; paragraphs 48-52). Liu fails to teach wherein each of the rod-shaped members has a polyqonal column shape. Singh discloses a method for electroplating conductive materials on a desired substrate comprising a plurality of anode elements having a surface selected from a variety of shapes including a triangle, rectangle, square, and hexagon, among others. The anode elements may be arranged in hexagonal, rectangular, or circular arrangements in order to reduce the terminal effect, promote uniform plating thickness, compensate uneven plating and control electroplating profiles (paragraphs 50, 55, 70). It would have been obvious to one having ordinary skill in the art at the time of filing to select polygonal-shaped members as the anodes of Liu because as taught by Singh, this arrangement reduces the terminal effect, promotes uniform plating thickness, compensates uneven plating and controls electroplating profiles as desired. It is important to note that it has been held by the courts that the shape of an element is an obvious matter of design choice, absent persuasive evidence that the particular configuration is significant. MPEP 2144.04.IV.B. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to ZULMARIAM MENDEZ whose telephone number is (571)272-9805. The examiner can normally be reached M-F 8am-4:30p. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, James Lin can be reached at 571-272-8902. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /ZULMARIAM MENDEZ/Primary Examiner, Art Unit 1794
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Prosecution Timeline

Mar 12, 2024
Application Filed
Sep 21, 2026
Non-Final Rejection mailed — §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
66%
Grant Probability
87%
With Interview (+21.1%)
3y 2m (~7m remaining)
Median Time to Grant
Low
PTA Risk
Based on 958 resolved cases by this examiner. Grant probability derived from career allowance rate.

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