Prosecution Insights
Last updated: July 17, 2026
Application No. 18/702,987

CONDUCTIVE PASTE FOR BONDING

Non-Final OA §103
Filed
Apr 19, 2024
Priority
Nov 30, 2021 — JP 2021-194501 +1 more
Examiner
YANG, JIE
Art Unit
Tech Center
Assignee
Daicel Corporation
OA Round
1 (Non-Final)
62%
Grant Probability
Moderate
1-2
OA Rounds
1y 2m
Est. Remaining
82%
With Interview

Examiner Intelligence

Grants 62% of resolved cases
62%
Career Allowance Rate
773 granted / 1244 resolved
+2.1% vs TC avg
Strong +19% interview lift
Without
With
+19.4%
Interview Lift
resolved cases with interview
Typical timeline
3y 5m
Avg Prosecution
48 currently pending
Career history
1305
Total Applications
across all art units

Statute-Specific Performance

§101
0.2%
-39.8% vs TC avg
§103
68.4%
+28.4% vs TC avg
§102
3.7%
-36.3% vs TC avg
§112
2.1%
-37.9% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1244 resolved cases

Office Action

§103
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . This application is a 371 of PCT/JP2022/043839 11/22/2022, FOREIGN APPLICATIONS JAPAN 2021-194501 11/30/2021. DETAILED ACTION Claims 1-7 remain for examination, wherein claim 1 is an independent claim. Claim Objections Claim 1 is objected to because of the following informalities: the da-db and dc should have proper unit. Appropriate correction is required. Claim Rejections - 35 USC § 103 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claims 1-7 are rejected under 35 U.S.C. 103(a) as being unpatentable over Konno Norijiro et al (JP 2004027347 A, with on-line translation, thereafter JP’347) in view of Mine et al (WO 2008/062548 A1, listed in IDS filed on 7/19/2024, with on-line English translation, thereafter WO’548). Regarding claims 1 and 7, JP’734 teaches a metal colloid organo-sol which has high concentration and the nano-order grain size distribution of metal colloid particles of nano-order sizes with a metal salt and the aliphatic amine into the organic solvent and reducing the mixture after stirring the same (Abstract, table 1, par.[0004], claims, and examples of JP’734), which reads on the conductive paste comprising metal nanoparticles with amine and dispersion organic solvent as claimed in the instant claims 1 and 7. JP’734 indicates that the organic solvent having a Hansen Solubility Parameter of 20 MPa1/2 or less (par.[0026] of JP’734) and JP’734 specify include hexane, octane, cyclohexane, benzene, toluene, and xylene. The organic solvents may be used alone or in combination of two or more (par.[0027] of JP’734), which reads on the claimed different organic solvent and overlap the claimed Hansen solubility parameters as claimed in the instant claim 1. MPEP 2144 05 I. It would have been obvious to one of ordinary skill in the art at the time the invention was made to apply different organic solvents with proper Hansen solubility parameters as claimed from the disclosure of JP’734 since JP’734 teaches the same conductive paste with organic solvent throughout the whole disclosed range. JP’734 does not specify the boiling temperature as claimed in the instant claim 1. WO’548 teaches a pasty metal particle composition comprising 100 parts by weight of metal particles which have a mean particle diameter of 0.001 to 50 μm and whose surfaces are coated with a water-repellent organic substance and 3 to 30 parts by weight of a volatile dispersion medium for bonding application and the boiling point of the volatile dispersion medium is preferably 60°C. to 300°C (Abstract and par.[0016] of WO’548), which overlap the claimed boiling temperature ranges as claimed in the instant claim 1. Therefore, it would have been obvious to one of ordinary skill in the art at the time the invention was made to choose proper organic solvent with proper boiling temperature as demonstrated by WO’548 for the metal paste of JP’734 since WO’548 indicates proper boiling temperature for desired bonding application (par.[0016] of WO’548). Regarding claims 2-3, WO’548 teaches a pasty metal particle composition comprising 100 parts by weight of metal particles which have a mean particle diameter of 0.001 to 50 μm and whose surfaces are coated with a water-repellent organic substance and 3 to 30 parts by weight of a volatile dispersion medium (Abstract and claims of WO’548) and the shape of the metal particles is spherical, approximately spherical, approximately cubic, flakes, indefinite. From the viewpoint of storage stability, a flake shape is preferable (par.[0014] of WO’548), which overlaps the claimed particle sizes and the total content proportion of the metal particles as claimed in the instant claims. MPEP 2144 05 I. Therefore, it would have been obvious to one of ordinary skill in the art at the time the invention was made to optimize the particle sizes and the total content proportion of the metal particles as demonstrated by WO’548 for the metal paste of JP’734 since WO’548 indicates proper particles distribution for desired bonding application (par.[0014] of WO’548). Regarding claim 4, WO’548 teaches metal particle size distribution and prefer of range 0.1-10 mm (par.[0014] of WO’548). Therefore, it would have been obvious to one of ordinary skill in the art at the time the invention was made to optimize the particle sizes distribution as demonstrated by WO’548 for the metal paste of JP’734 since WO’548 indicates proper particles distribution for desired bonding application (par.[0014] of WO’548). Regarding claim 5, JP’734 specify applying aliphatic amine in the present invention is each aliphatic amine (table 1 of JP’734), which reads on the claimed amine as claimed in the instant claim. Regarding claim 7, JP’734 specify include hexane, octane, cyclohexane, benzene, toluene, and xylene. The organic solvents may be used alone or in combination of two or more (par.[0027] of JP’734), It would have been obvious to one of ordinary skill in the art at the time the invention was made to apply different organic solvents as claimed from the disclosure of JP’734 since JP’734 teaches the same conductive paste with organic solvent throughout the whole disclosed range. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to JIE YANG whose telephone number is (571)270-1884. The examiner can normally be reached on IFP. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Jonathan J Johnson can be reached on 571-272-1177. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of an application may be obtained from the Patent Application Information Retrieval (PAIR) system. Status information for published applications may be obtained from either Private PAIR or Public PAIR. Status information for unpublished applications is available through Private PAIR only. For more information about the PAIR system, see http://pair-direct.uspto.gov. Should you have questions on access to the Private PAIR system, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative or access to the automated information system, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /JIE YANG/Primary Examiner, Art Unit 1734
Read full office action

Prosecution Timeline

Apr 19, 2024
Application Filed
Jun 10, 2026
Non-Final Rejection mailed — §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
62%
Grant Probability
82%
With Interview (+19.4%)
3y 5m (~1y 2m remaining)
Median Time to Grant
Low
PTA Risk
Based on 1244 resolved cases by this examiner. Grant probability derived from career allowance rate.

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