Prosecution Insights
Last updated: July 17, 2026
Application No. 18/705,632

LAMINATED STRUCTURE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING THE SAME

Non-Final OA §102
Filed
Apr 29, 2024
Priority
Jan 27, 2022 — JP 2022-011344 +2 more
Examiner
SAMPLE, DAVID R
Art Unit
1787
Tech Center
1700 — Chemical & Materials Engineering
Assignee
Gaianixx Inc.
OA Round
1 (Non-Final)
80%
Grant Probability
Favorable
1-2
OA Rounds
7m
Est. Remaining
90%
With Interview

Examiner Intelligence

Grants 80% — above average
80%
Career Allowance Rate
522 granted / 654 resolved
+14.8% vs TC avg
Moderate +10% lift
Without
With
+10.1%
Interview Lift
resolved cases with interview
Typical timeline
2y 9m
Avg Prosecution
14 currently pending
Career history
683
Total Applications
across all art units

Statute-Specific Performance

§101
0.1%
-39.9% vs TC avg
§103
60.7%
+20.7% vs TC avg
§102
13.1%
-26.9% vs TC avg
§112
8.0%
-32.0% vs TC avg
Black line = Tech Center average estimate • Based on career data from 654 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant’s election without traverse of Group I, claims 28-33, in the reply filed on 06 February 2026 is acknowledged. Claims 1-2 and 6-16 are withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to nonelected inventions, there being no allowable generic or linking claim. Election was made without traverse in the reply filed on 06 February 2026. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claims 28 and 32-34 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Ramdani et al. (US 2004/0149202 A1)(Ramdani). Ramdani discloses a layered (i.e., laminated) structure. The layered structure is as shown in the below table with the corresponding claim 28 limitation: Ramdani Corresponding claim 1 limitation Substrate 22 formed of monocrystalline semiconductor, silicon (see Figure 1 and paragraphs [0016] and [0017]; Example 1). a crystal substrate Amorphous intermediate layer 28 such as SiOx (Id. and paragraph [0019]) an amorphous thin film … between the crystal substrate and the epitaxial layer Accommodating monocrystalline buffer layer (i.e., epitaxial layer) such as SrzBa1-zTiO3 (Id.) epitaxial layer The amorphous thin film contains silicon (i.e., constituent metal) which is also present in the crystal substrate, silicon. Ramdani teaches the thickness of the amorphous intermediate layer is 0.5 to 5 nm (paragraph [0018]) which is sufficiently specific to anticipate the range recited in claim 32. Claim 33 is rejected because the limitations of the claim relate to an optional feature. As to claim 34, Ramdani teaches the semiconductor structure is used for an integrated circuit (i.e., electronic device). See the title. Claims 28-29 and 32-34 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Oba et al. (“Epitaxial Growth of Cuprous Oxide Electrodeposited onto Semiconductor and Metal Substrates,” J. Am. Ceram. Soc., 88 [2] 253–270 (2005))(Oba). Oba discloses an epitaxial cuprous oxide layer deposited on an Si single crystal substrate. See title and abstract. The laminate includes an amorphous silicon oxide layer containing small amounts of copper. See Figure 7(a) and the first column of page 258: “The HRTEM image in Fig. 5(b) confirms this conclusion: the two crystals are separated by an ‘‘interlayer’’ with a thickness of ≈ 3 nm, and the speckle pattern by which this layer appears in the image indicates that it consists of amorphous material.” “[T]he region of the amorphous interlayer located approximately at the center of the figure is significantly O-rich. In addition, the Cu concentration is low — the main components are Si and O.” Thus, the amorphous layer contains a constituent metal of the epitaxial layer (i.e., Cu) and the crystal substrate (i.e., Si) which meets the limitations of instant claim 28 and 29. As to claim 32, the amorphous interlayer has a thickness if approximately 3 nm. Id. Claim 33 is rejected because the limitations of the claim relate to an optional feature. As to claim 34, Oba discloses the semiconductor structure is used for microelectronic devices. See the first sentence of the introduction and the conclusion. Allowable Subject Matter Claims 30 and 31 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to David Sample whose telephone number is (571)272-1376. The examiner can normally be reached Monday to Friday 7AM to 3:30 PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Humera Sheikh can be reached at (571)272-0604. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /David Sample/Primary Examiner, Art Unit 1784
Read full office action

Prosecution Timeline

Apr 29, 2024
Application Filed
Apr 29, 2024
Response after Non-Final Action
Jun 10, 2026
Non-Final Rejection mailed — §102 (current)

Precedent Cases

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2y 4m to grant Granted Jun 16, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
80%
Grant Probability
90%
With Interview (+10.1%)
2y 9m (~7m remaining)
Median Time to Grant
Low
PTA Risk
Based on 654 resolved cases by this examiner. Grant probability derived from career allowance rate.

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