DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Specification
The title of the invention is not descriptive. A new title is required that is clearly indicative of the invention to which the claims are directed.
The following title is suggested: Multi-layer flexible cooling element with varying heat flux densities.
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 1 and 9 (and all claims dependent thereon) rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
As to Claims 1 and 9, the claim states that the multi-layer film is “thinner in a region with a higher heat flux density,” while later stating “the thinner region with a lower heat flux density of the multi-layer film is arranged to the second electronic component...” It is not clear if the thinner region has a higher or lower heat flux density.
Allowable Subject Matter
Claim 12 allowed.
The following is a statement of reasons for the indication of allowable subject matter:
The instant invention is directed to a device comprising at least one electronic assembly comprising electronic components, and comprising at least one cooling and/or temperature-control element for the cooling and/or temperature control of the electronic assembly, wherein the cooling and/or temperature-control element has at least one fluid channel for a cooling and/or temperature-control medium, wherein the fluid channel extends from a coolant inlet to a coolant outlet of the cooling and/or temperature-control element, wherein the cooling and/or temperature-control element has a flexible multi-layer film and a further flexible multi-layer film, wherein the multi-layer film and the further multi-layer film are connected to one another in connecting areas, forming the fluid channel, wherein the multi-layer film has regions with different heat flux densities, and is thinner in a region with a higher heat flux density than in a region with a lower heat flux density in comparison, wherein the multi-layer film is in direct contact with the electronic components of the electronic assembly, wherein the thinner region is formed by a material removal, wherein the electronic components of the electronic assembly are cooled with a cooling element with only one fluid channel wherein inhomogeneities in a flow field of the cooling medium are compensated in such a way that a poorer heat transfer in an edge region of the fluid channel is compensated for by better heat dissipation in the film through material removal to increase the flow velocity of the cooling medium in this region.
The art of record (US 2013/0092354 to Semenov et al.) discloses a device (FIG. 2) comprising an electronic component (50), and comprising at least one cooling and/or temperature-control element (10) for the cooling and/or temperature control of the electronic assembly, wherein the cooling and/or temperature-control element has at least one fluid channel (34) for a cooling and/or temperature-control medium, wherein fluid channel has regions with different heat flux densities (40, 42), and is thinner in a region with a higher heat flux density than in a region with a lower heat flux density in comparison, wherein the multi-layer film is in direct contact with the electronic components of the electronic assembly. However, Semenov fails to disclose wherein the fluid channel extends from a coolant inlet to a coolant outlet of the cooling and/or temperature-control element, wherein the cooling and/or temperature-control element has a flexible multi-layer film and a further flexible multi-layer film, wherein the multi-layer film and the further multi-layer film are connected to one another in connecting areas, forming the fluid channel,
While the art of record teaches varying the thickness of a heat pipe in relation to heat flux density, it fails to disclose a coolant inlet and coolant outlet, a flexible multi-layer film, or wherein the thinner region is formed by a material removal, wherein the electronic components of the electronic assembly are cooled with a cooling element with only one fluid channel wherein inhomogeneities in a flow field of the cooling medium are compensated in such a way that a poorer heat transfer in an edge region of the fluid channel is compensated for by better heat dissipation in the film through material removal to increase the flow velocity of the cooling medium in this region.
Claims 1 and 9 would be allowable if rewritten or amended to overcome the rejection(s) under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), 2nd paragraph, set forth in this Office action.
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. US 2013/0092354 discloses a heat pipe with wall thickness varying by heat flux density.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to JAMIL ALEXANDER DECKER whose telephone number is (571)272-6578. The examiner can normally be reached 8am-5pm Mon-Fri.
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/JAMIL ALEXANDER DECKER/Examiner, Art Unit 2841
/MANDEEP S BUTTAR/Primary Examiner, Art Unit 2841
