Prosecution Insights
Last updated: July 17, 2026
Application No. 18/713,043

ELECTROSTATIC CHUCK AND BASE

Non-Final OA §102§103
Filed
May 23, 2024
Priority
Nov 26, 2021 — CN 202111419897.8 +1 more
Examiner
WHITMIRE, ERIC DANIEL
Art Unit
3722
Tech Center
3700 — Mechanical Engineering & Manufacturing
Assignee
Beijing Naura Microelectronics Equipment Co., Ltd.
OA Round
3 (Non-Final)
66%
Grant Probability
Favorable
3-4
OA Rounds
1y 3m
Est. Remaining
98%
With Interview

Examiner Intelligence

Grants 66% — above average
66%
Career Allowance Rate
49 granted / 74 resolved
-3.8% vs TC avg
Strong +31% interview lift
Without
With
+31.4%
Interview Lift
resolved cases with interview
Typical timeline
3y 5m
Avg Prosecution
10 currently pending
Career history
94
Total Applications
across all art units

Statute-Specific Performance

§103
73.2%
+33.2% vs TC avg
§102
10.8%
-29.2% vs TC avg
§112
13.6%
-26.4% vs TC avg
Black line = Tech Center average estimate • Based on career data from 74 resolved cases

Office Action

§102 §103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Continued Examination Under 37 CFR 1.114 A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after final rejection. Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, the finality of the previous Office action has been withdrawn pursuant to 37 CFR 1.114. Applicant's submission filed on 02/12/2026 has been entered. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 13 and 15-17 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Yoon et al. (US 20200126836 A1, hereinafter ‘Yoon’). Regarding claim 13, Yoon teaches an electrostatic chuck 100 configured to absorb a plurality of wafers 10 comprising: a chuck body 124; a plurality of adsorption members 170 including an insulation layer 174, an electrode layer 172, and a dielectric layer 259 arranged sequentially in a direction away from the chuck body (Figs 5-6), and electrode layers of the plurality of adsorption members being in the same layer (Fig 6); and a voltage feed member 200 arranged between the adsorption members and the chuck body (Fig 2), electrically connected to electrode layers of the plurality of adsorption members ([0062]), and configured to feed direct current (DC) voltage into the electrode layer of each adsorption member ([0062]) of the plurality of adsorption members to allow the plurality of adsorption members to absorb the plurality of wafers in a one-to-one correspondence ([0062], Fig 6), wherein the chuck body includes a plurality of second grooves 124a arranged at intervals (Fig 2), shapes of the second grooves matching shapes of the adsorption members (Fig 2), and the plurality of adsorption members being arranged in the plurality of second grooves in a one-to-one correspondence ([0065], Fig 2). Regarding claim 15, Yoon teaches the electrostatic chuck according to claim 13, wherein: through holes are formed at the insulation layers of the adsorption members and pass through the insulation layers to the electrode layers (Fig 6); the voltage feed member 200 includes a wire structure including: an introduction end 240 configured to be electrically connected to the DC power source 114 ([0062]); a plurality of feed ends 253, a quantity of the plurality of feed ends being same as a quantity of the adsorption members (Figs 2-3), and the plurality of feed end being electrically connected to the electrode layers (Fig 2) via the through holes. Regarding claim 16, Yoon teaches the electrostatic chuck according to claim 15, wherein the wire structure includes: a ring-shaped wire 252 with an opening (Figs 2-3); an introduction wire 240a, one end of the introduction wire being electrically connected to one end of the ring-shaped wire at the opening (Fig 3), and the other end of the introduction wire being used as the introduction end (Fig 4), and a plurality of feed wires 260 arranged along a circumference of the ring-shaped wire at intervals (Figs 2-3), one end of each feed wire of the plurality of feed wires being electrically connected to the ring-shaped wire (Figs 2-3), and the other end of each feed wire of the plurality of feed wires being used as a corresponding feed end of the plurality of feed ends (Fig 2). Regarding claim 17, Yoon teaches the electrostatic chuck according to claim 16, wherein the voltage feed member further includes: an insulation sleeve sleeved at an outer side of the introduction wire ([0083]), the plurality of feed wires ([0087]), and the ring-shaped wire ([0084]); and a plurality of elastic conductive elements arranged at the plurality of feed ends in a one-to-one correspondence and electrically contacting the electrode layers of the plurality of adsorption members in a one-to-one correspondence ([0087]). Regarding claim 34, Yoon teaches the electrostatic chuck according to claim 13, wherein: the voltage feed member 200 includes a wire structure including: an introduction end 240 configured to be electrically connected to the DC power source 114 ([0062]); a plurality of feed ends 253, a quantity of the plurality of feed ends being same as a quantity of the adsorption members (Figs 2-3), and the plurality of feed end being electrically connected to the electrode layers (Fig 2); a ring-shaped wire 252 with an opening, such that the wire structure does not form a closed loop (Figs 2-3); an introduction wire 240a, one end of the introduction wire being electrically connected to one end of the ring-shaped wire at the opening (Fig 3), and the other end of the introduction wire being used as the introduction end (Fig 4), and a plurality of feed wires 260 arranged along a circumference of the ring-shaped wire at intervals (Figs 2-3), one end of each feed wire of the plurality of feed wires being electrically connected to the ring-shaped wire (Figs 2-3), one end of one of the plurality of feed wires being electrically connected to the other end of the ring-shaped wire at the opening (Fig 3), and the other end of each feed wire of the plurality of feed wires being used as a corresponding feed end of the plurality of feed ends (Fig 2). Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claims 13-17 and 22-24 are rejected under 35 U.S.C. 103 as being unpatentable over Guang et al. (CN 112133664 A, hereinafter ‘Guang’), and further in view of Kellerman et al. (US 20040212946 A1, hereinafter ‘Kellerman’). Regarding claim 13, Guang teaches an electrostatic chuck (Figs 1-7, [0033]) configured to absorb a plurality of wafers 700 comprising: a chuck body (Fig 6); a plurality of adsorption members 300 including an insulation layer ([0026]), an electrode layer 310, and electrode layers of the plurality of adsorption members being in the same layer (Fig 6), and a voltage feed member (Fig 6, wire structure including 410,510) arranged between the adsorption members 300 and the chuck body (Fig 6), electrically connected to electrode layers 310 of the plurality of adsorption members, and configured to feed direct current (DC) voltage (Fig 6, [0061]) into the electrode layer of each adsorption member of the plurality of adsorption members to absorb the plurality of wafers 700 in a one-to-one correspondence ([0039] [0048]), wherein the chuck body (Fig 6, including 100 and 200) includes a plurality of second grooves 210 arranged at intervals, shapes of the second grooves match shapes of the adsorption members (Figs 1-3), and the plurality of adsorption members being arranged in the plurality of second grooves in a one-to-one correspondence (Figs 1-3). Guang does not explicitly disclose a dielectric layer arranged sequentially in a direction away from the chuck body. However, Kellerman teaches an insulation layer 4, an electrode layer 5, and a dielectric layer 6 arranged sequentially ([0017]) in a direction away from the chuck body (Fig 1). It would have been obvious to someone of ordinary skill in the art before the effective filing date of the claimed invention to modify Guang to incorporate the dielectric layer on the adsorption member as disclosed by Kellerman in order to create the desired electric field and pressure distribution for the electrostatic chuck (Kellerman, [0036]). Regarding claim 14, Guang in view of Kellerman teaches the electrostatic chuck according to claim 13. Guang also teaches a positioning member 200 arranged at the chuck body and including: a plurality of positioning holes 210 arranged at intervals (Figs 1-2), the plurality of adsorption members 300 being arranged in the plurality of positioning holes 210 in a one-to-one correspondence (Figs 2-3, 5-6). Regarding claim 15, Guang in view of Kellerman teaches the electrostatic chuck according to claim 13. Guang also teaches through holes are formed at the insulation layers of the adsorption members and pass through the insulation layers to the electrode layers (Figs 4-5); the voltage feed member includes a wire structure including: an introduction end (shown in the annotated figure below) to be electrically connected to the DC power source (Fig 6); and a plurality of feed ends 410, a quantity of the plurality of feed ends 410 being same as a quantity of adsorption members 300, and the plurality of feed ends 410 being electrically connected to the electrode layers 310 via the through holes (Fig 6). Regarding claim 16, Guang in view of Kellerman teaches the electrostatic chuck according to claim 15. Guang also teaches the wire structure includes: an introduction wire 510, one end of the introduction wire being electrically connected to the ring-shaped wired (shown in the annotated figure above), and the other end of the introduction wire being used as the introduction end (Fig 6); and a plurality of feed wires 410 arranged along a circumference of the ring-shaped wire at intervals (Fig 6), on end of each feed wire of the plurality of feed wires being electrically connected to the ring-shaped wire (Fig 6), and the other end of each feed wire of the plurality of feed wires being used as a corresponding feed end the plurality of feed ends (Fig 6). Guang does not explicitly disclose a ring-shaped wire with an opening. However, Guang teaches a ring-shaped wire with “sufficient specificity” that one of ordinary skill in the art would arrive at the claimed combination. Moreover, one of ordinary skill in the art at the time of the claimed invention would have found it “obvious to try” shaping the ring-shaped wire with an opening as the teaching represents a finite number of identified, predictable combinations of shapes of the wire structure that are able to complete the circuit and provide charge to each of the adsorption members. KSR Int'l Co. v. Teleflex, Inc., 550 U.S. 398 (2007). Regarding claim 17, Guang in view of Kellerman teaches the electrostatic chuck according to claim 16. Guang also teaches the voltage feed member further includes: a plurality of elastic conductive elements 420 arranged at the plurality of feed ends 410 in a one-to-one correspondence ([0062]) and electrically contacting the electrode layers 310 of the plurality of adsorption members in a one-to-one correspondence (Fig 6, [0062]). Guang does not explicitly disclose an insulation sleeve sleeved at an outer side of the introduction wire, the plurality of feed wires, and the ring shaped wire. While the elements above are not disclosed by Guang, all of these elements are well known within the art of electrical wiring. Therefore, the Examiner takes Official Notice that it would have been obvious to one having ordinary skill in the art prior to the effective filing date of the Applicant’s invention to have incorporated each of these elements into the invention of Guang. Regarding claim 22, Guang in view of Kellerman teaches the electrostatic chuck according to claim 13. Guang also teaches a material of the chuck body includes a metal ([0042]). Guang does not explicitly disclose a material of the insulation layer includes ceramic. However, Kellerman teaches a material of the insulation layer includes ceramic ([0017]). It would have been obvious to someone of ordinary skill in the art before the effective filing date of the claimed invention to modify Guang as previously modified to utilize glass as the material for the insulation layer as disclosed by Kellerman because it is a non-conductive material that can be produced by standard methods (Kellerman, [0017]). Regarding claim 23, Guang teaches a base comprising: a chuck (Figs 1-7); and an electrostatic chuck ( [0033]) arranged on the chuck, configured to absorb a plurality of wafers 700 and including: a chuck body (Fig 6); a plurality of adsorption members 300 including an insulation layer ([0026]), an electrode layer 310, and electrode layers of the plurality of adsorption members being in the same layer (Fig 6), and a voltage feed member (Fig 6, wire structure including 410,510) arranged between the adsorption members 300 and the chuck body (Fig 6), electrically connected to electrode layers 310 of the plurality of adsorption members, and configured to feed direct current (DC) voltage (Fig 6, [0061]) into the electrode layer of each adsorption member of the plurality of adsorption members to absorb the plurality of wafers 700 in a one-to-one correspondence ([0039] [0048]), wherein the chuck body (Fig 6, including 100 and 200) includes a plurality of second grooves 210 arranged at intervals, shapes of the second grooves match shapes of the adsorption members (Figs 1-3), and the plurality of adsorption members being arranged in the plurality of second grooves in a one-to-one correspondence (Figs 1-3). Guang does not explicitly disclose a dielectric layer arranged sequentially in a direction away from the chuck body. However, Kellerman teaches an insulation layer 4, an electrode layer 5, and a dielectric layer 6 arranged sequentially ([0017]) in a direction away from the chuck body (Fig 1). It would have been obvious to someone of ordinary skill in the art before the effective filing date of the claimed invention to modify Guang to incorporate the dielectric layer on the adsorption member as disclosed by Kellerman in order to create the desired electric field and pressure distribution for the electrostatic chuck (Kellerman, [0036]). Regarding claim 24, Guang in view of Kellerman teaches the base according to claim 23. Guang also teaches an electrical feed assembly 510 electrically connected to the voltage feed member and configured to be electrically connected to the DC power source (Fig 6) and feed the DC voltage provided by the DC power source to the voltage feed member ([0061]), and an RF feed assembly 520 electrically connected to the chuck and configured to feed RF to the electrostatic chuck through the chuck (Fig 6, [0061]). Claims 18-20 are rejected under 35 U.S.C. 103 as being unpatentable over Guang further in view of Kellerman as applied to claims 13 and 15 above, and further in view of Chen et al. (CN 112670142 A, hereinafter ‘Chen’). Regarding claim 18, Guang in view of Kellerman teaches the electrostatic chuck according to claim 15. Guang also teaches a first groove 110, a shaped of the first groove matches a shape of the voltage feed member (at 410), and the voltage feed member is embedded in the first groove (Fig 6). Guang does not explicitly disclose an introduction channel provided at the chuck body, and the introduction channel communicates with the first groove, passes through the chuck body, and is configured for the introduction end to be electrically connected to the DC power source. However, Chen teaches an introduction channel (Fig 7, where the DC supply lines run through 620) are provided at the chuck body, and the introduction channel communicates with the first groove (Fig 7), and is configured for the introduction end to be electrically connected to the DC power source (Fig 7). It would have been obvious to someone of ordinary skill in the art before the effective filing date of the claimed invention to modify Guang as previously modified to incorporate the internal passages for the wire structure as disclosed by Chen in order to better protect the wire structure inside the body of the chuck. Regarding claim 19, Guang in view of Kellerman and Chen teaches the electrostatic chuck according to claim 18. Guang also teaches the plurality of second grooves 210 communicates with a part of the first groove 110 embedded with the plurality of feed ends 410. Regarding claim 20, Guang in view of Kellerman and Chen teaches the electrostatic chuck according to claim 19. Guang does not explicitly disclose the adsorption members are adhered to the second grooves. However, Kellerman teaches the adsorption members are adhered to the base ([0017]). It would have been obvious to someone of ordinary skill in the art before the effective filing date of the claimed invention to modify Guang as previously modified to use an epoxy adhesive as disclosed by Kellerman to ensure the adsorption member does not separate from the base when it is not desired. Claim 21 is rejected under 35 U.S.C. 103 as being unpatentable over Guang further in view of Kellerman as applied to claim 13 above, and further in view of Shamouilian et al. (US 5592358 A, hereinafter ‘Shamouilian’). Regarding claim 21, Guang in view of Kellerman teaches the electrostatic chuck according to claim 13. Guang does not explicitly disclose a thickness of the insulation layer is greater than or equal to 0.6 mm and smaller than or equal to 0.8 mm; a thickness of the electrode layer is greater than or equal to 0.03 mm and smaller than or equal to 0.04 mm; and a thickness of the dielectric layer is greater than or equal to 0.25 mm and smaller than or equal to 0.35 mm. However, Kellerman teaches a thickness of the dielectric layer is about 200 µm, which is substantially close to that of the instant claim. A prima facie case of obviousness exists where the claimed ranges and prior art do not overlap but are close enough that one in ordinary skill in the art would have expected them to have the same properties. Titanium Metals Corp. of America v. Banner, 778 f.2d 775, 227 USPQ 773 (Fed. Cir. 1985). See MPEP 2144.05. Additionally, Shamouilian teaches a thickness of the insulation layer is up to about 500 µm (Col 5 lines 31-35); and a thickness of the electrode layer is about 1 µm to 100 µm (Col 4 lines 59-61). Shamouilian teaches a thickness of the insulation layer that is substantially close to that of the instant claim. A prima facie case of obviousness exists where the claimed ranges and prior art do not overlap but are close enough that one in ordinary skill in the art would have expected them to have the same properties. Titanium Metals Corp. of America v. Banner, 778 f.2d 775, 227 USPQ 773 (Fed. Cir. 1985). See MPEP 2144.05. Shamouilian and the claims regarding the thickness of the electrode layer differ in that Shamouilian does not teach the exact same proportions as recited in the instant claims. However, one of ordinary skill in the art at the time the invention was made would have considered the invention to have been obvious because the compositional proportions taught by Shamouilian overlap the instantly claimed proportions and therefore are considered to establish a prima facie case of obviousness. It would have been obvious to one of ordinary skill in the art to select any portion of the disclosed ranges including the instantly claimed ranges from the ranges disclosed in the prior art reference, particularly in view of the fact that; “The normal desire of scientists or artisans to improve upon what is already generally known provides the motivation to determine where in a disclosed set of percentage ranges is the optimum combination of percentages”, In re Peterson, 65 USPQ2d 1379 (CAFC 2003). Response to Arguments Applicant's arguments filed 11/14/2025 have been fully considered but they are not persuasive. Applicant traverses the rejections under 35 U.S.C. 103 over Guang in view of Kellerman, Guang in view of Kellerman and Chen, and Guang in view of Kellerman Shamouilian. This argument is respectfully traversed. Applicant's arguments with respect to claims 13-24 fail to comply with 37 CFR 1.111(b) because they amount to a general allegation that the claims define a patentable invention without specifically pointing out how the language of the claims patentably distinguishes them from the references. Accordingly, the rejections are maintained. Applicant’s arguments with respect to claim(s) 34 have been considered but are moot because the new ground of rejection does not rely on any reference applied in the prior rejection of record for any teaching or matter specifically challenged in the argument. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to ERIC DANIEL WHITMIRE whose telephone number is (703)756-4729. The examiner can normally be reached 8 AM - 4 PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Sunil K. Singh can be reached at (571) 272-3460. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /ERIC DANIEL WHITMIRE/Examiner, Art Unit 3722 /SUNIL K SINGH/Supervisory Patent Examiner, Art Unit 3722
Read full office action

Prosecution Timeline

Show 2 earlier events
May 29, 2025
Non-Final Rejection mailed — §102, §103
Aug 27, 2025
Response Filed
Sep 15, 2025
Final Rejection mailed — §102, §103
Nov 06, 2025
Interview Requested
Nov 14, 2025
Response after Non-Final Action
Feb 12, 2026
Request for Continued Examination
Mar 09, 2026
Response after Non-Final Action
Apr 23, 2026
Non-Final Rejection mailed — §102, §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

3-4
Expected OA Rounds
66%
Grant Probability
98%
With Interview (+31.4%)
3y 5m (~1y 3m remaining)
Median Time to Grant
High
PTA Risk
Based on 74 resolved cases by this examiner. Grant probability derived from career allowance rate.

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